KR950702790A - 소자 모듈(component module) - Google Patents

소자 모듈(component module) Download PDF

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Publication number
KR950702790A
KR950702790A KR1019950700054A KR19950700054A KR950702790A KR 950702790 A KR950702790 A KR 950702790A KR 1019950700054 A KR1019950700054 A KR 1019950700054A KR 19950700054 A KR19950700054 A KR 19950700054A KR 950702790 A KR950702790 A KR 950702790A
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KR
South Korea
Prior art keywords
module
transmitting
receiving
circuit
carrier substrate
Prior art date
Application number
KR1019950700054A
Other languages
English (en)
Inventor
헤드버그 매쓰
Original Assignee
에르링 볼롬메.타게 뢰브그렌
테레포오낙티이에보라겟 엘엠 엘리크썬
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Publication date
Application filed by 에르링 볼롬메.타게 뢰브그렌, 테레포오낙티이에보라겟 엘엠 엘리크썬 filed Critical 에르링 볼롬메.타게 뢰브그렌
Publication of KR950702790A publication Critical patent/KR950702790A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
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    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

본 발명은 포위소자 또는 소자(72)를 지닌 하나 이상의 회로(71)및 하나 이상의 내부 또는 외부 캐리어에 의해 포함된 소자 모듈(70)에 관한 것이다. 회로(71)는 캐리어기판에 직접 설치되어 있고, 소자 모듈(70)은 엔클러싱장치를 포함하고 주부소자모듈을 앤슐레이팅하는 한방향으로 표준회로와 앤클로싱장치의 형태와 크기를 한 내부캐리어기판 및/또는 인쇄회로기판에 직접 설치되도록 형성되어 있다. 본 발명은 또한 소자 모듈을 형성하는 송수신 모듈에 형성하는 송수신 모듈에 관한 것이다.

Description

소자 모듈(COMPONENT MOOULE)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제la도는 6개중 구조를 기반으로 한 수신 모듈의 상측의 예를 도시한 도면.
제2a도는 6개층 구조상의 송신 모듈 방향축의 상측층(1)의 도면.
제7a도는 직접 설치된 광소자를 지닌 수신 모듈의 도면.
제8a도는 인덕터의 캐리어 기판 직접 소자를 지닌 소자 모듈의 도면

Claims (42)

  1. 하나 이상의 캐리어기판이 소자를 포함하는 회로와 소자와 부가적인 소자를 포함하는 회로를 지닌 하나 이상의 내부 또는 외부 회로이고, 이회로 (들)는 캐리어기판에 직접 설치되어 있으며, 소자 모듈(10;20;30;50a;50b;50c;70;80;90)은 앤클로싱 장치를 포함하는 소자 모듈(10;20;30;50a;50b;50c;70;80;90)에 있어서, 앤클로싱 장치는 한 방향으로 소자 모듈의 주요부분을 앤캡슐레이트하고, 소자 모듈(10;20;30;50a;50b;50;70;80;90)이 외부 캐이어기판, 카드 또는 인쇄회로기판에 직접 설치될 수 있는 표준회로형으로 형성되어 있으며, 캐리어기판은 플라스틱, 유리섬유적층, 에폭시 또는 세라믹 또는 다층세라믹을 포하는는 것을 특징으로 하는 소자 모듈.
  2. 제 1항에 있어서, 독립소자를 더 포함하는 것을 특징으로 하는 소자 모듈.
  3. 제 2항에 있어서, 하나 이상의 독립소자는 소자 모듈을 구성하는 것을 특징으로 하는 것을 특징으로 하는 소자 모듈.
  4. 제 1항에 있어서, LCC-표준회로 또는 PAA-표준회로와 같은 리이드-래스(lead-less)표준회로가 외부에 형성된 것을 특징으로 하는 소자 모듈.
  5. 제 1항에 있어서, 하나 또는 여러 로우(row)로 하나 이상의 측을 따라 도선 또는 핀을 포함하는 것을 특징으로 하는 소자 모듈.
  6. 제 1항에 있어서, 앤클로싱 장치는 플라스틱 드롭을 포함하는 것을 특징으로 하는 소자 모듈.
  7. 제 1항에 있어서, 앤클로싱 장치는 실리콘 드롬을 포함하는 것을 특징으로 하는 소자 모듈.
  8. 선행항중 어느 한 항에 있어서, 캐리어기판은 하나 이상의 신호층 또는 소자층(1;1'), 접점층(6) 및 공급층(2,3,4,5,6;3')을 구성하며, 절연층이 상이한 층 사이에 배열된 것을 특징으로 하는 소자 모듈.
  9. 제 8항에 있어서, 절연층은 박막 절연층(32a)형태로 배열된 플라스틱적층,유리섬유적층을 포함하는 것을 특징으로하는 소자 모듈.
  10. 제 8항에 있어서, 캐리어 기판은 다수 공급층(1,2,3,4,5,6;1',.... 3....)을 포함하는 것을 특징으로 하는 소자 모듈.
  11. 제 8항에 있어서, 캐리어기판에 배열된 바이어스(12,12';30,31a;97,97')는 매설 또는 블라인드인 것을 특징으로 하는 소자 모듈.
  12. 제 8항에 있어서, 열바이어스(31a)는 회로에서 열감쇠를 위해 배열된 것을 특징으로 하는 소자 모듈.
  13. 제 1항∼제 7항에 있어서, 회로는 접착기술 또는 플립 칩기술에 의해 캐리어기판에 설치되어 접속된 것을 특징으로 하는 소자모듈.
  14. 제 1항∼제 7항중 한항에 있어서, 광학 모듈인 것을 특징으로 하는 소자모듈.
  15. 제 1항∼제 7항중 한 항에 있어서, 하나 이상의 회로는 소자가 배열된 전송회로 (5,510a;510c;71)이고 송신장치를 포함하는 광학블록은 캐리어기판에 더 접속되어 있고 소자 모듈은 송신 모듈(20a;20b;20c;70)을 형성하는 것을 특징으로 하는 소자모듈.
  16. 제 1항∼제7항중 한항에 있어서, 송신장치는 LD또는 LED와 같은 송신 다이오드(511a;511b;511c)를 포함하는 것을 특징으로 하는 소자모듈.
  17. 제 1항-제 7항중 한항에 있어서, 송신장치는 파장 필터와 광학접속수단을 더 포함하는 파장 분할 멀티 플렉서 유닛에 의해 포함되는 것을 특징으로 하는 소자 모듈.
  18. 제 1항∼제 7항중 한항에 있어서, 광학블록은 MT-수단(72)을 포함하는 하나 이상의 송신장치를 구비한 것을 특징으로 하는 소자 모듈.
  19. 제 1항∼제 7항중 한항에 있어서, 다수의 전송장치의 어레이를 포함하고, 각각의 송신장치는 각각의 섬유에 의해 접속된 것을 특징으로 하는 소자모듈.
  20. 제 1항-제 7항중 한 항에 있어서, 분리부분 형태의 광학블록은 캐리어 기판에 직접 설치된 것을 특징으로 하는 소자 모듈.
  21. 제 1항-제 7항중 한 항에 있어서, 하나 이상의 회로는 소자가 배열된 수신회로 (M;510c';81)이고, 수신 장치를 포함하는 광학블록은 캐리어기판에 접속되어서 소자 모듈이 수신 모듈(16a;16b;10c;80)을 형성하는 것을 특징으로 하는 소자 모듈.
  22. 제 21항에 있어서, 수신장치는 PIN다이오드와 같은 수신 다이오드(513a;513b;513c)를 포함하는 것을 특징으로 하는 소자 모듈.
  23. 제 21항에 있어서, 수신장치는 파장필터와 광학접속수단을 포함하는 파장분할멀티플렉서 유닛에 의해 포함된 것을 특징으로 하는 소자 모듈.
  24. 제 21항에 있어서, 광학블록은 MT-수단(82)를 포함하는 하나 이상의 수신 장치를 포함하는 것을 특징으로 하는 소자 모듈.
  25. 제 21항에 있어서, 수신장치의 다수의 (어레이)를 포함하며, 각각의 어레이는 분리섬유에 접속된 것을 특징으로 하는 소자 모듈.
  26. 제 27항에 있어서, 분할부분형의 광학블록이 캐리어기판에 직접 접속된 것을 특징으로 하는 소자 모듈.
  27. 제 15항 또는 제 21항에 있어서, 송수신기 모듈을 포함하는 것을 특징으로 하는 소자 모듈.
  28. 하나 이상의 내부 또는 외부 캐리어기판(500a;500b;500c),송신유닛 및 수신유닛, 광학유닛 및 외부 캐리어기판 연결용 접속수단(508a;508b;508c)을 구비한 송수신 모듈(50a;50b;50c)에 있어서, 송신유닛과 수신 유닛은 캐리어기판(500a;500b;500c)에 앤클로즈되어설치된 송신 모듈(20a;20b;20c)과 수신 모듈(10a;10b;10c)를 포함하며, 광학유닛은 설치가능한 송수신장치를 구비한 것을 특징으로 하는 송수신 모듈.
  29. 제 28항에 있어서, LCC-회로 또는 PAA-회로와 같은 표준회로에 해당하는 형태와 모양 외부적으로 하는 것을 특징으로 하는 송수신 모듈.
  30. 제 28항 또는 제 29항에 있어서, 송신유닛은 청구 15항∼17항중 어느 한 항에 따르는 송신 모듈을 포함하며, 수신유닛은 청구 21항∼23한중 한항을 따르는 수신 모듈을 포함하는 것을 특징으로 하는 송수신 모듈.
  31. 제 28항 또는 제29항에 있어서, 송신유닛은 청구 18항∼20항중 한 항을 따르는 송신 모듈을 포함하고, 수신유닛은 청구 24항∼26항을 따르는 수신 모듈을 포함하는 것을 특징으로 하는 송수신 모듈.
  32. 제 28항에 있어서, 송신 모듈(20a,20b)과 수신 모듈(10a;10b;10c)는 내부 송수신 캐리어기판의 대항측에 배열된 것을 특징으로 하는 송수신 모듈.
  33. 제 28항에 있어서, 송신모듈(20a;20b;20c) 및 수신 모듈(10a;10b;10c)가 외부 송수신 캐리어기판의 대항측에 배열된 것을 특징으로 하는 송수신 모듈.
  34. 제 28항에 있어서, 수신 모듈(10a;10b)은 송신모듈(20a;20b)아래 배열되어 송수신 모듈 및/또는 외부 캐리어기판의 캐리어기판(500a;500b)에 의해 서로 차폐되는 것을 특징으로 하는 송수신 모듈
  35. 제 28항에 있어서, 송신 모듈(20c)과 수신모듈 (10c)이 내부(500c) 또는 외부 송수신 캐리어기판의 동측에 배열된 것을 특징으로 하는 송수신 모듈.
  36. 제 28항에 있어서, 송신 모듈 (20a;20b;20c)와 수신 모듈 (10a;10b;10c)송수신 모듈의 내부 캐리어기판 (500a;500b;500c)에 직접 설치되어 있고, 광학블록의 신호의 파장분할 멀티플렉서 유닛 (WDM)이 송신과 수신 모듈과 직접 접속된 것을 특징으로 하는 송수신 모듈.
  37. 제 28항에 있어서, 송신기와 수신기는 소자 모듈, 즉, 수신 모듈 (10a;10b;10c)과 송신모듈 (20a;20b;20c)을 형성하는 부모듈에 직접 접속된 것을 특징으로 하는 송수신 모듈.
  38. 제 28항에 있어서, 외부 및/또는 내부 인쇄회로기판은 송수신 캐리어 기판및/또는 소자 모듈의 하나 이상의 외부측을 따라 배열된 접속 도선(508a;508b;508c)을 포함하는 것을 특징으로 하는 송수신 모듈.
  39. 제 28항에 있어서, 송신모듈(20a;20b;20c)과 수신 모듈 (17a;17b;17c)에는 보호층 형태 보호장치 (503a;503b;503c)가 제공된 것을 특징으로 하는 송수신 모듈.
  40. 제 39항에 있어서, 보호층은 플라스틱 재료 및 실리콘을 포함하는 것을 특징으로 하는 송수신 모듈.
  41. 제28항-제40항중 한항에 있어서, 송신기와 수신기를 형성하는 송신 다이오드 (들) (511a;511b;511c)와 수신 다이오드 (들) (513a;513b;513c)는 송신기와 수신기 소자 모듈에 직접 설치된 TO-18-캡슐이 표준엔캡슐된 다이오드를 포함하는 것을 특징으로 하는 송수신 모듈.
  42. 제1항-제14항중 한항에 있어서, 회로(98)는 발진지(91)를 포함하며, 어떤 소자는 필라멘트 및 기판패턴을 접착하므로서, 포함된 캐리어기판(93) 또는 토론에 집적되고/또는 끼워진 인덕터(93)를 포함하는 것을 특징으로 하는 송수신 모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950700054A 1992-07-06 1993-06-02 소자 모듈(component module) KR950702790A (ko)

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AU4681697A (en) 1998-02-05
FI950058A (fi) 1995-01-05
NO950038L (no) 1995-01-05
CN1081297A (zh) 1994-01-26
BR9306685A (pt) 1998-12-08
JPH08501657A (ja) 1996-02-20
SE9202077D0 (sv) 1992-07-06
EP0649590A1 (en) 1995-04-26
MXPA93003941A (es) 2010-11-12
AU4517193A (en) 1994-01-31
WO1994001987A1 (en) 1994-01-20
NO950038D0 (no) 1995-01-05
SE9202077L (sv) 1994-01-07
CN1041479C (zh) 1998-12-30

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