AU2003249276A1 - Assembly for connecting a test device to an object to be tested - Google Patents

Assembly for connecting a test device to an object to be tested

Info

Publication number
AU2003249276A1
AU2003249276A1 AU2003249276A AU2003249276A AU2003249276A1 AU 2003249276 A1 AU2003249276 A1 AU 2003249276A1 AU 2003249276 A AU2003249276 A AU 2003249276A AU 2003249276 A AU2003249276 A AU 2003249276A AU 2003249276 A1 AU2003249276 A1 AU 2003249276A1
Authority
AU
Australia
Prior art keywords
tested
assembly
test device
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003249276A
Other languages
English (en)
Other versions
AU2003249276A8 (en
Inventor
Jovan Jovanovic
Donald P. Ii Richmond
Frank O. Uher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/197,104 external-priority patent/US6867608B2/en
Priority claimed from US10/197,133 external-priority patent/US6853209B1/en
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of AU2003249276A1 publication Critical patent/AU2003249276A1/en
Publication of AU2003249276A8 publication Critical patent/AU2003249276A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AU2003249276A 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested Abandoned AU2003249276A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/197,104 US6867608B2 (en) 2002-07-16 2002-07-16 Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
US10/197,133 2002-07-16
US10/197,133 US6853209B1 (en) 2002-07-16 2002-07-16 Contactor assembly for testing electrical circuits
US10/197,104 2002-07-16
PCT/US2003/022125 WO2004008163A2 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested

Publications (2)

Publication Number Publication Date
AU2003249276A1 true AU2003249276A1 (en) 2004-02-02
AU2003249276A8 AU2003249276A8 (en) 2004-02-02

Family

ID=30117843

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003249276A Abandoned AU2003249276A1 (en) 2002-07-16 2003-07-15 Assembly for connecting a test device to an object to be tested

Country Status (6)

Country Link
EP (1) EP1523685A2 (https=)
JP (1) JP2005533254A (https=)
KR (1) KR20050029215A (https=)
CN (1) CN100523826C (https=)
AU (1) AU2003249276A1 (https=)
WO (1) WO2004008163A2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956472B1 (ko) 2005-04-27 2010-05-07 에어 테스트 시스템즈 전자 장치들을 테스트하기 위한 장치
CN101051067B (zh) * 2006-04-03 2010-08-11 航天科工防御技术研究试验中心 电连接器综合检测控制装置设计方法
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
US7557594B2 (en) * 2007-08-14 2009-07-07 Electro Scientific Industries, Inc. Automated contact alignment tool
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
CN101545926B (zh) * 2008-03-25 2011-05-11 旺矽科技股份有限公司 探针测试装置
DE102009012021B4 (de) * 2009-03-10 2011-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung zur elektrischen Vermessung einer einseitig an einer Messseite elektrisch kontaktierbaren Messstruktur
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
TWI440412B (zh) * 2011-12-28 2014-06-01 巨擘科技股份有限公司 超薄多層基板之封裝方法
CN103808979A (zh) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 用于承载待测试电子装置的治具
CN103808969A (zh) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 用于承载待测试电子装置的治具
CN105548859A (zh) * 2015-12-09 2016-05-04 上海精密计量测试研究所 用于环境测试的测试设备及方法
TWI729056B (zh) 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
CN106200239B (zh) * 2016-09-14 2019-03-15 海信集团有限公司 光机照明系统
US10782316B2 (en) * 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
EP4632390A3 (en) 2017-03-03 2026-01-14 AEHR Test Systems Electronics tester
CN120254561B (zh) 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
US11774486B2 (en) 2021-06-30 2023-10-03 Delta Design Inc. Temperature control system including contactor assembly
JP2026501645A (ja) 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
JPH0763788A (ja) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6028437A (en) * 1997-05-19 2000-02-22 Si Diamond Technology, Inc. Probe head assembly
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
JP2001013208A (ja) * 1999-06-30 2001-01-19 Mitsubishi Electric Corp 半導体テスト治工具

Also Published As

Publication number Publication date
CN1668929A (zh) 2005-09-14
CN100523826C (zh) 2009-08-05
KR20050029215A (ko) 2005-03-24
WO2004008163A3 (en) 2004-06-10
WO2004008163A2 (en) 2004-01-22
EP1523685A2 (en) 2005-04-20
AU2003249276A8 (en) 2004-02-02
JP2005533254A (ja) 2005-11-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase