AU2002366434A1 - Automatic multi-channel etching system - Google Patents

Automatic multi-channel etching system

Info

Publication number
AU2002366434A1
AU2002366434A1 AU2002366434A AU2002366434A AU2002366434A1 AU 2002366434 A1 AU2002366434 A1 AU 2002366434A1 AU 2002366434 A AU2002366434 A AU 2002366434A AU 2002366434 A AU2002366434 A AU 2002366434A AU 2002366434 A1 AU2002366434 A1 AU 2002366434A1
Authority
AU
Australia
Prior art keywords
etching system
automatic multi
channel etching
channel
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002366434A
Other languages
English (en)
Inventor
Wolfgang Coenen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2002366434A1 publication Critical patent/AU2002366434A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
AU2002366434A 2001-12-17 2002-12-12 Automatic multi-channel etching system Abandoned AU2002366434A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2001162191 DE10162191A1 (de) 2001-12-17 2001-12-17 Automatisches Vielkanalätzsystem
DE10162191.4 2001-12-17
PCT/EP2002/014144 WO2003052796A2 (de) 2001-12-17 2002-12-12 Automatisches vielkanal-ätzsystem

Publications (1)

Publication Number Publication Date
AU2002366434A1 true AU2002366434A1 (en) 2003-06-30

Family

ID=7709682

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002366434A Abandoned AU2002366434A1 (en) 2001-12-17 2002-12-12 Automatic multi-channel etching system

Country Status (3)

Country Link
AU (1) AU2002366434A1 (de)
DE (1) DE10162191A1 (de)
WO (1) WO2003052796A2 (de)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US13355A (en) * 1855-07-31 Machine for compressing ptjddlers balls and other masses op iron
US5057184A (en) * 1990-04-06 1991-10-15 International Business Machines Corporation Laser etching of materials in liquids
US6239038B1 (en) * 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
US6149828A (en) * 1997-05-05 2000-11-21 Micron Technology, Inc. Supercritical etching compositions and method of using same
KR100252221B1 (ko) * 1997-06-25 2000-04-15 윤종용 반도체장치 제조용 습식 식각장치 및 습식 식각장치내의 식각액 순환방법
US6039835A (en) * 1997-09-15 2000-03-21 Motorola, Inc. Etching apparatus and method of etching a substrate
DE19815039A1 (de) * 1998-03-02 1999-09-16 Mostafa Sabet Verfahren zum Wechseln eines in einem Behandlungsbecken enthaltenen Behandlungsmediums und Anlage zur Ausführung des Verfahrens
JPH11354478A (ja) * 1998-05-29 1999-12-24 Lsi Logic Corp マイクロバブル付着防止装置
US6124214A (en) * 1998-08-27 2000-09-26 Micron Technology, Inc. Method and apparatus for ultrasonic wet etching of silicon
DE19859466C2 (de) * 1998-12-22 2002-04-25 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19934298A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19911084C2 (de) * 1999-03-12 2002-01-31 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
TW583734B (en) * 1999-04-28 2004-04-11 Winbond Electronics Corp Wafer cleaning equipment with function of preventing gas supply pipeline wall from being obstructed
TW501196B (en) * 1999-08-05 2002-09-01 Tokyo Electron Ltd Cleaning device, cleaning system, treating device and cleaning method
DE19941042A1 (de) * 1999-08-28 2001-03-15 Bosch Gmbh Robert Verfahren zur Herstellung oberflächenmikromechanischer Strukturen durch Ätzung mit einem dampfförmigen, flußsäurehaltigen Ätzmedium
EP1149411A1 (de) * 1999-11-26 2001-10-31 Koninklijke Philips Electronics N.V. Verfahren und vorrichtung zum nassätzen von halbleitersubstraten
DE19959558A1 (de) * 1999-12-10 2001-06-21 Messer Griesheim Gmbh Reinigung von Materialoberflächen mit Gasen

Also Published As

Publication number Publication date
WO2003052796A3 (de) 2004-03-04
DE10162191A1 (de) 2003-06-18
WO2003052796A2 (de) 2003-06-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase