AU4517193A - Component module - Google Patents

Component module

Info

Publication number
AU4517193A
AU4517193A AU45171/93A AU4517193A AU4517193A AU 4517193 A AU4517193 A AU 4517193A AU 45171/93 A AU45171/93 A AU 45171/93A AU 4517193 A AU4517193 A AU 4517193A AU 4517193 A AU4517193 A AU 4517193A
Authority
AU
Australia
Prior art keywords
module
transmitter
receiver
carrier substrate
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU45171/93A
Other languages
English (en)
Inventor
Mats Hedberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU4517193A publication Critical patent/AU4517193A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • G—PHYSICS
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    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4286—Optical modules with optical power monitoring
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/481—Disposition
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/341—Surface mounted components
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    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Transceivers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Glass Compositions (AREA)
AU45171/93A 1992-07-06 1993-06-02 Component module Abandoned AU4517193A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9202077A SE9202077L (sv) 1992-07-06 1992-07-06 Komponentmodul
SE9202077 1992-07-06
PCT/SE1993/000486 WO1994001987A1 (en) 1992-07-06 1993-06-02 Component module

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU46816/97A Division AU4681697A (en) 1992-07-06 1997-12-01 Component module

Publications (1)

Publication Number Publication Date
AU4517193A true AU4517193A (en) 1994-01-31

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AU45171/93A Abandoned AU4517193A (en) 1992-07-06 1993-06-02 Component module
AU46816/97A Abandoned AU4681697A (en) 1992-07-06 1997-12-01 Component module

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AU46816/97A Abandoned AU4681697A (en) 1992-07-06 1997-12-01 Component module

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EP (1) EP0649590A1 (fi)
JP (1) JPH08501657A (fi)
KR (1) KR950702790A (fi)
CN (1) CN1041479C (fi)
AU (2) AU4517193A (fi)
BR (1) BR9306685A (fi)
FI (1) FI950058A0 (fi)
MX (1) MXPA93003941A (fi)
NO (1) NO950038D0 (fi)
SE (1) SE9202077L (fi)
WO (1) WO1994001987A1 (fi)

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EP0936485A1 (de) * 1998-02-12 1999-08-18 Alcatel Optoelektronisches Bauelement
US6381283B1 (en) * 1998-10-07 2002-04-30 Controlnet, Inc. Integrated socket with chip carrier
DE10008340A1 (de) * 2000-02-23 2001-08-30 Siemens Ag Elektronische Flachbaugruppe für elektronische Geräte, insbesondere Kommunikationsendgeräte
EP1369002A2 (en) * 2001-01-17 2003-12-10 Honeywell International Inc. Adaptor for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
CA2373675A1 (en) * 2001-02-28 2002-08-28 Sumitomo Electric Industries, Ltd. Optical data link
US6894903B2 (en) 2001-02-28 2005-05-17 Sumitomo Electric Industries, Ltd. Optical data link
FR2822246B1 (fr) * 2001-03-15 2003-05-16 Opsitech Optical Sys On A Chip Procede de fabrication d'un boitier optique et dispositif opto-electronique
GB2385914B (en) * 2001-10-19 2004-03-03 Visteon Global Tech Inc LCC-Based fluid-level detection sensor
US20040156149A1 (en) * 2002-09-05 2004-08-12 Odd Steijer Method of and apparatus for plastic optical-chip encapsulation
CN101378624B (zh) * 2007-08-29 2010-11-10 海华科技股份有限公司 整合周边电路的模块结构及其制造方法
CN101965104A (zh) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 一种电路封装装置
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
CN103413797B (zh) * 2013-07-29 2015-10-14 中国科学院电工研究所 一种三维结构单元组装的功率半导体模块
CN103984065B (zh) * 2014-05-30 2015-07-15 武汉光迅科技股份有限公司 一种光传输模块
CN106298761A (zh) * 2016-09-24 2017-01-04 苏州捷研芯纳米科技有限公司 光电传感器封装件、半成品及批量封装方法

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US4447857A (en) * 1981-12-09 1984-05-08 International Business Machines Corporation Substrate with multiple type connections
JPS59180514A (ja) * 1983-03-31 1984-10-13 Toshiba Corp 光受信モジユ−ル
US4911519A (en) * 1989-02-01 1990-03-27 At&T Bell Laboratories Packaging techniques for optical transmitters/receivers
JPH02306690A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 表面実装用配線基板の製造方法
US5039194A (en) * 1990-01-09 1991-08-13 International Business Machines Corporation Optical fiber link card
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module

Also Published As

Publication number Publication date
JPH08501657A (ja) 1996-02-20
EP0649590A1 (en) 1995-04-26
FI950058A (fi) 1995-01-05
BR9306685A (pt) 1998-12-08
SE9202077L (sv) 1994-01-07
AU4681697A (en) 1998-02-05
FI950058A0 (fi) 1995-01-05
MXPA93003941A (es) 2010-11-12
NO950038L (no) 1995-01-05
WO1994001987A1 (en) 1994-01-20
NO950038D0 (no) 1995-01-05
CN1081297A (zh) 1994-01-26
CN1041479C (zh) 1998-12-30
SE9202077D0 (sv) 1992-07-06
KR950702790A (ko) 1995-07-29

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