AU2002306475A1 - Integrated circuit die having an electromagnetic interference shield - Google Patents

Integrated circuit die having an electromagnetic interference shield

Info

Publication number
AU2002306475A1
AU2002306475A1 AU2002306475A AU2002306475A AU2002306475A1 AU 2002306475 A1 AU2002306475 A1 AU 2002306475A1 AU 2002306475 A AU2002306475 A AU 2002306475A AU 2002306475 A AU2002306475 A AU 2002306475A AU 2002306475 A1 AU2002306475 A1 AU 2002306475A1
Authority
AU
Australia
Prior art keywords
integrated circuit
electromagnetic interference
circuit die
interference shield
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002306475A
Other languages
English (en)
Inventor
Guruswami M. Sridharan
Kartik M. Sridharan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ashvattha Semiconductor Inc
Original Assignee
Ashvattha Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ashvattha Semiconductor Inc filed Critical Ashvattha Semiconductor Inc
Publication of AU2002306475A1 publication Critical patent/AU2002306475A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU2002306475A 2001-02-16 2002-02-13 Integrated circuit die having an electromagnetic interference shield Abandoned AU2002306475A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/785,620 US6486534B1 (en) 2001-02-16 2001-02-16 Integrated circuit die having an interference shield
US09/785,620 2001-02-16
PCT/US2002/004193 WO2002067326A2 (en) 2001-02-16 2002-02-13 Integrated circuit die having an electromagnetic interference shield

Publications (1)

Publication Number Publication Date
AU2002306475A1 true AU2002306475A1 (en) 2002-09-04

Family

ID=25136069

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002306475A Abandoned AU2002306475A1 (en) 2001-02-16 2002-02-13 Integrated circuit die having an electromagnetic interference shield

Country Status (5)

Country Link
US (2) US6486534B1 (enExample)
EP (1) EP1393372A2 (enExample)
JP (1) JP2004521496A (enExample)
AU (1) AU2002306475A1 (enExample)
WO (1) WO2002067326A2 (enExample)

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TWI381306B (zh) 2009-04-23 2013-01-01 Htc Corp 可攜式電子裝置及其影像資料通訊方法
US8125058B2 (en) * 2009-06-10 2012-02-28 Medtronic, Inc. Faraday cage for circuitry using substrates
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US8502735B1 (en) * 2009-11-18 2013-08-06 Ball Aerospace & Technologies Corp. Antenna system with integrated circuit package integrated radiators
JP6009139B2 (ja) * 2010-06-22 2016-10-19 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US8619435B2 (en) * 2010-07-06 2013-12-31 Honeywell International Inc. Electromagnetic interference (EMI) diverter
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US8424388B2 (en) 2011-01-28 2013-04-23 Medtronic, Inc. Implantable capacitive pressure sensor apparatus and methods regarding same
TWI499011B (zh) * 2011-02-10 2015-09-01 國立清華大學 封裝結構及其製作方法
US9693492B2 (en) 2011-04-14 2017-06-27 Mitsubishi Electric Corporation High-frequency package
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Also Published As

Publication number Publication date
WO2002067326A3 (en) 2003-12-18
US20030017646A1 (en) 2003-01-23
WO2002067326A2 (en) 2002-08-29
US7151011B2 (en) 2006-12-19
EP1393372A2 (en) 2004-03-03
WO2002067326A9 (en) 2004-04-01
US6486534B1 (en) 2002-11-26
JP2004521496A (ja) 2004-07-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase