AU2693500A - Electronic device - Google Patents

Electronic device

Info

Publication number
AU2693500A
AU2693500A AU26935/00A AU2693500A AU2693500A AU 2693500 A AU2693500 A AU 2693500A AU 26935/00 A AU26935/00 A AU 26935/00A AU 2693500 A AU2693500 A AU 2693500A AU 2693500 A AU2693500 A AU 2693500A
Authority
AU
Australia
Prior art keywords
electronic device
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU26935/00A
Inventor
Tomoaki Aoki
Toshiyuki Fujita
Yoshiki Inoue
Shigeki Katogi
Hiromasa Kawai
Takuya Sugishita
Masahiro Suzuki
Hitoshi Yamazaki
Katsuhiko Yasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2693500A publication Critical patent/AU2693500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU26935/00A 1999-02-26 2000-02-25 Electronic device Abandoned AU2693500A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11/51667 1999-02-26
JP05166799A JP3807139B2 (en) 1999-02-26 1999-02-26 Manufacturing method of electrical and electronic parts
PCT/JP2000/001112 WO2000051178A1 (en) 1999-02-26 2000-02-25 Electronic device

Publications (1)

Publication Number Publication Date
AU2693500A true AU2693500A (en) 2000-09-14

Family

ID=12893246

Family Applications (1)

Application Number Title Priority Date Filing Date
AU26935/00A Abandoned AU2693500A (en) 1999-02-26 2000-02-25 Electronic device

Country Status (5)

Country Link
JP (1) JP3807139B2 (en)
KR (1) KR100447711B1 (en)
AU (1) AU2693500A (en)
TW (1) TW507218B (en)
WO (1) WO2000051178A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003003046A (en) * 2001-06-25 2003-01-08 Hitachi Chem Co Ltd Methathesis-polymerizable resin material and composition of the same
DE102004012482B4 (en) * 2004-03-15 2005-12-29 Era Ag Transformation device for generating an ignition voltage for internal combustion engines
JP4577759B2 (en) * 2004-07-09 2010-11-10 Necトーキン株式会社 Magnetic core and wire ring parts using the same
TWI411663B (en) * 2005-09-12 2013-10-11 Fujifilm Electronic Materials Additives to prevent degradation of cyclic alkene derivatives
JP2009507834A (en) * 2005-09-12 2009-02-26 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド Additives that prevent degradation of cyclic alkene derivatives
JP2009260122A (en) * 2008-04-18 2009-11-05 Kyocera Chemical Corp High voltage coil and its manufacturing method
DE102009036968A1 (en) 2009-08-12 2011-02-17 Tesa Se Method for encapsulating an electronic device
KR20130118332A (en) * 2011-03-28 2013-10-29 제온 코포레이션 Thermosetting crosslinked cycloolefin resin composition, thermosetting crosslinked cycloolefin resin film, process for producing thermosetting crosslinked cycloolefin resin composition, and process for producing thermosetting crosslinked cycloolefin resin film
JP7224798B2 (en) * 2018-07-06 2023-02-20 東芝インフラシステムズ株式会社 Method for manufacturing mold-type electrical equipment
WO2021010217A1 (en) * 2019-07-16 2021-01-21 Agc株式会社 Transparent display device, laminated glass, and method for manufacturing transparent display device
EP3796342B1 (en) 2019-09-18 2023-11-01 Premo, S.A. A power transformer assembly and a thermal conductive compound for sealing a power transformer assembly
KR102079167B1 (en) * 2019-12-24 2020-02-19 제룡전기 주식회사 Mold type shunt reactor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105610A (en) * 1985-11-01 1987-05-16 Nippon Zeon Co Ltd Resin sealing method for electronic and electric parts
JP2769590B2 (en) * 1992-06-11 1998-06-25 東都化成株式会社 Epoxy resin composition
JPH0697324A (en) * 1992-09-11 1994-04-08 Mitsui Toatsu Chem Inc Resin-sealed semiconductor device
JPH07102148A (en) * 1993-10-06 1995-04-18 Mitsubishi Chem Corp Semiconductor-sealing resin composition

Also Published As

Publication number Publication date
KR100447711B1 (en) 2004-09-08
WO2000051178A1 (en) 2000-08-31
TW507218B (en) 2002-10-21
JP2000252395A (en) 2000-09-14
KR20020035474A (en) 2002-05-11
JP3807139B2 (en) 2006-08-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase