TW507218B - Electronic device - Google Patents

Abstract

The present invention provides an electronic device comprising an encapsulating member having a modulus of bend elasticity of less than 500 MPa at 23 DEG C produced by polymerizing a polymerizable composition having a viscosity of less than 0.3 N.s.m<SP>-2</SP> at 23 DEG C and and an electronic device comprising an encapsulating member having a modulus of bend elasticity of less than 500 MPa at 23 DEG C produced by polymerizing a polymerizable composition containing an olefin compound.

Description

507218 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) Technical Field The present invention relates to silicon wafers, transformers, and coils containing LSI (Large Scale Integrated Circuit) and i C (Integrated Circuit), etc. , Transistor, diode, power switch and other components of the appropriate resin-encapsulated electronic devices. 2. Description of the Related Art With the miniaturization and thinness of electrical appliances and electronic devices, the parts used have been developed to be highly dense and highly integrated. In particular, in semiconductor-related parts of resin-encapsulated semiconductor devices, this progress is very impressive. Among these electrical and electronic parts, generally, they are trusted to improve insulation, moisture resistance, thermal shock resistance, and reflow crack resistance. In nature, the components made of inorganic materials such as gold, silver, copper, inscriptions, sheet copper, diction, sand, fault, 42 alloy, and non-recorded steel are encapsulated with polymer materials. For example, IC components are usually encapsulated with epoxy resin (silicon chip), and ignition coils are encapsulated with epoxy resin and polysiloxane resin. In addition, electrical appliances and electronic parts on which components (IC, bare chips, etc.) are mounted on a supporting substrate composed of ceramics, epoxy resin, etc. can be made of acrylic resin, polysiloxane resin, urethane according to the use environment. Resin or epoxy resin etc. are encapsulated. Examples of the resins used for encapsulation in these electrical and electronic parts include thermosetting resins such as epoxy resins, polysiloxane resins, urethane resins, and polyimide resins, and polyethylene, polyterephthalate The size of ethylene formate and poly paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) -4- nnn —l · Ί— nn-Jmm nn 1_1 · ϋ I an · ϋ ϋ ϋ ϋ 1 · · Ϋ ϋ n 1 n ϋ I (Please read the precautions on the back before filling this page) 507218 A7 B7 V. Description of the invention (2) (Please read the precautions on the back before filling this page) Carbonate, modified polymer Engineering plastics (thermoplastic resins) such as phenoxy, polyphenylene sulfide, etc. Among these packaging resins, epoxy resins are most frequently used because of their best adhesion to inorganic materials. In order to prevent the peeling of the interface between the inorganic component and the polymer, the resin used in the packaging of these electrical and electronic components generally pursues a low linear expansion coefficient, that is, the 'linear expansion coefficient is close to that of silicon wafers, aluminum electrodes, copper wires and other inorganic components. In addition, for example, the Joule heat generated during the operation of semiconductors and the heat generated by the resistance of copper wires are diffused, and the heat generated by electrical and electronic parts is diffused to improve the durable life and reliability of electrical and electronic parts. Generally, the pursuit of heat conduction Rate increases. Therefore, in order to lower the coefficient of linear expansion and increase the thermal conductivity, an inorganic filler material such as silica and aluminum hydroxide is added to the resin composition for encapsulation. -Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs However, the addition of filler materials makes the resin hard and brittle, and easily cracks, which reduces the periodicity of heat resistance of the parts. In general, when an inorganic filler is added, the polymerizable composition (resin raw material before polymerization and hardening) becomes solid at room temperature, or has a high viscosity of several to several tens of N · s · m_2 or more, and lacks fluidity. . Therefore, the conventional polymerizable composition is not suitable for the packaging of high-density integrated circuits, fine circuits, etc., if a filler material is added. For example, Japanese Unexamined Patent Publication No. 10-2019 proposes a low-viscosity epoxy resin prepolymer. This prepolymer achieves, for example, a low viscosity of 2.9 N • s · m — 2. However, at this level of viscosity, high-density integrated circuits and fine circuits cannot be fully encapsulated. In addition, the glass transition temperature of the hardened material (resin) is 110 ° C, and it shows mechanically hard and brittle properties at the actual use temperature. Therefore, in the heat resistance cycle test, the paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 ____B7__ 5. Description of the invention (3) The problem of cracks easily occurs. Therefore, the method of packaging with mechanically tough engineering plastics was also reviewed. For example, in Japanese Unexamined Patent Publication No. 10—2 9 2 1 18, a method is proposed in which polyphenylene sulfide is used and an electronic part such as an IC chip is packaged by extrusion molding at a cylinder temperature of 300 ° C. However, engineering plastics are thermoplastic resins, and their molding must generally be a high temperature of 300 ° C or more. Moreover, because such high temperature also shows a high melt viscosity of about tens of N · s · m_2, it is used It is difficult for such plastics to fully impregnate fine circuits. On the other hand, in order to prevent the reliability of electrical and electronic parts from being reduced due to peeling and cracking of the sealing resin, polymers with low elasticity such as polysiloxane resin and urethane resin are sometimes used as the sealing resin. However, prepolymers of polysiloxane resins and urethane resins are generally high in viscosity and poor in impregnation. In addition, these polymers have a higher dielectric constant than olefin-based resins, and have poor electrical characteristics. For this reason, the technique described in JP-A-H 8- 3 1 6 3 7 3 is to optimize the resin filling method during molding, and JP-A-H 10- 2 3 3 4 7 2 proposes to optimize the part structure. Methods, but these improvements alone cannot fully impregnate the fine circuits. In addition, Japanese Patent Application Laid-Open No. 5-2 8 7 0 7 7 proposes a polysiloxane resin that reduces the viscosity of a prepolymer, but its viscosity is also above 0 · 3 N · s · m-2 and it has not yet reached Fully impregnated with micro circuits. On the other hand, it is known that a cycloolefin resin obtained by metathesis polymerization of an original norbornene-based compound has excellent mechanical properties, electrical properties, and water resistance, and is proposed in Japanese Patent Publication No. 5-4 108 Reactive injection molding of the original norbornene-based compound, and the paper size of the electrical and electronic components to be encapsulated is in accordance with the Chinese National Standard (CNS) A4 (210 X 2977 mm) ^ ---- J --- J--I- ---- I--Order --------- (Please read the notes on the back before filling out this page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 ____ B7 _ ^ __ V. Description of the invention ( 4) Manufacturing method. Also, in Japanese Patent Application Laid-Open No. 9-1 8 3 8 3 3, a suitable original norbornene-based compound for encapsulating electrical and electronic parts through a new metathesis polymerization catalyst is proposed. In addition, Japanese Patent Application Laid-Open No. 10—1 8 2 9 2 2 shows that a metathesis polymerizable cycloolefin-based compound (prepolymer) has a low viscosity even when a filling material is added, and is suitable for electrical and electronic parts. Encapsulation. However, all of them are hardened products of prepolymers in which an original norbornene-based compound such as dicyclopentadiene and an inorganic filler are combined as a sealing material. The hardened products obtained have a high glass transition temperature and, on the other hand, It lacks adhesion to inorganic parts and has a high elastic modulus, so it has the problem of easy peeling at the interface with inorganic parts. In addition, the metathesis polymerization catalyst system described in the above-mentioned Japanese Patent Publication No. 5-4 1 0 8 8 is an organic compound of tungsten or molybdenum as shown in Japanese Patent Publication No. 5 9-5 1 9 11 The catalysts of the ammonium salt, the halogenated alkoxyalkylaluminum or the halogenated aryloxyaluminum combined with the activator are the same. Because they are easily deactivated with oxygen, they also have to be molded in an inert gas atmosphere. problem. As described above, hard resins such as epoxy resins having a high elastic modulus have a problem that they are prone to peeling and cracking, and have problems in reliability and reliability of electrical and electronic parts. In addition, soft resins with low elasticity, such as polysiloxane resins and urethanes, have poor impregnation properties due to the high viscosity of the prepolymer, and they have a problem that high-density integrated circuits and fine circuits cannot be fully encapsulated. In addition, a polymer obtained by using dicyclopentadiene as a cycloolefin-based resin and subjecting it to metathesis polymerization also has a problem of peeling due to its high elastic modulus. In addition, when using cycloolefin resins for metathesis polymer resin for encapsulation, the paper size must be in accordance with China National Standard (CNS) A4 (210 X 297 mm) _---- ί --- 1 --- --------- Order --------- line (please read the precautions on the back before filling this page) 507218 B7__ V. Description of the invention (5) Completely in the inert gas atmosphere Problems with molding. Disclosure of the Invention In order to solve the above-mentioned problems, the present invention provides an electronic device having a packaged part obtained by polymerizing a polymerizable composition, and the packaged part has a bending elasticity at 2 3 ° C of less than 500 MPa. However, the flexural modulus is specified by J I S — K-7 2 0 3. If such package parts are used, good precision moldability and reflow resistance can be achieved. That is, the polymerizable composition is a polymerizable liquid substance having a viscosity of less than 0.3 N · s · m — 2 at 2 3 ° C, or an olefin compound. Alas, the electronic device of the present invention may be, for example, a part of a resin-encapsulated semiconductor device and other products of an ignition coil, and may also be any electrical part or electronic part. Suitable electronic devices of the present invention include, for example, a central core composed of a magnetic body, a primary coil and a secondary coil wound around the periphery of the central core, and a magnetic body disposed outside the secondary coil. Ignition coil for external core. The package parts of the present invention are expected to be from the following (1) to (4) .------- / ------------ -Order --------- (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 Less% Volume 尙 2 ° c degrees at 3 temperature 2 Chemical system is based on the expansion coefficient of glass Suction

The bottom 1 is P, o OC, and the top is m PP. Ο is less than full 4 2 Water immersion is the middle and bottom. Β is dissolved. It contains materials that are not grouped together. (3 original 2 pieces at zero rate. Electric seals are expected} The paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -8-507218 A7 ----- —_B7_ V. Description of the invention (6) Materials, and may also contain additives (ie, modifiers, polymerization rate modifiers, foaming agents, defoamers, colorants, stabilizers, IJ, adhesives, flame retardants, coupling agents, and / Or organic peroxide) ° The additive may be one kind, or two or more kinds may be combined as necessary. Furthermore, a filling material and an additive may be used in combination. It is desirable that the polymerizable composition contains one or more metathesis polymerizable rings. The olefin compound 'is more preferably a compound containing two or more kinds selected from metathesis polymerizable cycloolefin compounds having a molecular weight of less than 300. When the polymerizable composition contains a metathesis polymerizable cycloolefin compound, it is desirable to further contain the compound. Metathesis polymerization catalyst The metathesis polymerization catalyst may be used include compounds of the following general formula (1) to (3) of FIG.

1 2 Q Q / \ C 1 = 2 L I Μ I L 1 \ / 2 X X Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

C II C II 2 — MIL 1 \ / 2 XX

1X L

1 2 Q Q ---- Γ ---------------- Order --------- Line (Please read the precautions on the back before filling this page)

L IΜI L 1 \ / 2 X X

3 R

C

R

C II C Η This paper size is in accordance with China National Standard (CNS) A4 (210 x 297 mm) 9- Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 B7 Γ 5. Description of the invention (7) In the formulae (1) to (3), μ represents ruthenium or iron, and X 1 and X 2 each independently represent an anionic ligand, L 1 and L 2 each independently represent a neutral ligand, and Q 1 and Q 2 Each independently represents hydrogen, an alkyl group, an alkyl group having a substituent, an alkenyl group, an alkenyl group having a substituent, an aromatic group, or an aromatic group having a substituent. R 1 and R 2 each independently represent an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, an alkynyl group and aryl group having 2 to 18 carbon atoms, and 1 to 18 carbon atoms Carboxylic acid ester groups, alkoxy groups with 1 to 18 carbon atoms, alkenyloxy groups with 2 to 18 carbon atoms, alkynyloxy groups with 2 to 18 carbon atoms, and 2 to 18 carbon atoms An aryloxy group, a carbon oxo group having 2 to 18 carbons, a sulfur group having 1 to 18 carbons, an alkanesulfonyl group having 1 to 8 carbons, or an alkane having 1 to 18 carbons Sulfinylene, R3 represents hydrogen, aryl, or an alkyl group having 1 to 18 carbon atoms. If these metathesis polymerization catalysts are used in the reaction for obtaining an olefin-based resin, they are hardly affected by oxygen and moisture in the air, so that molding variations can be reduced. Therefore, these catalysts are suitable for the present invention. In the electronic device of the present invention, it can be used as a package part for molding in an oxygen-containing atmosphere. Brief Description of the Drawings Fig. 1 is a sectional view showing an example of the structure of an ignition coil. Component symbol 11 Center core 12 Outer core 13 Primary coil This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -------------- 袈 ----- --- Order --------- Line '(Please read the precautions on the back before filling out this page) 507218 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (8 14 Primary Coil 15 Secondary spools 16 Secondary coils 17 Terminals 18 Ignition timing control circuit parts 19 Ceramic substrate with IC 20 — Stage terminals 2 1 Cover killer 22 Epoxy resin 23 Encapsulated parts to implement the best form of the invention The device is an encapsulating part of a polymer with a polymerizable composition. The encapsulating part has a flexural modulus of 500 ° MPa or less at 23 ° C as specified in JIS-K-7202. In this specification, the resin composition constituting the package part may be referred to as a low-elasticity resin. The polymerizable composition is expected to be a liquid polymerizable liquid at 2 3 ° C. The polymerizable liquid The viscosity is preferably 0.005 N · s · m — 2 to 0.2N · s · m — 2. In the case of electronic devices such as flyback transformers and ignition coils, if the viscosity of the polymerizable liquid substance exceeds 0 β 3 N · s · m — 2, the impregnation of the inside of the winding coil is deteriorated and the battery is not charged. It also reduces the insulation properties. Also, similarly, the polymerizable liquid fine paper whose viscosity exceeds 0.3 N · s · m — 2 applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -Π (Please read the notes on the back before filling in this page) --------- Order --------- Line 1 507218 A7 __ B7 V. Description of the invention (9) (Please first Read the notes on the back and fill in this page again) When using the semiconductor device packaging material in the semiconductor device represented by DIP (Dual Inline Package, Dual lnllne Paekage), make the circuit chip and reading frame or substrate (poly配线 imine film and ceramic, etc.) to cut the connection wiring. The bending elastic modulus of the packaging resin used in the present invention is preferably 30 OMP a or less, and more preferably 100 OMP a or less. 5 Ο Ο Μ P a is easy to peel and crack. I Package parts There are no particular restrictions on the types of packaging resins used in Mingming's packaging parts, provided they have the above characteristics. For example, epoxy resin, urethane resin, polysiloxane resin, acrylic resin, and Acrylic resin, polyester resin, phenol resin, olefin resin (that is, a resin obtained by polymerizing an olefin compound), and the like. Among them, acrylic resins, methacrylic resins, polyester resins, and olefin-based resins are preferred, and olefin-based resins are particularly preferred from the viewpoint of excellent electrical properties. The glass transition temperature of the packaging parts used in the electronic device of the present invention printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is preferably below 80 t, more preferably below 50 ° C, and even below 25 ° C. The following are the characteristics. If the glass transition temperature exceeds 80 ° C, cracks tend to occur inside the packaging material. For the same reason, the linear expansion coefficient of the packaged part is preferably 100 P P m or more. Furthermore, it is preferable that the water absorption of the packaged parts is less than 0. 1% by weight after immersion at 23 ° C for 24 hours. When the water absorption is not less than 0.1% by weight, the insulating properties and the reflow resistance of the solder tend to decrease. -12- This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm) 507218 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (10) The higher the density and higher the integration, the better the dielectric constant of the package parts to be free of electromagnetic wave interference is 2.0 · 3 ~ 0 'and more preferably 2.0 · 2.9. 1 I Composition of polymerizable composition for encapsulation Hereinafter, the composition of the polymerizable composition for encapsulation of raw materials for encapsulating parts used in the electronic device of the present invention will be specifically described. That is, the polymerizable composition for encapsulation is a polymerizable liquid having a viscosity of less than 0 · 3 Ν · s · m — 2 at 2 ° C. It is also desirable to contain an olefin compound as a resin raw material (monomer or low Polymer). A. Resin monomers and oligomers There are no particular restrictions on the types of resins used for encapsulation in the package parts of the present invention, but olefin resins are particularly preferred. Examples of suitable olefin-based resin raw materials in the present invention include commonly known resins such as polyethylene, polypropylene, and polybutadiene. Cycloolefin pharmaceutical compounds are preferred, and particularly preferred are metathesis-polymerizable cycloolefin compounds. Metathesis-polymerizable depleted cyclic olefin compounds can be roughly classified into pro-norbornene-based cyclic olefin compounds and non-ortho-bornene-based cyclic olefin compounds. The orbornene-based cyclic olefin compound may be substituted or unsubstituted, monoorbornene, methylorbornene, dimethylorbornene, ethylorbornene, ethyleneorbornene, butylorbornene Bicycloprobornene, dicyclopentadiene (dimer of cyclopentadiene), dihydrodicyclopentadiene This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm) S ---- ί I ---- -------- Order ---------- Line (Please read the precautions on the back before filling this page) 507218 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by employees' consumer cooperatives A7 B7 V. Description of the invention (11), tricycloorbornene, methyldicyclopentadiene, dimethyldicyclopentadiene, etc., tetracyclododecene, methyltetracycline Tetracyclylnorbornene such as dodecene, dimethylcyclotetradecane (dodecene), tricyclopentadiene (terpolymer of cyclopentadiene), tetracyclopentadiene (cyclopentadiene Tetramer) and other five-ring orthonorbornene. Examples of the non-orbornene-based cyclic olefin compound include cyclobutene, cyclopentene, cyclooctene, cyclododecene, tetrahydroindene, and methyltetrahydroindene. In addition, compounds having two or more probornyl groups, such as tetracyclododecadiene, symmetric tricyclopentadiene, and the like can also be used as the polyfunctional crosslinking agent. Furthermore, orbornenyl derivatives such as Hymic acid, Hymic acid anhydride, or norbornadiene can also be used. These metathesis polymerizable cycloolefin compounds may be used singly or in combination of two or more kinds. Among them, in terms of easiness of obtaining, economy, etc., dicyclopentadiene, methyltetracyclododecene, ethylene-orbornene, tricyclopentadiene, cyclooctene, and cyclopentadiene are preferred. Octadiene, cyclododecatriene, etc. Alas, dicyclopentadiene can be heat treated beforehand to make a part of dicyclopentadiene into cyclopentadiene oligomers such as tricyclopentadiene and tetracyclopentadiene, and the vinyl of impure substances Orbornene and methylvinylorbornene areomerized into tetrahydroindane and methyltetrahydroindene. This prior heat treatment is usually performed at 120 to 250 ° C for 0 to 5 to 10 hours. Alas, the commercially available olefin resin raw materials are generally cyclic olefin compounds containing impurities and having various purity. For example, 'The content of this paper in dicyclopentadiene is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -14- ·, ---- r ---- L ------ ------ Order--------- line (please read the note on the back? Matters before filling out this page) 507218 A7 B7 V. Description of the invention (12) Vinyl original norbornene, tetrahydroindene , Methylvinyl original norbornene, methyltetrahydroindene, methyldicyclopentadiene, dimethyldicyclopentadiene, tricyclopentadiene, etc., and contains unreacted in cyclooctadiene Impurities such as butadiene and cyclooctane. However, these commercially available products can be used without special purification.尙, when used in the electronic device of the present invention, it is generally preferred to use more than 90% of the resin raw material (monomer or oligomer), and it is more preferable to use more than 95%, especially 98% purity. These cyclic olefin compounds are desirably two or more kinds having a molecular weight of less than 300. If so, the elastic modulus can be controlled. For example, the resin obtained by polymerizing a bicyclic or polycyclic body such as dicyclopentadiene and tricyclopentadiene is hard, but through the use of cyclopentene, cyclooctene, cyclooctadiene, cyclododecatriene Monocyclic bodies such as ene, cyclooctatetraene, etc., can reduce the elastic modulus. The monocyclic cyclic olefin compound used to reduce the elastic modulus is preferably blended in a range of 40 mol% or more and less than 99 mol% with respect to the total mole number of the polycyclic and monocyclic compound. If the monocyclic body is less than 40 mole%, the elasticity rate is 50 OMP a or more. In addition, when 99% by mole or more is used, the crosslinking density is lowered, and the toughness of the resin is lowered. B. Polymerization catalysts for multiple sales It is desirable that the resin suitable for encapsulation in the present invention is cured by metathesis polymerization. As the metathesis polymerization catalyst used in this metathesis polymerization, a known catalyst system using a catalyst type for ring-opening metathesis polymerization of a cycloolefin-based compound can be used, and examples thereof include a two-component catalyst and a one-component catalyst This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) --------- Order -------- -Line 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7-B7 5. Invention Description (13), but there are no special restrictions. However, from the viewpoint of good stability in air, a one-component metal polyacetylene type catalyst is preferred. The addition amount of the metathesis catalyst is usually from 0. 001 to 20% by weight relative to the cycloolefin polymerizable composition, but from the standpoint of economy and hardening speed, it is from 0. 0 1 to A range of 5% by weight is preferred. The two-component metathesis polymerization catalyst is a catalyst system combining a catalyst component and an activator. The two-component metathesis polymerization catalyst used in the present invention includes transition metals such as titanium, star, molybdenum, tungsten, osmium, iridium, ruthenium, and star, and is a compound metal halide, metal polyacetylene, or Ziegler type Coordination catalyst, etc. Specific examples include tungsten compounds such as tungsten hexachloride, tungsten oxytetrachloride, tungsten oxide, tridecyl ammonium tungstate, molybdenum pentachloride, molybdenum oxytrichloride, molybdenum oxide, Molybdenum compounds such as trialkylammonium molybdate, yttrium compounds such as yttrium pentachloride, and [(cyclohexyl) 3P] 2RuC12, [(phenyl) 3P] 3RuC12, (cyclohexyl) 3P (p-monomethyl Ruthenium compounds such as cumene) RuC12, [(phenyl) 3p] 3 (C0) RuH2, and the like. In these two-component metathesis polymerization catalyst systems, a known co-catalyst (activator) may be used if necessary. Specific examples include alkyl aluminum halides, halogenated amine oxygen radicals, halogenated aryloxy amine radicals, organotin compounds, etc. The one-component metathesis polymerization catalyst is different from the two-component type catalyst system. The catalyst activity is easily lost due to the moisture in the air and the adsorbed water on the solid surface, and the cycloolefin-based compound can undergo ring-opening metathesis polymerization by metathesis reaction. This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) (Please read the precautions on the back before filling out this page) ----- Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economy 16 507218 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (14) Such a one-component metathesis polymerization catalyst. Specifically, ruthenium or a starved metal polyacetylene structure is used as the central skeleton, and The structure that makes the three-dimensional hindering ligands coordinate to the central metal is a metal polyacetylene-type coordination catalyst that stabilizes water. Preferred examples of such ruthenium or hungry metal polyacetylene type coordination catalysts include compounds represented by any one of the following general formulae (1) to (3). Among them, the compound represented by the general formula (3) is particularly preferable from the aspects of high catalyst activity, high synthetic yield, and economical efficiency.

X 2 L 2 C = C H R2 Here, M is ruthenium or hungry. X 1 and X 2 each independently represent an anionic ligand. The so-called anionic ligand refers to an atom or a group of atoms having a negative charge when the coordination to the central metal is removed. This anionic ligand is, for example, hydrogen or halogen. The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) ------- -I Order ------- • Line 1 507218 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (15), CF 3 C 0 2 ^ C Η 3 C 0 2 ^ CFH2C〇2 , (C Η 3) 3 C 0. (CF3) 2 (CH3) C〇, (CF 3) (CH3) 2C〇, alkyl group having 1 to 5 carbons, alkoxy group having 1 to 5 carbons , Phenyl, phenoxy, tosylsulfonyl, mesylsulfonyl, trifluoromethanesulfonate and the like. It is particularly preferred that both X1 and X2 are halogens, especially chlorine. L 1 and L 2 each independently represent a neutral ligand. Astatine, the so-called neutral ligand refers to the atom or atomic group having a neutral charge when the coordination with the central metal is removed. Examples of such groups include PR 4 R 5 R 6 (here, R 4 is a secondary alkyl group or a cycloalkyl group, R 5 and R 6 are aryl groups, and the primary alkyl group and secondary alkyl group having 1 to 10 carbon atoms are used. And a phosphine-based electron donor represented by a group independently selected from a cycloalkyl group and a cycloalkyl group). L1 and L2 are both P (cyclohexyl) 3,? (Cyclopentyl) 3 or fluorene (isopropyl) 3 is preferred 'and may be different from each other. Furthermore, examples of the ligand include pyridine, p-fluoropyridine, and imidazolyl. The imidazolyl compound is preferably a heterocyclic compound represented by the following general formula (4) or (5). Among them, a compound represented by the formula (5) is particularly preferred as a ligand. f = \ · Ν · • N_Re 4) ---- rf--r ------------ Order ------ 丨! Line-^ · (Please read the precautions on the back before filling in this page) ΓΛ 8 • N, / N—R8, c '(6) Here, R7 and R8 are independently selected from the carbon number of 1 ~ 2 0 Alkyl paper size applies + National National Standard (CNS) A4 specification (210 X 297 mm) 507218 A7 B7 5. Description of the invention (16), alkenyl with 2 to 20 carbons, 2 to 20 with carbon Alkynyl, cycloalkyl, aryl.尙, R7 and R8 are alkyl groups having 1 to 10 carbon atoms, and alkoxy groups having 1 to 10 carbon atoms can also be substituted by aryl groups, and these groups are halogens and 1 to 5 carbon atoms. An alkyl group, an alkoxy group having 1 to 5 carbon atoms, may also be substituted by a phenyl group. From the viewpoint of thermal stability, it is preferable that at least one of r 7 and R 8 is a base represented by the following general formula (6).

(6) Printed in this formula (6) by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics, R9 and R1Q are hydrogen, alkyl groups having 1 to 3 carbon atoms or alkoxy groups having 1 to 3 carbon atoms, R11 It is hydrogen, an alkyl group, an aryl group, a hydroxyl group, a thiol group, a thioether group, a ketone group, an aldehyde group, an ester group, an ether group, an amine group, an imine group, a sulfonium group, a nitrate Group, carboxylic acid group, dithio group, carbonate group isocyanate group, carbodiimide group, alkoxy group, urethane group, halogen and the like. Specific imidazolyl compounds that can be used as the ligand include polyacetylenes represented by the following structural formula (7) or (8). Among them, from the viewpoint of polymerization activity, an imidazolyl compound having a structural formula (7) is particularly preferred is CH3… (7)

CH3 (8 ---- Γ --- Γ ---- clothing -------- order --------- line (please read the precautions on the back before filling this page) this Paper size applies Chinese National Standard (CNS) A4 specification (210 x 297 mm) 507218 A7 ____B7___ V. Description of the invention (17) Q1 and Q 2 are independently selected from hydrogen, courtyard, orthodontic or fragrant group, The alkyl group, alkenyl group or aromatic group may have a substituent. R1 and R2 each independently represent an alkyl group selected from 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and 2 to 18 carbon atoms. Alkynyl and aryl groups, carboxylic acid ester groups with 1 to 18 carbons, alkoxy groups with 1 to 18 carbons, alkenyl groups with 2 to 18 carbons, and 2 to 18 carbons Alkynyloxy groups, aryloxy groups with 2 to 18 carbons, alkoxycarbonyl groups with 2 to 18 carbons, alkylthio groups with 1 to 18 carbons, and 1 to 18 carbons Alkylsulfenyl or alkanesulfinyl having 1 to 18 carbons, and R3 is hydrogen, aryl, or alkyl having 1 to 18 carbons. Suitable specific examples in the present invention include the following structures (9) ~ (11) ° (Please read the precautions on the back before filling in this page)

CL Η

: CC ch3 ch3 (9) Η Η〇): Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, CH3

‘The paper size is in accordance with China National Standard (CNS) A4 (210 x 297 mm) _ 507218 Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economy A7 ______ B7 V. Description of the invention (18)

In addition, the compound represented by the following general formula (1 2) is also suitable for the present invention: 0 c 1 P (R 1 M 3

\ I M = C = CHC (CH3) 3… (12) / I. C 1 P (R 1 1) 3 尙, in the general formula (1 2), R11 is phenyl, isopropyl or cyclohexyl. Such a metal polyacetylene compound can be obtained according to a known synthesis method. Examples include methods using propargyl chloride as shown in Oirganometallics Vol. 16, No. 18, p. 3867 (1979). A synthesis example of the compound represented by the aforementioned structural formula (9) is shown below (Reference: Organometallics, Vol. 16, No. 18, p. 3867 (1997)).尙, cy represents cyclohexyl. &lt; Synthesis example &gt; -nnn IL ΟΊ I innnnnn I nnn 1: 0 strokes »ni XI ni I (Please read the note on the back? Matters before filling out this page) This paper size applies Chinese National Standard (CNS) A4 specifications ( 210 X 297 mm) -21-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 B7 V. Description of the invention (19) Put a 500-mL Fisher-Porter bottle into cyclooctadiene dichloride Ruthenium (21 millimoles), tricyclohexylphosphine (42 millimoles) 'sodium hydroxide (7.2 g), and the second butanol deoxygenated 2 50 ha: liter, and at 2 0 OKP a Heat in a hydrogen atmosphere at 90 ° C. Repeat the pressure several times until the end of hydrogen absorption, and continue to stir overnight. It was cooled to room temperature under hydrogen pressure as usual, and a pale yellow precipitate was obtained. 30 ml of water was added and the precipitate was filtered and dried in a stream of hydrogen to obtain Ru (H) 2 (H2) 2 (P (cy) 3) 2 (yield about 80%). Next, this Ru (H) 2 (H2) 2 (P (cy) 3) 2 (1.5 mmol) was dissolved in 30 ml of dichloroethane and cooled to -30 ° C. Add 3-chloro-1,3-methyl-1,1-butyne. The solution immediately turned red-purple. After 15 minutes of reaction, the cooling bath was removed. If degassed methanol (20 ml) was added, purple crystals precipitated. Wash with methanol and dry to obtain Ru polyacetylene catalyst (C 1) 2 (P (cy) 3) 2Ru = CH — CH = C (CH3) 2 (yield 95%). C. Additives In the polymerizable composition for encapsulation (preferably polymerizable liquid), taking into account the physical properties and appearance of the hardened material, the moldability of the composition, etc., optionally adding fillers, modifiers, polymerization, etc. as needed Speed regulator, foaming agent, defoaming agent, coloring agent, stabilizer, adhesion promoter, flame retardant, coupling agent, organic peroxide, etc. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -------- ^ I ----------- Order --------- (Please read the precautions on the back before filling this page) -22 507218 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (20) (1) Filling materials The filling materials used in the present invention may be Examples include inorganic filling materials such as fused silica, crystalline silica, silica sand, calcium carbonate, aluminum hydroxide, magnesia, clay, and inorganic ion exchangers, and wood flour, polyester, polysiloxane, and polymer. Bead-shaped organic filling materials such as styrene acrylonitrile-butadiene-styrene (AB S). Among them, silica and aluminum hydroxide are preferred in terms of electrical characteristics and thermal conductivity. Examples of commercially available filling materials suitable for use in the present invention include CRT-AA, 〇11 丁 一 0, 11〇-8 (above, trade name of Longsen Co., Ltd.), and COX-31 (product of Micro Co., Ltd.) Name), C-303H, C-315H, C-308 (above, the trade name of Sumitomo Chemical Industry Co., Ltd.), SL-700 (the trade name of Takehara Chemical Industry Co., Ltd.), etc. The compounding amount of these inorganic filling materials is 0-95% by weight in the resin, preferably 10-95% by weight, and more preferably 30-95% by weight. A blending amount of 30 to 75% by weight is particularly preferred. If the blending amount exceeds 95% by weight, the dielectric properties of the packaged parts exceed 3.0, so the electrical characteristics are lowered. The particle size, shape, and grade of the filling material can be appropriately determined according to the purpose of manufacturing the electronic device, and the shape of the inorganic filling material is preferably spherical. The average particle diameter is preferably between 0.1 and 100 #m, and the average particle diameter is particularly preferable between 1 and 50 μm. The combination of those with different average particle diameters can further improve the fine filling and fluidity. In addition, suitable filling materials in the present invention may also include ground glass and cut paper. The size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) -nnn n-4 * n * 1 nnnnn · I nn I nt— i 一-口, mildew »MM W MM MV (Please read the precautions on the back before filling this page) -23- 507218 Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ——______ Β7__ 5. Description of the invention ( 21) Inorganic and organic fibrous filling materials such as cut fibers, microfibers, microspheres, flaky glass powder, carbon fibers, and sulphamine fibers. These fibrous filling materials can also be used in the above filling materials. The aspect ratio and shape can be appropriately selected depending on the purpose. The amount of these fibrous filling materials is usually 0 to 20 parts by weight, and preferably 0 to 10 parts by weight, with respect to 100 parts by weight of the resin for encapsulation. (2) Modifiers The modifiers used in the present invention include, for example, elastomers, natural rubber, butadiene rubber, and copolymers (styrene-butadiene copolymer (SBR), styrene-butadiene). Monostyrene block copolymer (SBS), styrene-maleic acid copolymer, ethylene-vinyl acetate copolymer, etc.) and thermoplastic resins (polymethyl methacrylate, polyvinyl acetate, polystyrene Wait). These copolymers and thermoplastic resins may also be esterified, and polar groups may be grafted. In addition, epoxy resin, urethane resin, polyester resin, polysiloxane resin, phenol resin, polyimide resin, polyimide resin, polyimide resin and derivatives thereof are improved. Its physical properties are also available. Furthermore, for example, a compound obtained by reacting an epoxy compound with orthobornene monocarboxylic acid, a compound obtained by reacting an isocyanate compound with orthobornene monool, Hymic acid modified polyester, petroleum resin, etc., can be used as modifications in the present invention. Quality agent. Alas, petroleum resins can be produced by making known C 5 or C 9 fractions refined from crude ethylene in raw materials. For example, Cuinton (Japanese Zeon) This paper applies Chinese National Standard (CNS) A4 standard mo X 297. Li) (Please read the precautions on the back before filling out this page), Fees ------ Order --------- · -24-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 507218 A7 B7 V. Description of the invention (22) (trade name, manufactured by Co., Ltd.) and thermoplastic polyorbornene resin Norsolex (trade name, manufactured by Zeon (Japan)). The petroleum resin is preferably a number-average molecular weight of 1,000 or more, and more preferably a resin skeleton having functional groups such as a hydroxyl group and an ester group. Although the blending amount of these modifiers may vary depending on the physical properties of the target resin, it is generally 0.2 to 5.0 parts by weight based on 100 parts by weight of the polymerizable composition. It is preferably in a range of 0.5 to 40 parts by weight. If it is less than 0.2 parts by weight, it is difficult to express the effect of the modifier, and if it is 50 parts by weight or more, the polymerizability tends to decrease. (3) Polymerization rate adjuster When the resin used for encapsulation is a radical polymerizable resin such as acrylic resin or polyester resin, a chain shifting agent such as methylstyrene dimer can be used as the polymerization rate adjuster. When the encapsulating resin is an olefin-based resin, phosphates such as triisopropylphosphine, triphenylphosphine, and tricyclohexylphosphine can be used as a polymerization rate regulator. These polymerization rate regulators can be used in an amount of 0. 0 to 5 to 20 parts by weight based on 100 parts by weight of the polymerizable composition. The purpose of the amount of these polymerization rate regulators is to control the time used for molding. The time used can also be reduced in a short time and increased in a long time. (4) Defoaming agent, foaming agent For the defoaming agent, known defoamers such as silicone oil, fluorine oil, and polycarboxylic acid polymers can be used. The defoaming agent is 100 parts by weight with respect to the polymerizable composition. The paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) — III-J * IlnlI — · II I ---- ^ » — — — — — — — I ^ v. (Please read the notes on the back before filling out this page) -25- 507218 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -26-A7, ___B7 _ V. Description of the invention ( 23) Normally add 0 · 00 1 to 5 parts by weight. Examples of the blowing agent include low-boiling hydrocarbon compounds such as pentane, propane, and hexane; physical blowing agents (carbon dioxide gas, water vapor, etc.); Butyronitrile, N &gt;, azo compounds such as N-dinitrosopentamethylenetetramine, and nitroso compounds, etc.)). (5) Colorants Suitable colorants in the present invention include inorganic pigments such as titanium dioxide, cobalt blue, cadmium yellow, carbon black, nigrosine, Θ-naphthol, phthalocyanine, quinacridone, azo-based, quinophthalein Ketone, indanthrene blue and other organic pigments, and can be mixed according to the desired hue. It may be used in combination of two or more kinds. Generally, these pigments can be added in an amount of 0.1 to 50 parts by weight based on 100 parts by weight of the polymerizable composition. (6) Stabilizers The stabilizers used in the present invention include ultraviolet absorbers, light stabilizers and antioxidants. Examples of the ultraviolet absorber include salicylic acid-based ultraviolet absorbers such as phenyl salicylate, p-tert-butyl salicylate, 2,4-dihydroxybenzophenone, 2. -hydroxy-4 Benzophenone-based UV absorbers such as methoxybenzophenone, 2,2-dihydroxy-4,4-dimethoxybenzophenone, etc. This & Zhang scale applies to China National Standard (CNS) A4 specifications ( 210 X 297 mm) ---- ί--Γ ------------ Order --------- • line &lt; Please read the notes on the back before filling in this Page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 ____ B7 V. Description of the invention (24) 2-(2--hydroxyl-5 / -methylphenyl) benzotriazole, 2-{2hydroxyl 3 &gt;, 5 / -bis (third butyl) phenyl} benzotriazole, 2- {2, -hydroxy-3 &gt;, 5, bis (third pentyl) phenyl} benzotriazole Benzotriazole UV absorber, 2-ethylhexyl-2, cyano-3,3'-biphenylpropionate, ethyl-2-cyano-3,3 &gt; A cyanoacrylate-based ultraviolet absorber such as phenylacrylate. They can be used alone or in combination of two or more. 〇5〜2 0 The addition amount of these ultraviolet absorbers can be appropriately determined according to the required characteristics of the use environment of the electronic device, the presence or absence of a cover, but it is generally used in an amount of 0.05 to 2 parts by weight based on the polymerizable composition. Examples of the light stabilizer by weight include bis (2,2,6,6-tetramethyl-4 piperidinyl) sebacate, bis (1,2,2,6,6-pentamethyl one) 4-piperidinyl) sebacate, dimethyl succinate- 1- (2-hydroxyethyl)-4 -hydroxy-2,2,6,6-tetramethylpiperidine polycondensate and other hindered amines Department of light stabilizers. This light stabilizer is usually added in an amount of 0.05 to 20 parts by weight based on 100 parts by weight of the polymerizable composition. Furthermore, examples of the antioxidant used in the present invention include quinones such as p-benzoquinone, tolylquinone, naphthoquinone, hydroquinone, p-tert-butylcatechol, and 2,5-bis (third-butyl) Hydroquinones such as hydroquinone, bis (third butyl) -p-cresol hydroquinone monomethyl ether, phenols such as pyrophenol, copper salts of naphthenolone and copper octenate, --- -! Γ --- * ----------- Order ------- • line i ^ w. (Please read the note on the back? Matters before filling this page) This paper Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) -27- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 __B7 V. Description of the invention (25) Monomethyl chloride, two Tertiary ammonium salts such as methyl benzylcis maleic acid ester, phenyltrimethylamine chloride, etc., quinqueline and methyl ethyl ketone, triethylamine hydrochloride and Dibutylamine hydrochloride and other amine hydrochloride, mineral oil, essential oil, fatty oil and other oil. These antioxidants can be added in different types and amounts according to the compatibility with the filling material, the molding workability of the purpose, and the stability of the resin storage. Generally, the amount of addition is 10 to 10,000 ppm based on 1,000 parts by weight of the polymerizable composition. (7) Adhesive imparting agent Examples of the adhesive imparting agent used in the present invention include silane coupling agent 51. The silane-based coupling agent is generally represented by the following general formula (1 3).

Yn—S i — χ4-Π ... (13) However, Y is a monovalent group having a functional group and bonded to si, and χ is a monovalent group having hydrolyzability and bonded to S i . η is an integer of 1 to 3. The functional groups in fluorene are, for example, vinyl, amine, epoxy, chloro, hydrogenthio, methacryloxy, cyano, urethane, pyridine, azide, urea, benzene Vinyl, chloromethyl, ammonium, alcohol and other groups. X is, for example, a chloro group, a methoxy group, an ethoxy group, a methoxyethoxy group, or the like. Specific examples of such sand courtyard coupling agents include ethylene sand trimethyl gas, a sand courtyard, vinyltris (2-methoxyethoxy) silane, and r ~ (2-aminoethyl). The paper standards are applicable to Chinese national standards (CNS ) A4 size (210 X 297 mm) -28- Γ Γ -------------------- (Please read the notes on the back before filling this page) Ministry of Economy Printed by the Intellectual Property Bureau's Consumer Cooperatives 507218 A7 B7___ V. Description of the Invention (26)) -Aminopropyltrimethoxysilane, r-hydrothiopropyltrimethoxysilane, r-glycidyloxypropyltrimethoxysilane , R-methacryloxypropyltrimethoxysilane, N, N-dimethylaminephenyltriethoxysilane, hydrothioethyltriethoxysilane, methacryloxyethyldimethyl chloride (3-trimethoxysilylpropyl) ammonium, 3- (N-styrenemethyl-2-aminoethylamino) propyltrimethoxysilane hydrochloride, etc., and they can also be used in combination. The silane-based coupling agent is usually added in an amount of 0.001 to 5 parts by weight based on 1,000 parts by weight of the flocculant composition. (8) Flame retardants Flame retardants can be derived from hexabromobenzene, tetrabromobisphenol A, decabromodiphenyl ether, tribromophenol, dibromophenyl glycidyl ether, perchloropentacyclodecane, and hytrate And other halogen-based compounds. They can be used alone or in combination of two or more. In addition, phosphoric acid compounds such as tris (dichloropropyl) phosphate, tris (dibromopropyl) phosphate, and boric acid compounds can also be used. Furthermore, examples of the flame retardant aid include antimony trioxide, iron oxide, aluminum hydride, and the like, and the flame retardant effect can be improved by using the flame retardant. Generally, a halogen-based flame retardant is used in an amount of 1 to 50 parts by weight based on 100 parts by weight of a cycloolefin-based compound, and a flame retardant such as antimony trioxide is used in a range of 1 to 15 parts by weight. Also, commercially available hydrates such as aluminum hydroxide and magnesium hydroxide as fillers for plastics can also be used as flame-resistant filler materials. These additions are based on 100 parts by weight of the polymerizable composition. 'Preferable use 1 〇 ~ 3 0 0 This paper size applies to China National Standard (CNS) A4 specifications (210x 297 mm) -29- ---- Γ ------- ------- Order ------- 丨 -line (Please read the precautions on the back before filling out this page) Printed by the Employee Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507218 A7 B7 5. Description of the invention (27) Range of parts by weight. (9) Organic peroxide Furthermore, an organic peroxide may be added. Examples of the organic peroxide include cumene hydroperoxide, tert-butyl peroxy 2-ethylhexanoate, methyl ethyl ketone peroxide, benzamidine peroxide, acetoacetone peroxide, and bis-4 A well-known substance such as a third butyl cyclohexane dicarboxylic acid ester, 2,5-dimethyl-2,5-bis (third butylperoxy) hexyne-3, which can be used alone, and also More than two kinds can be used. The added amount is usually 100 parts by weight with respect to the polymerizable composition, and preferably 0.1 to 10 parts by weight. (10) Reactive diluent In the electronic device of the present invention, in order to adjust the viscosity of the composition and the mechanical and electrical characteristics of the packaged component, the polymerizable composition used for packaging may also use acrylic monomers and methacrylic Reactive diluent with low viscosity, such as monomers, vinyl monomers, and diaryl phthalates. They can be used singly or in combination of two or more. However, it is desirable that the polymerizable composition used in the packaging of the electronic device of the present invention does not contain a solvent. The solvent used herein refers to a generally known non-reactive diluent such as benzene, toluene, xylene, ethyl acetate, methyl ethyl ketone, and the like. (Ii) When a commercially available product is used as an additive, it may contain a solvent. The cereals contained in such towels can be ignored. However, this case is also to prevent swelling during hardening. It is better to make the solvent content relative to the polymerizable composition. This paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love).丨 丨 1-, 丨 丨 丨 I 丨 丨 丨 丨 丨 --Order. 丨 丨 丨 丨 丨 丨 I (Please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 507218 A7 _____ B7 V. Description of the invention (28) The content is less than 2 parts by weight. (11) Others In addition to the above components, the polymerizable composition for encapsulation used in the present invention may be added with appropriate components as necessary. For example, in order to improve the wettability of the filling material, a coupling agent (e.g., a commercially available wetting agent and dispersant represented by the B Y K series manufactured by Beek Chem) can be added. In addition, in order to improve workability, release agents such as silicone oil and zinc stearate may be added. D. Molding method For the molding method of the electronic device of the present invention, a layer synthesis method such as a vacuum injection molding method, a pressure injection molding method, an impregnation molding method, a RTM molding method, a dipping method, a manual lamination, and a spray lamination can be used , Compression molding method, fiber filament winding method, centrifugal molding method, vacuum or pressure support method, continuous molding method, draw molding method, injection molding method, transfer molding method and the like. When the metathesis polymerization catalysts shown in the above general formulae (1) to (3) are used, these moldings must be performed in an inert gas atmosphere. When using a cycloolefin-based polymerizable composition, a metathesis polymerization catalyst can be added to the composition, dissolved, and then polymerized by heating. The temperature at which the metathesis polymerization catalyst is added to the polymerizable composition and dissolved is usually 0 to 80 ° C, preferably room temperature to 50 ° C. The heating operation for obtaining the polymer may be one-stage heating, and may be multi-stage heating of two or more stages. When heating in one stage, its temperature is usually 0 ~ 250. (:, Preferably 20 ~ 200 ° C. When heating in two stages ^ Paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) I --- Γ ------ ---------- Order --------- line (please read the precautions on the back before filling this page) 507218 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Explanation (29) 'The temperature in the first stage is usually 0 ~ 150 ° C, preferably 10 ~ 100 ° C, and the temperature in the second stage is usually 200 ~ 200 ° C, preferably 30 to 180 t. In addition, the polymerization time is appropriately determined according to the amount of catalyst and the polymerization temperature, but is usually 1 minute to 50 hours. III. Housing The electronic device of the present invention is a hardened material including the polymerizable composition. The object is used as a package part, but it can also be covered with a cover object. At this time, the package part and the cover object can also be integrally formed. Moreover, the substrate on which the component is mounted can also be placed in the cover. Encapsulated with resin. 尙 The material of the casing can be made of inorganic materials such as SUS, copper, iron, aluminum, ceramics, etc., and thermosetting resins, thermoplastic resins. Among organic materials such as biodegradable resins and natural resins, there are no particular restrictions on the selection based on the purpose and application. In addition, the shape and scale of the casing and electronic device can also be arbitrarily designed according to the purpose and the like. EXAMPLES Hereinafter, the present invention will be described based on examples. That is, in the following examples and comparative examples, the so-called "parts" means "parts by weight I. Resin preparation &lt; Resin 1: low olefin content" unless otherwise specified. Elasticity Resin> This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) _ ---- Γ ---- * I ---- i I ----- ^- ----- 1 (Please read the notes on the back before filling this page) 507218 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _______B7___ V. Description of the invention (30) High purity dicyclopentadiene (Nine Goods) 50 parts by weight of a petroleum chemical company with a purity of 99% or more, 50 parts by weight of cyclooctadiene (manufactured by HULS with a purity of 98.5% or more) and 50 parts by weight of a silane coupling agent ) Made by FZ — 3778) 0 · 1 part by weight mixed. Next, melt silicon with an average particle diameter of 15 # m (Huse Rex RD-8 manufactured by Longsen Co., Ltd.) or aluminum hydroxide with an average particle size of 8 (C-3 0 8 manufactured by Jiyou Chemical Industry Co., Ltd.) is added in the specified amount shown in Table 1 to obtain a composition In this composition, 0.2 parts by weight of the metathesis polymerization catalyst shown in the above structural formula (9) was added immediately before injection molding and tested. Unless otherwise specified, the curing conditions were 3 8 t: 2 hours + 100 ° C for 1 hour + 125 ° C for 1 hour. &lt; Resin 2: acrylic low-elasticity resin &gt; Polypropylene glycol dimethacrylate (Kyoeisha Chemical Co., Ltd.) was mixed with 90 parts of lauryl methacrylate (Lite Ester L manufactured by Kyoeisha Chemical Co., Ltd.). 10 parts of NK Ester 9PG manufactured by KK Co., Ltd., and mixed with a silane coupling agent (FZ-3778 manufactured by Unica Co., Ltd.) in an amount of 0.1 parts by weight. Next, fused silica (Huse Rex RD-8 manufactured by Longsen Co., Ltd.) having an average particle diameter of 15 / zm was added in a specified amount shown in Table 1 to obtain a composition. To this composition, 0.5 parts of a third butylperoxy-2-ethylhexanoate as a polymerization catalyst was added immediately before injection and tested. Unless otherwise stated, the hardening conditions are 40 t: 1 hour + 60 ° C 3 hours + 80 ° C 1 hour + 1 ° C 1 hour.

This standard is applicable to the national standard (CNS) A4 specification (210 X 297 public love) II (Please read the precautions on the back before filling this page) f Order --------- line. 507218 A7 ____B7 V. Description of the invention (31) &lt; Resin 3: Polyester-based low-elasticity resin &gt; In a two-liter four-neck flask equipped with a stirrer, a condenser tube, a nitrogen introduction tube, and a thermometer, diethylene glycol 4 6 3 was charged. Parts, neopentyl glycol 4 5 4 parts, adipic acid 9 2 7 parts, maleic anhydride 1 5 6 parts, and using a covered heater to heat up to 1 5 while slowly flowing nitrogen 0 ° C. After holding for 1 hour, the temperature was raised to 220 ° C over 5 hours. It was held at this temperature for 6 hours to obtain an unsaturated polyester having an acid value of 30. In this, 0.01% of a styrene monomer dissolved in hydroquinone was added to 70% by weight of an unsaturated polyester and dissolved, so that the viscosity at 25 ° C was 0.19Pa · s (0. 1 9 N · sm-2) unsaturated polyester resin solution. To 100 parts of this resin solution, bis (4-tertiary-butylcyclohexyl) peroxydicarbonate of organic peroxide was added. 0.15 parts, cumene hydroperoxide was 0.45 parts, 0 · 8 parts of benzamidine oxide. Unless otherwise stated, the curing conditions are 80 t 3 hours + 1 2 5 t: 3 hours. &lt; Resin 4: Dicyclopentadiene-based resin 1 &gt; 100 parts by weight of dicyclopentadiene of the same high purity as resin 1 and a silane coupling agent (FZ-3778, manufactured by Unica Co., Ltd.) 0 · 1 weight Serving. Next, fused silica (Huse Rex RD-8 manufactured by Longsen Co., Ltd.) having an average particle size of 15 // m was added to the amount specified in Table 2 'and stirred to obtain a composition. The hardening is carried out in the same manner as the resin 1 using the complex decomposition polymerization catalyst shown in the structural formula (9). This paper size applies to China National Standard (CNS) A4 (210 x 297 public love) -34- (Please read the precautions on the back before filling this page) --------- Order — 丨 --- -I. Printed by the Employees 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by 507218 A7 B7 V. Description of the invention (32) &lt; Resin 5 ·· Dicyclopentadiene resin 2 &gt; Among the dicyclopentadiene used in Resin 1, diethylaluminum chloride at a concentration of 40 mmol, n-propanol at a concentration of 52 mmol and 'silicon tetrachloride at a concentration of 20 mmol Add 'Making solution A' in a dry box purged with nitrogen. Dicyclopentadiene, which is the same as solution A, was added with tridecyl ammonium molybdate at a concentration of 10 millimolars to prepare solution B. 50 parts by weight of each of the A liquid and the B liquid were mixed, and the average particle diameter of the fused silica (Huse Rex RD-8, manufactured by Longsen Co., Ltd.) 1 0 0 parts by weight was used at a side velocity of 1 5 // m. Equal amounts were mixed under the atmosphere and tested. Hardening conditions Unless otherwise specified, 50 ° C 0 · 5 hours + 125 ° C for 3 hours. &lt; Resin 6: Epoxy resin &gt; To 1,000 parts by weight of bisphenol A type epoxy resin (YD-1 2 8 manufactured by Tohto Kasei Co., Ltd.), a silane coupling agent 0.1 parts by weight (Toshiba Silicone Co., Ltd., TSA — 720). On the other hand, 2 parts of 2-ethyl-4-methylimidazole were added to 87 parts by weight of methyltetrahydroanhydride (HN—220 0) manufactured by Hitachi Chemical Co., Ltd. as a hardener. . 50 parts by weight of liquid A and 45 parts by weight of liquid B were mixed, and 1,000 parts by weight of fused silica having an average particle size of 15 (Huse Rex RD-8 manufactured by Longsen Co., Ltd.) was further mixed, and thoroughly stirred. And for testing. Unless otherwise stated, the hardening conditions are 100 ° C for 1 hour and 1 2 5 ° C for 2 hours. The paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) I --- /- -一 --------- I ------------- ^ Aw (Please read the notes on the back before filling this page) 35- 507218 A7 B7

V. Description of the invention (33) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and 14 C 3 hours. &lt; Resin 7: Polysiloxane resin &gt; A commercially available exothermic polysiloxane resin (KE-1 2 2 3 manufactured by Shin-Etsu Silicone Co., Ltd.) was tested. Unless otherwise stated, the curing conditions are 100 ° C for 1 hour. &lt; Resin 8: Urethane resin &gt; In 100 parts by weight of a commercially available urethane resin for injection molding (KU-707 manufactured by Hitachi Chemical Co., Ltd.), 0.1 part by weight was mixed and stirred. Silane coupling agent (AZ-6171, manufactured by Unica Co., Ltd., Japan), and then mixed with fused silica having an average particle diameter of 15 V m to remove attached water by heating (Huse Rex RD-8, manufactured by Ronson Corporation) 1 0 0 parts by weight. Unless otherwise stated, the hardening conditions are 50 ° C for 3 hours + 100 ° C for 2 hours. &lt; Resin 9: olefin-based low elasticity resin &gt;

25 parts by weight of high-purity dicyclopentadiene, 75 parts by weight of cyclooctadiene, and 0.1 part by weight of a silane coupling agent (FZ-3778 manufactured by Unica Japan) were blended. Next, high-purity synthetic silica (Adomafine SO-25H manufactured by Longsen Co., Ltd.) having an average particle diameter of 0.5 μm was added in a specified amount shown in Table 1 to obtain a composition. In this composition, 1 part by weight of the metathesis polymerization catalyst represented by the general formula (10) was added immediately before the injection, and it was tested. As long as the hardening conditions are not specified, then it is 2 5 ° C ----} 丨} ---- Feng -------- Order --------- Line #, C Please read first Note on the back page, please fill in this page again) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -36- 507218 A7 B7 V. Description of the invention (34) 1 hour + 1 0 0 ° C 1 hour. (Please read the precautions on the back before filling in this page) &lt; Resin 10: Olefins-based low elasticity resin &gt; High purity dicyclopentadiene 2 5 parts by weight and cyclooctadiene 3 7 · 5 parts by weight 3. After adding 37.5 parts by weight of cyclooctene (purity of 97% manufactured by HULS), immediately before injection, add 0.1 · 1 parts by weight of the metathesis polymerization catalyst shown in the general formula (1 0) for testing. Hardening conditions Unless otherwise stated, 25 ° C for 1 hour + 100 ° C for 1 hour. II Test method &lt; Viscosity &gt; The viscosity was measured using a B-type viscometer under conditions of 2 3 t, Rotor No. 3, 60 r p m. &lt; Flexural modulus &gt; Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs For the above resins 1 to 10, injection-molded plates with a thickness of 3 mm were made and measured in accordance with J I S-K 7 2 0 3. Alas, the shape of the test piece was 25x80x3mm, the test span was 48mm, and the test speed was 100mm / min. &lt; Model impregnation test &gt; In a polypropylene test tube with a diameter of 15 mm, glass beads (average particle size 80 μm) dried at 1000 ° C. for 1 hour are applicable at a height of about 60 mm. China National Standard (CNS) A4 (210 x 297 mm) 37 507218 A7 B7 V. Description of the invention (35) After filling with vibration at 35 degrees, measure the weight of glass beads w. (S) ° (Please read the precautions on the back before filling this page) Second, in a polypropylene test tube filled with glass beads, inject the polymerizable composition at a liquid level of about 60 mm, and After decompressing in 1 · 3 KP a and leaving it for 10 minutes, heat curing was performed under prescribed conditions. Next, glass beads that were not impregnated and separated from the hardened matter were collected, and the weight Wi (g) was measured. The model impregnation rate was calculated from the following formula.

Model impregnation rate WhKWo-Wd / WdXlOO &lt; output power characteristics &gt; For device models 1 to 3, a heating cycle test with (-1 40 ° C 3 0 minutes + 1 2 5 ° C 30 minutes) as a cycle A total of 400 cycles, and after the test, whether the secondary voltage of the output power above 20 KV is obtained when 12 V is applied as the primary voltage is tested. The parts after the test were cut and the presence or absence of peeling was observed with an optical microscope. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs &lt; Formability &gt; For the device model 4 ', the cut-off state of the metal wire was confirmed with a soft X-ray, and the presence or absence of disconnection was evaluated. &lt; Reflow resistance &gt; Using device models 4 and 5, it was left in an atmosphere of 8 5 ° C / 8 5% RH for 16 8 hours, and then performed 3 times at 2 4 0 ° c for 10 seconds. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -38-507218 A7 __ — _ B7 V. Description of the invention (36) Heating, and observe the occurrence of cracks and electrical test. &lt; Method for making device model &gt; (1) Device model 1: Ignition coil The ignition coil produced in this embodiment is as shown in Fig. 1 and has a magnetic core 1 and an external core 1 2. A primary spool 1 3. Primary coil 1 4. Secondary bobbin 1 5. Secondary coil 1 6. Terminal 1 7. Ignition timing control circuit parts 1 8. Primary terminal 2 0. Housing (box) 2 1. And, packaging resin Constituted package part 23. The ignition timing control circuit part 18 is a ceramic substrate 19 with IC attached thereto, and is encapsulated with an epoxy resin 22. Alas, in FIG. 1, a cross-sectional view is omitted for easy viewing. The primary coil 14 is used for winding 2,000 times of enameled wire with a diameter of about 0.5 mm, and the secondary coil 16 is used for winding 20,000 times of enameled wire with a diameter of about 0.05 mm, and is respectively on the spool 1 3. 1 5 Roll up the line. The primary coil 14 is a direct current flowing to the battery, and the current is intermittently changed by the ignition timing control circuit part 18 and the power switch to change the magnetic flux ’, and the primary voltage can be obtained through self-induction. The ignition coil is induced by the primary coil 14 and the secondary coil 16 to cause this primary voltage to generate a high voltage of 20 to 40 KV, so that the ignition plug connected to the terminal generates a spark discharge. The device model 1 is assembled in a polyphenylene sulfide (PPS) box 2 1 with a magnetic core 1 1, 1 2, an aluminum electrode, an ignition timing control circuit part 18, and a modified polyphenylene oxide (PPO) bobbin 13. The paper size of 15 rewind papers is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling in this page) * nnn -1.1 nnn 1 ^ I n 1 I nn line -Printed by 507218 A7 ____B7_ of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the Invention (37) (Please read the precautions on the back before filling this page) Primary Assembly 圏 1 4 and Secondary Coil 16 Assemblies And test samples shown in Tables 1 and 2 (defoaming at 0 · 6 7 KP a for 1 minute) injection molding as a polymerizable composition for encapsulation, and 30 t 1 hour + 5 0 ° C 1 hour + 8 0 ° C 1 hour + 1 2 0 ° C 1 hour hardening conditions to harden, forming package parts 2 3, to obtain the ignition wire 圏. (2) Device model 2:-In addition to using a ceramic substrate with a bare chip IC (parts are not packaged) as the ignition timing control circuit part 18, the packaged ignition coil will be assembled in the same configuration of device model 1 as The test samples shown in Table 1 (defoamed at 0.67 KP a for 1 minute) were injection-molded as a polymerizable composition for encapsulation, and at 30 ° C for 1 hour + 50 ° C for 1 hour + 8 0 ° C for 1 hour + 1 2 0 ° C for 1 hour under the hardening conditions to harden to form the package parts 2 3, to obtain the ignition coil that encapsulates the electronic circuit parts and the coils together. (3) Device model 3: Printed magnetic core 1 1, 1 2. Brass electrode, ignition timing control circuit parts 1 8 (ceramic with bare chip IC) Substrate (parts are not packaged) and modified PP 0-made spools 1, 3, and 15. The primary coils 14 and secondary coils 16 rolled back are used for necessary wiring, and they are arranged at designated positions in the center of the mold. The test sample shown in 1 (defoamed for 1 minute at 0.67KP a) is injection-molded as a polymerizable composition for encapsulation, and is 30 ° C for 1 hour + 5 0 t for 1 hour + 8 0 ° C 1 Hour + ^ Paper size applies Chinese National Standard (CNS) A4 specification (210 &gt; &lt; 297 mm) &quot; &quot; -40- 507218 A7 B7 V. Description of the invention (38) 1 2 0 ° C 1 hour hardening conditions After hardening to form package parts 2 and 3, the packaged ignition coil can be obtained from the mold. (Please read the precautions on the back before filling this page) (4) Device model 4 ·· IC parts in 縦 2 5mm, 22.5mm in width, 5mm in thickness. The center of the modified PP0 box 2 1 is equipped with 15mm each in the vertical and horizontal directions. The ceramic substrate with 16-pin DIP-type IC packaged with epoxy resin is flowed into the package part to form a packaged part to obtain a resin-encapsulated semiconductor device. (5) Device model 5: DIP-type 1C package The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Material and Economics printed a test component for use (aluminum wiring was applied to a silicon chip with 5mm oxide film in both vertical and horizontal directions), and it was framed with a part of silver-plated 42 alloy. The epoxy-based silver paste was spliced, and a thermo-acoustic wire connector was used to connect the bonding pads of the device and the internal wires with a 10 μm metal wire at 20 ° C. Thereafter, it was removed in advance. The test specimens of the foam were adhered and hardened to form package parts, and a 16-pin DIP-type semiconductor package with a resin package was obtained. &Lt; Glass transition temperature (T g) &gt; Use of TMA 8 manufactured by Ugacu Co., Ltd. 3 10 Measurement. &Lt; Coefficient of linear expansion &gt; Using TMA 8310 manufactured by Ligacu Co., Ltd. at -41-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 507218 A7 ______B7 5. Description of the invention (39) —1 0 0 ° C ~ 2 Measured at 0 0 ° C. &Lt; Dielectric Rate &gt; Using a TR-1 ° C dielectric loss meter made by Ando Electric Co., Ltd., and measured at 1 μΗ. &Lt; Water absorption &gt; Measured in accordance with JIS K 7 1 1 4. III Test results The results of Examples and Comparative Examples are shown in Tables 1 and 2. The electronic device of each example is a device of each comparative example encapsulated with an epoxy resin and a dicyclopentadiene-based resin having a high elastic modulus and a polysiloxane resin and a urethane resin having a low elastic modulus. Has better output characteristics, moldability and reflow resistance. This result shows that the electronic device of the present invention has excellent reliability. ---— I — Γ ------------ Order --------- line (please read the precautions on the back before filling this page) Employees of Intellectual Property Bureau of the Ministry of Economy Consumption The paper size printed by the cooperative applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -42-507218 Α7B7 V. Description of the invention (40) Table 1 Example of printing by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 2 3 4 5 6 7 8 9 Material Shelves 1 100 100 100 100-----Resin 2 Suspect---100----Shelves 3----100-Vertical-Resins 4 Shelves 5 Purpose 6-Resin 7 • • Resin 8 Resin 9 100 100 Pain Resin 10-100 Fused Evening Stone 100 300 • 50 30 20 Vertical-Aluminium hydroxide suspected ore 100 Suspected seam-Look-Flexural modulus (MPa) 50 200 15 50 40 110 1 &gt; 1 &gt; 1 &gt; Water absorption (% by weight) 10.06 0.08 0.06 0.09 0.11 0.12 0.06 0.05 0.05 Dielectric constant 2.7 2.9 2.4 3.1 3.7 3.8 2.5 2.4 2.4 Linear expansion coefficient (ppm / K) 70 40 130 70 100 130 200 250 240 Glass transition temperature (rc) -20 -20 -20 -20 -60 30 -60 -60 -55 Viscosity (Pa · s) 0.05 0.19 0.02 0.15 0.19 0.19 0.05 0.003 0.003 Surface impregnation rate (%) 98 96 100 90 88 86 99 100 100 Presence or absence of moldability scale) Charm Μ J 1 \ Ν and ^ ϊ \\ Μ j \\\ Μ j \\\ 4ΐΐΤ. ιΤΤτ: J \\\ NEW / \\\ カ Μ j \\\ Output power device model 1 Output power Yes Yes Yes Yes Yes Yes Yes Yes Charm J \\\ No Μ dnSL m iTTiT J »w dnL Τπτ: j \\\ and j \\\ Μ j \\\ dnL Tfif: j \\\ Device model 2 output power yes yes yes yes yes yes With peeling te jw \ 4rrr ιΓΓΓ J \ w / frrf 1Π17 J \\\ 4n £ L ΠιιΓ 4tttl ΤΓΠΤ J i \\ Μ j \\\ Μ j \\\ Μ j \\\ charm d \ w device model 3 output Power yes yes yes yes yes yes yes j \ w 4rtr Π11 &quot; J \ S \ Μ / \\\ charm M j \ w Μ and j \\\ j \\\ solder reflow resistant device model 4 conduction YES YES YES YES YES YES te te Μ / \\\ te jw \ charm jiw charm j \\\ jia j \\\ Μ j \\\ J \ S \ device model 5 conduction yes yes yes Yes Yes Yes Yes Yes M j »M j \\\ jfrrr: 1111: No y ϊ \\ charm / \\\ ^ τΙΙΓ- lUt? J \ \\ ^ fnT ιΓΤΤ: J \\\ j \ w (Please read the precautions on the back before filling this page), φ ^ ί --- order — ^ -------- line. -L. This paper size applies to Chinese National Standard (CNS) A4 (210 x 297 mm) -43 507218 A7B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Description of the Invention (41) Table 2 Comparative Example 1 2 3 4 5 Material Shed 1-----Resin 2-----Resin 3----Shed 4 4----Shed 5-100 • --Resin 6--100--Resin 7-• • 100-Resin 8 _ • Age · 100 Resin 9 Resin 10 Fresh Sleeping Fused Silica 100 100 100 100 Aluminum hydroxide ) 3000 3300 5000-Surface water absorption (wt%) 0.06 0.15 0.2 0.3 0.3 Dielectric constant 2.6 2.6 3.9 2.9 4.1 Linear expansion coefficient (ppm / K) 30 28 40 300 180 Glass transition temperature (. 〇135 140 106 -60 -70 Viscosity (Pa · s) 0.23 0.1 15 9 10 Model impregnation rate (%) 95 94 39 40 44 Presence or absence of moldability tear line Μ j \\\ and j \\\ Yes Yes Yes Output power device model 1 Output power ^ \\\ Aw i * τΤΤΤ: JWS 加 jw \ Μ j \\\ -fat Stripped with or without device model 2 Output power &gt; flfp ΙΠΓ J \\\ and J \ \\ 4ττΓ- ΙΗΓ J \\\ and j \\\ λΠΤ- TfTT? J \\\ peeled off with or without device model 3 output power Μ j \\\ Μ j \\\ charm J \\\ Μ Μ j \\\ peeled yes yes yes yes solder resist reflow device model 4 lead ^^ \\\ ^ \\\ Μ j 1 \\ Μ j \\\ Μ peeled yes yes yes yes device model 5 lead jw \ Μ j \\\ no Μ j \ \\ e no j \\\ peeled off yes yes yes yes (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specifications ( 210 X 297 mm) -44- 507218 A7 _B7_ V. Description of the invention (42) Industrial applicability As mentioned above, the electronic device of the present invention is excellent in water resistance, reflow crack resistance, etc., and has high Reliability. Therefore, if the electronic device of the present invention is used, it is possible to widely provide electrical appliances and electronic parts that are compatible with high density, high integration, long life, and stomach durability. -IIII -I n it II n · 1 n I It nnn》 aJa n ϋ nnn ϋ ϋ I (Please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs-45- This paper Standards apply to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

6. Application for Patent Scope No. 89103530 Patent Application Chinese Patent Application Amendment (please read the precautions on the back before filling this page) Republic of China 1990 / month Amendment 1 · An electronic device is equipped with an order containing more than one type A packaging part obtained by polymerizing a polymerizable composition of a metathesis polymerizable cycloolefin compound. The polymerizable composition is a polymerizable liquid substance having a viscosity of less than 0.3 ^ · s · m _ 2 at 2 3 ° C. The package The material has a flexural modulus of 500 MPa or less at 2 3 ° C. 2 · The electronic device according to item 1 of the scope of patent application, wherein the packaging component has a glass transition temperature of 80 ° C or lower. 3. The electronic device according to item 1 of the scope of patent application, wherein the package component has a coefficient of linear expansion of more than 100 p p m at 23 ° C. 4 · If the electronic device of the scope of application for the first item of the patent application, wherein the water absorption of the packaged part at 2 3 ° C for 24 hours is less than 0.1% by weight. For example, the electronic device of the first patent application range, wherein the dielectric constant of the packaging material at 2 3 ° C is 3.0 or less. 6. The electronic device according to item 1 of the patent application scope, wherein the polymerizable composition contains a charging material. 7. The electronic device according to item 1 of the scope of patent application, wherein the polymerizable composition contains a modifier, a polymerization speed regulator, a foaming agent, a defoaming agent, a colorant, a stabilizer, and an adhesive agent. , Flame retardants, coupling agents ^ Paper size: China National Standards (CNS) A4 size 2i × 297 mm) ~-: --- 507218 Α8 Β8 C8 D8 cavity, patent application and organic peroxide At least one of the additives. 8. The electronic device according to item 1 of the scope of patent application, wherein the polymerizable composition does not contain a solvent. 9. The electronic device according to item 1 of the application, wherein the polymerizable composition contains two or more compounds selected from metathesis polymerizable cycloolefin compounds having a molecular weight of less than 300. 10. The electronic device according to item 1 of the scope of patent application, wherein the polymerizable composition contains a metathesis polymerization catalyst. 1 1 · If the electronic device of the scope of patent application No. 10, wherein the metathesis polymerization catalyst is a compound represented by the following general formula (1) (please read the precautions on the back before filling this page) X (1) L], I Μ C Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (here, M represents ruthenium or iron, X1 and X2 each independently represent an anionic ligand, L 1 and L 2 each independently represent a neutral ligand, Q 1 And Q2 each independently represent hydrogen, an alkyl group, an alkyl group having a substituent, an alkenyl group, an alkenyl group having a substituent, an aromatic group, or an aromatic group having a substituent). 12. The electronic device according to item 10 of the scope of patent application, wherein the metathesis polymerization catalyst is a compound represented by the following general formula (2). The size of this paper is in accordance with China National Standard (CNS) A4 (210X297 mm) -2-507218 8888 ABCD VI. Application scope of patent X 1 L 1 Q 1 \ 丨 /… M = C = C (2) / 1 X2 L2 · Q2 (here, M is ruthenium or hungry. X1 and X2 each independently represent an anionic ligand, L 1 and L 2 each independently represent a neutral ligand, and Q 1 and Q2 each independently Represents hydrogen, alkyl, substituted alkyl, alkenyl, substituted alkenyl, aromatic group, or substituted aromatic group). 1 3 · If the electronic device of the scope of patent application No. 10, wherein the metathesis polymerization catalyst is a compound not shown in the following general formula (3) (please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (here, M is ruthenium or hungry, X1 and X2 each independently represent an anionic ligand, L 1 and L 2 each independently represent a neutral ligand, R 1 and R 2 independently represents an alkyl group having 1 to 18 carbons, a storage group having 2 to 18 carbons, and a fast group having 2 to 18 carbons, and a square group having 1 to 18 carbons. Ester group, 1 to 18 carbon atoms, alkenyloxy group, 2 to 18 carbon atoms, alkynyloxy group, 2 to 18 carbon atoms, 2 to 18 carbon atoms, aryloxy group Radicals, alkoxycarbonyl groups of 2 to 18 carbons, alkylthio groups of 1 to 8 carbons, alkylsulfonyl groups of 1 to 18 carbons, or alkyl papers of 1 to 18 carbons The standard is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) '507218 A8 B8 C8 D8 VI. Patent application scope sulfinyl sulfenyl group, R 3 is hydrogen, aryl or alkyl group with 1 ~ 18 carbon number ) 〇 (Please read the precautions on the back before filling out this page) 1 4 · If the electronic device is in the scope of patent application, the package parts are molded in an atmosphere containing oxygen. 1 5 · The electronic device according to item 1 of the scope of patent application, wherein the electronic device is provided with a central core composed of a magnetic body, a primary coil and a secondary coil wound around the periphery of the central core, and is disposed in the second Ignition coil of external core composed of magnetic body outside the secondary coil. 1 6 · A polymerizable composition, which is a packaging part provided with polymerizing a polymerizable composition containing one or more metathesis polymerizable cycloolefin compounds, and the polymerizable composition has a viscosity of less than 2 3 t 0 · 3N · s · m — 2 polymerizable liquid, the sealing material has a flexural modulus of 500 MPa or less at 2 3 ° C. 17 · The polymerizable composition according to item 16 of the scope of patent application, wherein the packaging part has a glass transition temperature of 80 ° C or lower. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 18 · If the polymerizable composition of item 16 in the scope of patent application, the packaging part has a linear expansion coefficient of 2 3 t: 100 P P m or more. .. i 1 9 · The polymerizable composition according to item 16 of the scope of patent application, wherein the water absorption of the packaged part after immersion in water for 2 to 24 hours is less than 0.1% by weight. 20 · If the polymerizable composition in item 16 of the scope of patent application, the paper size of this paper uses China National Standards (CNS) A4 specifications (210X297 mm) -4-507218 8 88 8 ABCD The dielectric constant of the packaging material at 2 3 ° C is 3.0 or less. 2 1 · If the polymerizable composition of item 16 in the scope of patent application, (please read the precautions on the back before filling out this page), the polymerizable composition contains a filling material. 2 2 · The polymerizable composition according to item 16 of the scope of application for a patent, wherein the polymerizable composition contains a modifier, a polymerization rate modifier, a foaming agent, an antifoaming agent, a colorant, a stabilizer, and an adhesive At least one of an additive, a flame retardant, a coupling agent, and an organic peroxide. 2 3. The polymerizable composition according to item 16 of the scope of patent application, wherein the polymerizable composition contains two or more compounds selected from metathesis polymerizable cycloolefin compounds having a molecular weight of less than 300. 24. The polymerizable composition according to item 16 of the scope of patent application, wherein the polymerizable composition contains a metathesis polymerization catalyst. 25. The polymerizable composition according to item 16 of the patent application scope, wherein the polymerizable composition contains a metathesis polymerization catalyst. 2 6 The polymerizable composition according to item 25 of the scope of patent application, wherein the metathesis polymerization catalyst is a compound represented by the following general formula (1): X 1 L 1 Q 1 X 1 / (1) M = C 1 1; / I \ L2 Q2 (Here, M is ruthenium or hungry, X1 and X 2 each independently represent an anionic ligand, and L 1 and L 2 each independently represent Neutral ligands, Q 1 and Q 2 each independently represent hydrogen, alkyl, alkyl with substituents, alkenyl, and this paper standards are applicable to China National Standard (CNS) A4 specifications (21〇 &gt; &lt; 297 public dust ^ ^: 507218 A8 B8 C8 D8 i, alkenyl group having substituents, aromatic group or aromatic group having substituents in the scope of patent application) 2 7 · Polymerization as in item 25 of the scope of patent application A chemical composition wherein the metathesis polymerization catalyst is a compound represented by the following general formula (2): L 1 QC 1-2 • mil C 2 Q (here, M is ruthenium or hungry, X1 and X2 are independent Represents anionic ligands, L 1 and L 2 each independently represent a neutral ligand, Q 1 and Q 2 each independently represent hydrogen, Alkyl group, substituted alkyl group, alkenyl group, substituted alkenyl group, aromatic group, or substituted aromatic group) 2 8 · If the polymerizable composition of the 25th item of the scope of patent application, The metathesis polymerization catalyst is a compound X 1 L 1 R 3 \ I / M = CR 1 / I \ / (3) X 2 L 2 C = C (please read the back first) Please note this page, please fill in this page) Ken Γ Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs (Here, M is ruthenium or hungry, X1 and X2 each independently represent an anionic ligand, L 1 and L 2 each independently represent a neutral ligand, and R 1 and R 2 each independently represent a carbon number of 1 to 1 8 alkyl groups, alkenyl groups of 2 to 18 carbon atoms, alkynyl groups of 2 to 18 carbon atoms, aryl groups, ester groups of 1 to 18 carbon atoms, alkyl groups of 1 to 18 carbon atoms Oxygen, carbon number 2 ~ 18 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -6- 507218 A8 B8 C8 D8 VI. Patent application scope Alkenyloxy, carbon number 2 ~ 1 8 Alkynyloxy groups, aryloxy groups with 2 to 18 carbons, alkoxycarbonyl groups with 2 to 18 carbons, alkylthio groups with 1 to 18 carbons, and 1 to 18 carbons Alkanesulfonyl or alkanesulfinyl with 1 to 18 carbons, R3 is hydrogen, aryl or alkyl with 1 to 18 carbons) 〇 2 9 · If the scope of application for the patent is 16th It is a polymerizable composition in which the package elasticity at 2 3 ° C is less than 500 M pa, and the package component can be molded in an atmosphere containing oxygen. (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -7- This paper uses the Chinese National Standard (CNS) A4 size (210 X 297 mm)