CN1041479C - 元件模块 - Google Patents

元件模块 Download PDF

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Publication number
CN1041479C
CN1041479C CN93108141A CN93108141A CN1041479C CN 1041479 C CN1041479 C CN 1041479C CN 93108141 A CN93108141 A CN 93108141A CN 93108141 A CN93108141 A CN 93108141A CN 1041479 C CN1041479 C CN 1041479C
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CN
China
Prior art keywords
module
transceiver
transmitter
carrier substrates
receiver
Prior art date
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Expired - Fee Related
Application number
CN93108141A
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English (en)
Chinese (zh)
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CN1081297A (zh
Inventor
M·赫德堡
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Telefonaktiebolaget LM Ericsson AB
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Telefonaktiebolaget LM Ericsson AB
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Publication of CN1081297A publication Critical patent/CN1081297A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Transceivers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Glass Compositions (AREA)
CN93108141A 1992-07-06 1993-07-05 元件模块 Expired - Fee Related CN1041479C (zh)

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DE10008340A1 (de) * 2000-02-23 2001-08-30 Siemens Ag Elektronische Flachbaugruppe für elektronische Geräte, insbesondere Kommunikationsendgeräte
EP1369002A2 (en) * 2001-01-17 2003-12-10 Honeywell International Inc. Adaptor for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
US6894903B2 (en) 2001-02-28 2005-05-17 Sumitomo Electric Industries, Ltd. Optical data link
CA2373675A1 (en) * 2001-02-28 2002-08-28 Sumitomo Electric Industries, Ltd. Optical data link
FR2822246B1 (fr) * 2001-03-15 2003-05-16 Opsitech Optical Sys On A Chip Procede de fabrication d'un boitier optique et dispositif opto-electronique
GB2384636A (en) * 2001-10-19 2003-07-30 Visteon Global Tech Inc Communication system with a signal conduction matrix and surface signal router
US20040156149A1 (en) * 2002-09-05 2004-08-12 Odd Steijer Method of and apparatus for plastic optical-chip encapsulation
CN101378624B (zh) * 2007-08-29 2010-11-10 海华科技股份有限公司 整合周边电路的模块结构及其制造方法
CN101965104A (zh) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 一种电路封装装置
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
CN103413797B (zh) * 2013-07-29 2015-10-14 中国科学院电工研究所 一种三维结构单元组装的功率半导体模块
CN103984065B (zh) * 2014-05-30 2015-07-15 武汉光迅科技股份有限公司 一种光传输模块
CN106298761A (zh) * 2016-09-24 2017-01-04 苏州捷研芯纳米科技有限公司 光电传感器封装件、半成品及批量封装方法

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FI950058A0 (fi) 1995-01-05
AU4681697A (en) 1998-02-05
FI950058A (fi) 1995-01-05
NO950038L (no) 1995-01-05
CN1081297A (zh) 1994-01-26
BR9306685A (pt) 1998-12-08
KR950702790A (ko) 1995-07-29
JPH08501657A (ja) 1996-02-20
SE9202077D0 (sv) 1992-07-06
EP0649590A1 (en) 1995-04-26
MXPA93003941A (es) 2010-11-12
AU4517193A (en) 1994-01-31
WO1994001987A1 (en) 1994-01-20
NO950038D0 (no) 1995-01-05
SE9202077L (sv) 1994-01-07

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