AU2003205307B2 - Apparatus incorporating small-feature-size and large-feature-size components and method for making same - Google Patents
Apparatus incorporating small-feature-size and large-feature-size components and method for making same Download PDFInfo
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- AU2003205307B2 AU2003205307B2 AU2003205307A AU2003205307A AU2003205307B2 AU 2003205307 B2 AU2003205307 B2 AU 2003205307B2 AU 2003205307 A AU2003205307 A AU 2003205307A AU 2003205307 A AU2003205307 A AU 2003205307A AU 2003205307 B2 AU2003205307 B2 AU 2003205307B2
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- Prior art keywords
- integrated circuit
- substrate
- conductive medium
- antenna
- vias
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- Ceased
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Classifications
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- B82—NANOTECHNOLOGY
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5619202A | 2002-01-23 | 2002-01-23 | |
US10/056,192 | 2002-01-23 | ||
PCT/US2003/002115 WO2003063211A1 (en) | 2002-01-23 | 2003-01-23 | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003205307A1 AU2003205307A1 (en) | 2003-09-18 |
AU2003205307B2 true AU2003205307B2 (en) | 2009-03-26 |
Family
ID=27609271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003205307A Ceased AU2003205307B2 (en) | 2002-01-23 | 2003-01-23 | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1468443A1 (zh) |
JP (1) | JP2006504251A (zh) |
KR (1) | KR20040105705A (zh) |
CN (1) | CN1606796A (zh) |
AU (1) | AU2003205307B2 (zh) |
CA (1) | CA2474054A1 (zh) |
WO (1) | WO2003063211A1 (zh) |
Families Citing this family (34)
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US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
US7230580B1 (en) * | 2003-08-29 | 2007-06-12 | National Semiconductor Corporation | Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same |
KR101185613B1 (ko) | 2004-04-27 | 2012-09-24 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 소프트 리소그래피용 복합 패터닝 장치 |
US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
JP2008502151A (ja) | 2004-06-04 | 2008-01-24 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 印刷可能半導体素子を製造して組み立てるための方法及びデバイス |
US7943491B2 (en) | 2004-06-04 | 2011-05-17 | The Board Of Trustees Of The University Of Illinois | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7576656B2 (en) | 2005-09-15 | 2009-08-18 | Alien Technology Corporation | Apparatuses and methods for high speed bonding |
CN105826345B (zh) | 2007-01-17 | 2018-07-31 | 伊利诺伊大学评议会 | 通过基于印刷的组装制造的光学系统 |
TWI500364B (zh) | 2008-03-05 | 2015-09-11 | 美國伊利諾大學理事會 | 可延展且可折疊的電子裝置 |
US8946683B2 (en) | 2008-06-16 | 2015-02-03 | The Board Of Trustees Of The University Of Illinois | Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
JP5646492B2 (ja) | 2008-10-07 | 2014-12-24 | エムシー10 インコーポレイテッドMc10,Inc. | 伸縮可能な集積回路およびセンサアレイを有する装置 |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
WO2010132552A1 (en) | 2009-05-12 | 2010-11-18 | The Board Of Trustees Of The University Of Illinois | Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays |
US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
WO2011084450A1 (en) | 2009-12-16 | 2011-07-14 | The Board Of Trustees Of The University Of Illinois | Electrophysiology in-vivo using conformal electronics |
US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
CN102892356B (zh) | 2010-03-17 | 2016-01-13 | 伊利诺伊大学评议会 | 基于生物可吸收基质的可植入生物医学装置 |
WO2012097163A1 (en) | 2011-01-14 | 2012-07-19 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
WO2012167096A2 (en) | 2011-06-03 | 2012-12-06 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
JP6231489B2 (ja) | 2011-12-01 | 2017-11-15 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | プログラム可能な変化を被るように設計された遷移デバイス |
EP2830492B1 (en) | 2012-03-30 | 2021-05-19 | The Board of Trustees of the University of Illinois | Appendage mountable electronic devices conformable to surfaces and method of making the same |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
CN104224167B (zh) * | 2014-09-21 | 2016-06-01 | 北京师范大学 | 一次性脑状态监测柔性贴片电极 |
MX2017015587A (es) | 2015-06-01 | 2018-08-23 | Univ Illinois | Metodo alternativo para sensor uv. |
WO2016196675A1 (en) | 2015-06-01 | 2016-12-08 | The Board Of Trustees Of The University Of Illinois | Miniaturized electronic systems with wireless power and near-field communication capabilities |
US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
Citations (3)
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US5545291A (en) * | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
JPH11353439A (ja) * | 1998-06-04 | 1999-12-24 | Dainippon Printing Co Ltd | 非接触型icカードとその製造方法、非接触型icカード用基体 |
JP2001175837A (ja) * | 1999-12-22 | 2001-06-29 | Toppan Printing Co Ltd | Icカード |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
-
2003
- 2003-01-23 AU AU2003205307A patent/AU2003205307B2/en not_active Ceased
- 2003-01-23 CN CNA038017814A patent/CN1606796A/zh active Pending
- 2003-01-23 CA CA002474054A patent/CA2474054A1/en not_active Abandoned
- 2003-01-23 EP EP03703985A patent/EP1468443A1/en not_active Withdrawn
- 2003-01-23 WO PCT/US2003/002115 patent/WO2003063211A1/en active Search and Examination
- 2003-01-23 JP JP2003562978A patent/JP2006504251A/ja active Pending
- 2003-01-23 KR KR10-2004-7011487A patent/KR20040105705A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5545291A (en) * | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
JPH11353439A (ja) * | 1998-06-04 | 1999-12-24 | Dainippon Printing Co Ltd | 非接触型icカードとその製造方法、非接触型icカード用基体 |
JP2001175837A (ja) * | 1999-12-22 | 2001-06-29 | Toppan Printing Co Ltd | Icカード |
Also Published As
Publication number | Publication date |
---|---|
CA2474054A1 (en) | 2003-07-31 |
EP1468443A1 (en) | 2004-10-20 |
KR20040105705A (ko) | 2004-12-16 |
JP2006504251A (ja) | 2006-02-02 |
CN1606796A (zh) | 2005-04-13 |
WO2003063211A1 (en) | 2003-07-31 |
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