AU2004292495A1 - Silver solder or brazing alloys and their use - Google Patents
Silver solder or brazing alloys and their use Download PDFInfo
- Publication number
- AU2004292495A1 AU2004292495A1 AU2004292495A AU2004292495A AU2004292495A1 AU 2004292495 A1 AU2004292495 A1 AU 2004292495A1 AU 2004292495 A AU2004292495 A AU 2004292495A AU 2004292495 A AU2004292495 A AU 2004292495A AU 2004292495 A1 AU2004292495 A1 AU 2004292495A1
- Authority
- AU
- Australia
- Prior art keywords
- solder
- silver
- alloy
- composition
- colour
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 134
- 229910045601 alloy Inorganic materials 0.000 title claims description 49
- 239000000956 alloy Substances 0.000 title claims description 49
- 238000005219 brazing Methods 0.000 title claims description 43
- 229910052732 germanium Inorganic materials 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 42
- 229910052709 silver Inorganic materials 0.000 claims description 38
- 229910052718 tin Inorganic materials 0.000 claims description 37
- 229910052710 silicon Inorganic materials 0.000 claims description 32
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 22
- 229910052725 zinc Inorganic materials 0.000 claims description 21
- 229910052796 boron Inorganic materials 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910017518 Cu Zn Inorganic materials 0.000 claims description 3
- 229910017752 Cu-Zn Inorganic materials 0.000 claims description 3
- 229910017943 Cu—Zn Inorganic materials 0.000 claims description 3
- 239000010944 silver (metal) Substances 0.000 claims 6
- 239000010934 sterling silver Substances 0.000 claims 1
- 229910000898 sterling silver Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 79
- 238000002844 melting Methods 0.000 description 77
- 230000008018 melting Effects 0.000 description 76
- 239000010949 copper Substances 0.000 description 42
- 230000004907 flux Effects 0.000 description 39
- 239000011701 zinc Substances 0.000 description 36
- 239000000463 material Substances 0.000 description 35
- 229910001118 argentium sterling silver Inorganic materials 0.000 description 23
- 229910000562 Gilding metal Inorganic materials 0.000 description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 16
- 239000006185 dispersion Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 7
- 238000005336 cracking Methods 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000007792 addition Methods 0.000 description 5
- 238000000137 annealing Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- 235000019271 petrolatum Nutrition 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910017821 Cu—Ge Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 239000004264 Petrolatum Substances 0.000 description 1
- 244000090125 Solidago odora Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NZWXMOTXTNDNLK-UHFFFAOYSA-N [Cu].[Zn].[Ag] Chemical compound [Cu].[Zn].[Ag] NZWXMOTXTNDNLK-UHFFFAOYSA-N 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- -1 e.g. Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010947 jewellery metal Substances 0.000 description 1
- 239000000693 micelle Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 229940066842 petrolatum Drugs 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005494 tarnishing Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 229940099259 vaseline Drugs 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0326927.1 | 2003-11-19 | ||
| GB0326927A GB2408269B (en) | 2003-11-19 | 2003-11-19 | Silver solder or brazing alloys and their use |
| PCT/GB2004/050027 WO2005051593A1 (en) | 2003-11-19 | 2004-11-18 | Silver solder or brazing alloys and their use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2004292495A1 true AU2004292495A1 (en) | 2005-06-09 |
Family
ID=29764073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2004292495A Abandoned AU2004292495A1 (en) | 2003-11-19 | 2004-11-18 | Silver solder or brazing alloys and their use |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070144624A1 (zh) |
| EP (1) | EP1713613A1 (zh) |
| CN (1) | CN1882409A (zh) |
| AU (1) | AU2004292495A1 (zh) |
| CA (1) | CA2544861A1 (zh) |
| EA (1) | EA200600981A1 (zh) |
| GB (1) | GB2408269B (zh) |
| WO (1) | WO2005051593A1 (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2428046A (en) * | 2005-07-07 | 2007-01-17 | Middlesex Silver Co Ltd | A silver-copper-zinc-germanium brazing alloy |
| KR100950686B1 (ko) * | 2009-09-08 | 2010-03-31 | 주식회사 한국번디 | 용가재 합금조성물 |
| JP5623783B2 (ja) * | 2010-05-13 | 2014-11-12 | 日本発條株式会社 | 大気接合用ろう材、接合体、および、集電材料 |
| JP5645307B2 (ja) * | 2010-12-09 | 2014-12-24 | 日本発條株式会社 | 大気接合用ろう材、接合体、および、集電材料 |
| CN102319964B (zh) * | 2011-08-06 | 2013-06-05 | 郑州机械研究所 | 一种钎焊陶瓷用活性芯银钎料及其制备方法 |
| DE102012100920A1 (de) * | 2012-02-03 | 2013-08-08 | Horwitz-Hamburg GmbH | Silberlegierung, insbesondere zur Herstellung von Schmuck |
| ITMI20120331A1 (it) * | 2012-03-02 | 2013-09-03 | Legor Group S P A | Silver-based alloy powder for manufacturing of 3-dimensional metal objects |
| RU2526023C1 (ru) * | 2013-10-21 | 2014-08-20 | Юлия Алексеевна Щепочкина | Сплав на основе серебра |
| CN105397334A (zh) * | 2015-12-16 | 2016-03-16 | 郑州机械研究所 | 一种真空环境下使用的银基钎料 |
| CN111482734B (zh) * | 2020-04-21 | 2021-06-22 | 浙江力强科技有限公司 | 铜镍银钎焊浆料及其制备方法 |
| CN111690837A (zh) * | 2020-07-10 | 2020-09-22 | 深圳市瑜悦珠宝有限公司 | 一种银合金及其制备方法 |
| CN114473292A (zh) * | 2021-12-30 | 2022-05-13 | 郑州机械研究所有限公司 | 一种足银首饰焊接用低银钎料及其制备方法 |
| CN114193026A (zh) * | 2021-12-30 | 2022-03-18 | 郑州机械研究所有限公司 | 一种足银首饰焊接用高银钎料及其制备方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH598354A5 (zh) * | 1974-06-12 | 1978-04-28 | Castolin Sa | |
| DE2830759C2 (de) * | 1978-07-13 | 1980-05-22 | Fa. Dr. Th. Wieland, 7530 Pforzheim | Legierungspulver zur Herstellung von Dental am algamen |
| US4242134A (en) * | 1979-06-25 | 1980-12-30 | Gte Products Corporation | Cadmium-free silver based brazing alloy |
| US4475959A (en) * | 1983-07-13 | 1984-10-09 | Gte Products Corporation | Non-aqueous brazing alloy paste |
| JPS6134148A (ja) * | 1984-07-25 | 1986-02-18 | Tanaka Kikinzoku Kogyo Kk | すり接点材料 |
| EP0267318A3 (de) * | 1986-11-13 | 1989-01-11 | C. HAFNER GmbH & Co. | Legierung für Schmuckzwecke |
| US5120374A (en) * | 1990-05-11 | 1992-06-09 | The Morgan Crucible Company Plc | Gel for brazing filler metal paste |
| JP3064042B2 (ja) * | 1991-05-10 | 2000-07-12 | シチズン時計株式会社 | 銀ロウ材 |
| WO1995014112A1 (en) * | 1993-11-15 | 1995-05-26 | Apecs Investment Castings Pty. Ltd. | Silver alloy compositions |
| GB2283933B (en) * | 1993-11-18 | 1996-04-24 | Univ Middlesex Serv Ltd | A method of joining materials together by a diffusion process using silver/germanium alloys |
| US5443658A (en) * | 1994-06-08 | 1995-08-22 | Praxair S.T. Technology, Inc. | Braze filler metal alloy paste |
| US6168071B1 (en) * | 1994-11-17 | 2001-01-02 | Peter Gamon Johns | Method for joining materials together by a diffusion process using silver/germanium alloys and a silver/germanium alloy for use in the method |
| JPH1029087A (ja) * | 1996-07-12 | 1998-02-03 | Tanaka Kikinzoku Kogyo Kk | 白金装飾品用低融点ろう材 |
| DE19940115A1 (de) * | 1999-08-24 | 2001-03-01 | Degussa | Cadmiumfreie Hartlotlegierungen |
-
2003
- 2003-11-19 GB GB0326927A patent/GB2408269B/en not_active Expired - Fee Related
-
2004
- 2004-11-18 US US10/579,867 patent/US20070144624A1/en not_active Abandoned
- 2004-11-18 EA EA200600981A patent/EA200600981A1/ru unknown
- 2004-11-18 CN CNA2004800342272A patent/CN1882409A/zh active Pending
- 2004-11-18 WO PCT/GB2004/050027 patent/WO2005051593A1/en active Application Filing
- 2004-11-18 CA CA002544861A patent/CA2544861A1/en not_active Abandoned
- 2004-11-18 EP EP04819277A patent/EP1713613A1/en not_active Withdrawn
- 2004-11-18 AU AU2004292495A patent/AU2004292495A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| GB2408269A (en) | 2005-05-25 |
| WO2005051593A1 (en) | 2005-06-09 |
| GB2408269B (en) | 2006-02-22 |
| CA2544861A1 (en) | 2005-06-09 |
| EP1713613A1 (en) | 2006-10-25 |
| EA200600981A1 (ru) | 2006-10-27 |
| GB0326927D0 (en) | 2003-12-24 |
| CN1882409A (zh) | 2006-12-20 |
| US20070144624A1 (en) | 2007-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4 | Application lapsed section 142(2)(d) - no continuation fee paid for the application |