AU512805B2 - Control ofan electroless copper plating bath - Google Patents

Control ofan electroless copper plating bath

Info

Publication number
AU512805B2
AU512805B2 AU30760/77A AU3076077A AU512805B2 AU 512805 B2 AU512805 B2 AU 512805B2 AU 30760/77 A AU30760/77 A AU 30760/77A AU 3076077 A AU3076077 A AU 3076077A AU 512805 B2 AU512805 B2 AU 512805B2
Authority
AU
Australia
Prior art keywords
plating bath
copper plating
electroless copper
ofan
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU30760/77A
Other languages
English (en)
Other versions
AU3076077A (en
Inventor
R. J. Karas J. P. and Funk C. R Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of AU3076077A publication Critical patent/AU3076077A/en
Application granted granted Critical
Publication of AU512805B2 publication Critical patent/AU512805B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
AU30760/77A 1976-11-22 1977-11-18 Control ofan electroless copper plating bath Expired AU512805B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22
USUS744,110 1976-11-22

Publications (2)

Publication Number Publication Date
AU3076077A AU3076077A (en) 1979-05-24
AU512805B2 true AU512805B2 (en) 1980-10-30

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
AU30760/77A Expired AU512805B2 (en) 1976-11-22 1977-11-18 Control ofan electroless copper plating bath

Country Status (14)

Country Link
JP (1) JPS5365226A (enrdf_load_html_response)
AT (1) AT354213B (enrdf_load_html_response)
AU (1) AU512805B2 (enrdf_load_html_response)
CA (1) CA1112523A (enrdf_load_html_response)
CH (1) CH637995A5 (enrdf_load_html_response)
DE (2) DE2759952C2 (enrdf_load_html_response)
ES (1) ES464266A1 (enrdf_load_html_response)
FR (1) FR2371522A1 (enrdf_load_html_response)
GB (1) GB1588758A (enrdf_load_html_response)
IL (1) IL53298A (enrdf_load_html_response)
IT (1) IT1116376B (enrdf_load_html_response)
NL (1) NL7712683A (enrdf_load_html_response)
SE (1) SE442410B (enrdf_load_html_response)
ZA (1) ZA775495B (enrdf_load_html_response)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
DE2911073C2 (de) 1979-03-21 1984-01-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum automatischen Messen und Regeln der Konzentration der Hauptkomponenten eines Bades zum stromlosen Abscheiden von Kupfer
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS6096767A (ja) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 銅めつき方法
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
ES2039403T3 (es) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) Metodo para depositar sin electricidad cobre de alta calidad.
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
JPS63149278U (enrdf_load_html_response) * 1987-03-19 1988-09-30
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (ja) 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法
CN120006271B (zh) * 2025-04-18 2025-08-01 南通赛可特电子有限公司 一种化学镀铜溶液的制备参数调控方法及装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
JPS5921386B2 (ja) * 1976-04-13 1984-05-19 株式会社東芝 無電解メツキのメツキ速度自動制御方法

Also Published As

Publication number Publication date
SE7713192L (sv) 1978-05-23
GB1588758A (en) 1981-04-29
CA1112523A (en) 1981-11-17
DE2759952C2 (de) 1984-03-08
ATA827777A (de) 1979-05-15
AU3076077A (en) 1979-05-24
JPS5365226A (en) 1978-06-10
NL7712683A (nl) 1978-05-24
FR2371522B1 (enrdf_load_html_response) 1980-02-15
CH637995A5 (en) 1983-08-31
ZA775495B (en) 1978-07-26
IL53298A0 (en) 1978-01-31
IL53298A (en) 1981-02-27
IT1116376B (it) 1986-02-10
JPS5753857B2 (enrdf_load_html_response) 1982-11-15
DE2751104A1 (de) 1978-05-24
FR2371522A1 (fr) 1978-06-16
ES464266A1 (es) 1978-08-01
SE442410B (sv) 1985-12-23
AT354213B (de) 1979-12-27

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