AU5171800A - Massively parallel interface for electronic circuit - Google Patents

Massively parallel interface for electronic circuit

Info

Publication number
AU5171800A
AU5171800A AU51718/00A AU5171800A AU5171800A AU 5171800 A AU5171800 A AU 5171800A AU 51718/00 A AU51718/00 A AU 51718/00A AU 5171800 A AU5171800 A AU 5171800A AU 5171800 A AU5171800 A AU 5171800A
Authority
AU
Australia
Prior art keywords
electronic circuit
parallel interface
massively parallel
massively
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU51718/00A
Inventor
Fu Chiung Chong
Sammy Mok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NanoNexus Inc
Original Assignee
NanoNexus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NanoNexus Inc filed Critical NanoNexus Inc
Publication of AU5171800A publication Critical patent/AU5171800A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AU51718/00A 1999-05-27 2000-05-26 Massively parallel interface for electronic circuit Abandoned AU5171800A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13663799P 1999-05-27 1999-05-27
US60136637 1999-05-27
PCT/US2000/014768 WO2000073905A2 (en) 1999-05-27 2000-05-26 Test interface for electronic circuits

Publications (1)

Publication Number Publication Date
AU5171800A true AU5171800A (en) 2000-12-18

Family

ID=22473706

Family Applications (1)

Application Number Title Priority Date Filing Date
AU51718/00A Abandoned AU5171800A (en) 1999-05-27 2000-05-26 Massively parallel interface for electronic circuit

Country Status (5)

Country Link
EP (1) EP1183604A2 (en)
JP (1) JP2003501819A (en)
KR (1) KR20020028159A (en)
AU (1) AU5171800A (en)
WO (1) WO2000073905A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6358103B1 (en) * 1999-08-02 2002-03-19 Swenco Products, Inc. No-crimp electrical connector side-by-side type
KR20020026585A (en) * 2000-06-20 2002-04-10 나노넥서스, 인코포레이티드 Systems for testing and packaging integraged circuits
US6621280B1 (en) * 2000-06-27 2003-09-16 Agere Systems Inc. Method of testing an integrated circuit
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US7102367B2 (en) 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6835589B2 (en) * 2002-11-14 2004-12-28 International Business Machines Corporation Three-dimensional integrated CMOS-MEMS device and process for making the same
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP4727948B2 (en) 2004-05-24 2011-07-20 東京エレクトロン株式会社 Multilayer substrate used for probe card
US7375542B2 (en) 2004-06-30 2008-05-20 Teradyne, Inc. Automated test equipment with DIB mounted three dimensional tester electronics bricks
KR20070058522A (en) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 Double sided probing structures
KR100689023B1 (en) * 2005-06-29 2007-03-02 주식회사 크라또 Probe unit and method for fabricating thereof
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
DE102006059429A1 (en) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Module for a test device for testing printed circuit boards
JPWO2008126173A1 (en) * 2007-03-13 2010-07-15 株式会社アドバンテスト TCP handling equipment
JP5258395B2 (en) * 2008-06-03 2013-08-07 株式会社日本マイクロニクス Probing device
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
JP6563317B2 (en) * 2015-11-25 2019-08-21 新光電気工業株式会社 Probe guide plate, manufacturing method thereof, and probe apparatus
US10514391B2 (en) * 2016-08-22 2019-12-24 Kla-Tencor Corporation Resistivity probe having movable needle bodies
CN107237859A (en) * 2017-07-24 2017-10-10 江苏方正环测设备有限公司 A kind of bump testing machine damping
KR102133675B1 (en) * 2019-07-03 2020-07-13 주식회사 새한마이크로텍 Test socket
KR102164378B1 (en) * 2019-07-17 2020-10-12 윌테크놀러지(주) Probe card having board type space transformer
JP2021076486A (en) * 2019-11-11 2021-05-20 株式会社日本マイクロニクス Electrical connection device
KR102501995B1 (en) 2019-12-18 2023-02-20 주식회사 아도반테스토 Automated test equipment for testing one or more DUTs and methods of operating the automated test equipment
JP7217293B2 (en) * 2019-12-18 2023-02-02 株式会社アドバンテスト Automatic test equipment for testing one or more devices under test, and method for operating the automatic test equipment
KR102075484B1 (en) * 2019-12-30 2020-02-10 윤찬 Socket for testing semiconductor
KR102554635B1 (en) * 2021-04-12 2023-07-13 (주)이즈미디어 Socket opening device for camera module inspection
CN115236360B (en) * 2022-09-21 2022-11-22 百信信息技术有限公司 Improved multipurpose test special vehicle

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187144U (en) * 1983-05-31 1984-12-12 株式会社東芝 Test equipment for semiconductor devices
DE3630548A1 (en) * 1986-09-08 1988-03-10 Mania Gmbh DEVICE FOR ELECTRONICALLY CHECKING CIRCUITS WITH CONTACT POINTS IN 1/20 INCH GRID
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
DE3838413A1 (en) * 1988-11-12 1990-05-17 Mania Gmbh ADAPTER FOR ELECTRONIC TEST DEVICES FOR PCBS AND THE LIKE
US5144228A (en) * 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
JPH06151532A (en) * 1992-11-13 1994-05-31 Tokyo Electron Yamanashi Kk Prober
US5395253A (en) * 1993-04-29 1995-03-07 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
JP2995134B2 (en) * 1993-09-24 1999-12-27 東京エレクトロン株式会社 Probe device
KR100324059B1 (en) * 1994-11-15 2002-04-17 이고르 와이. 칸드로스 Interconnection Elements for Microelectronic Components
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits

Also Published As

Publication number Publication date
JP2003501819A (en) 2003-01-14
EP1183604A2 (en) 2002-03-06
KR20020028159A (en) 2002-04-16
WO2000073905A3 (en) 2001-09-07
WO2000073905A2 (en) 2000-12-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase