WO2003052796A3 - Automatisches vielkanal-ätzsystem - Google Patents

Automatisches vielkanal-ätzsystem Download PDF

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Publication number
WO2003052796A3
WO2003052796A3 PCT/EP2002/014144 EP0214144W WO03052796A3 WO 2003052796 A3 WO2003052796 A3 WO 2003052796A3 EP 0214144 W EP0214144 W EP 0214144W WO 03052796 A3 WO03052796 A3 WO 03052796A3
Authority
WO
WIPO (PCT)
Prior art keywords
etching system
automatic multi
channel etching
etching
involves
Prior art date
Application number
PCT/EP2002/014144
Other languages
English (en)
French (fr)
Other versions
WO2003052796A2 (de
Inventor
Wolfgang Coenen
Original Assignee
Wolfgang Coenen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfgang Coenen filed Critical Wolfgang Coenen
Priority to AU2002366434A priority Critical patent/AU2002366434A1/en
Publication of WO2003052796A2 publication Critical patent/WO2003052796A2/de
Publication of WO2003052796A3 publication Critical patent/WO2003052796A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Abstract

Die vorliegende Erfindung betrifft eine Vorrichtung and ein Verfahren zur Ätzung von Präzisionsoberflächen und hat die Aufgabe, eine Vorrichtung und ein Verfahren anzugeben, wodurch eine Produktentwicklung und eine Produktionsprozessentwicklung erleichtert wird. Diese Aufgabe wird erfindungsgemäss dadurch gelöst, dass die Ätzvorrichtung aus einer Reaktionskammer zur Aufnahme und Bearbeitung eines einzelnen Gegenstandes besteht.
PCT/EP2002/014144 2001-12-17 2002-12-12 Automatisches vielkanal-ätzsystem WO2003052796A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002366434A AU2002366434A1 (en) 2001-12-17 2002-12-12 Automatic multi-channel etching system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2001162191 DE10162191A1 (de) 2001-12-17 2001-12-17 Automatisches Vielkanalätzsystem
DE10162191.4 2001-12-17

Publications (2)

Publication Number Publication Date
WO2003052796A2 WO2003052796A2 (de) 2003-06-26
WO2003052796A3 true WO2003052796A3 (de) 2004-03-04

Family

ID=7709682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/014144 WO2003052796A2 (de) 2001-12-17 2002-12-12 Automatisches vielkanal-ätzsystem

Country Status (3)

Country Link
AU (1) AU2002366434A1 (de)
DE (1) DE10162191A1 (de)
WO (1) WO2003052796A2 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001216A (en) * 1997-06-25 1999-12-14 Samsung Electronics Co., Ltd. Apparatus and methods for rerecirculating etching solution during semiconductor wafer processing
US6224713B1 (en) * 1998-08-27 2001-05-01 Micron Technology, Inc. Method and apparatus for ultrasonic wet etching of silicon
WO2001039262A1 (en) * 1999-11-26 2001-05-31 Koninklijke Philips Electronics N.V. Method and apparatus for wet-etching semiconductor wafers
US6254720B1 (en) * 1999-04-28 2001-07-03 Winbond Electronics Corp. Wafer-processing apparatus
US6276379B1 (en) * 1998-05-29 2001-08-21 Lsi Logic Corporation Anti-microbubble deposition apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US13355A (en) * 1855-07-31 Machine for compressing ptjddlers balls and other masses op iron
US5057184A (en) * 1990-04-06 1991-10-15 International Business Machines Corporation Laser etching of materials in liquids
US6239038B1 (en) * 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
US6149828A (en) * 1997-05-05 2000-11-21 Micron Technology, Inc. Supercritical etching compositions and method of using same
US6039835A (en) * 1997-09-15 2000-03-21 Motorola, Inc. Etching apparatus and method of etching a substrate
DE19815039A1 (de) * 1998-03-02 1999-09-16 Mostafa Sabet Verfahren zum Wechseln eines in einem Behandlungsbecken enthaltenen Behandlungsmediums und Anlage zur Ausführung des Verfahrens
DE19934298A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19859466C2 (de) * 1998-12-22 2002-04-25 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19911084C2 (de) * 1999-03-12 2002-01-31 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
DE10038219A1 (de) * 1999-08-05 2001-05-03 Tokyo Electron Ltd Reinigungseinrichtung, Reinigungssystem, Behandlungseinrichtung und Behandlungsverfahren
DE19941042A1 (de) * 1999-08-28 2001-03-15 Bosch Gmbh Robert Verfahren zur Herstellung oberflächenmikromechanischer Strukturen durch Ätzung mit einem dampfförmigen, flußsäurehaltigen Ätzmedium
DE19959558A1 (de) * 1999-12-10 2001-06-21 Messer Griesheim Gmbh Reinigung von Materialoberflächen mit Gasen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001216A (en) * 1997-06-25 1999-12-14 Samsung Electronics Co., Ltd. Apparatus and methods for rerecirculating etching solution during semiconductor wafer processing
US6276379B1 (en) * 1998-05-29 2001-08-21 Lsi Logic Corporation Anti-microbubble deposition apparatus
US6224713B1 (en) * 1998-08-27 2001-05-01 Micron Technology, Inc. Method and apparatus for ultrasonic wet etching of silicon
US6254720B1 (en) * 1999-04-28 2001-07-03 Winbond Electronics Corp. Wafer-processing apparatus
WO2001039262A1 (en) * 1999-11-26 2001-05-31 Koninklijke Philips Electronics N.V. Method and apparatus for wet-etching semiconductor wafers

Also Published As

Publication number Publication date
DE10162191A1 (de) 2003-06-18
AU2002366434A1 (en) 2003-06-30
WO2003052796A2 (de) 2003-06-26

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