AU2002225846A1 - A high-performance fin configuration for air-cooled heat dissipation device - Google Patents

A high-performance fin configuration for air-cooled heat dissipation device

Info

Publication number
AU2002225846A1
AU2002225846A1 AU2002225846A AU2584602A AU2002225846A1 AU 2002225846 A1 AU2002225846 A1 AU 2002225846A1 AU 2002225846 A AU2002225846 A AU 2002225846A AU 2584602 A AU2584602 A AU 2584602A AU 2002225846 A1 AU2002225846 A1 AU 2002225846A1
Authority
AU
Australia
Prior art keywords
air
heat dissipation
dissipation device
cooled heat
fin configuration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002225846A
Inventor
Seri Lee
Lloyd Pollard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2002225846A1 publication Critical patent/AU2002225846A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2002225846A 2000-11-20 2001-10-31 A high-performance fin configuration for air-cooled heat dissipation device Abandoned AU2002225846A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/716,510 US6633484B1 (en) 2000-11-20 2000-11-20 Heat-dissipating devices, systems, and methods with small footprint
US09/716,510 2000-11-20
PCT/US2001/045677 WO2002041395A2 (en) 2000-11-20 2001-10-31 A high-performance fin configuration for air-cooled heat dissipation device

Publications (1)

Publication Number Publication Date
AU2002225846A1 true AU2002225846A1 (en) 2002-05-27

Family

ID=24878282

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002225846A Abandoned AU2002225846A1 (en) 2000-11-20 2001-10-31 A high-performance fin configuration for air-cooled heat dissipation device

Country Status (12)

Country Link
US (2) US6633484B1 (en)
EP (1) EP1344251A2 (en)
JP (2) JP4801313B2 (en)
KR (2) KR100566446B1 (en)
CN (1) CN100373602C (en)
AU (1) AU2002225846A1 (en)
DE (1) DE10196917B4 (en)
GB (1) GB2384911B (en)
HK (1) HK1055509A1 (en)
MY (2) MY138068A (en)
TW (1) TW519742B (en)
WO (1) WO2002041395A2 (en)

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JP4646219B2 (en) * 2005-06-22 2011-03-09 古河電気工業株式会社 heatsink
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US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
US20080066898A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat dissipation device
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TW200934361A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipater and structure thereof
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US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
US8365407B2 (en) * 2009-04-14 2013-02-05 Neng Tyi Precision Industries Co., Ltd. Radiator manufacturing method and aligning-and-moving mechanism thereof
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US9140502B2 (en) 2010-07-08 2015-09-22 Hamilton Sundstrand Corporation Active structures for heat exchanger
US8295046B2 (en) 2010-07-19 2012-10-23 Hamilton Sundstrand Corporation Non-circular radial heat sink
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US9137925B2 (en) * 2013-05-08 2015-09-15 Hamilton Sundstrand Corporation Heat sink for contactor in power distribution assembly
JP6372845B2 (en) * 2014-01-16 2018-08-15 国立大学法人 鹿児島大学 heatsink
US9581322B2 (en) * 2014-09-30 2017-02-28 Aeonovalite Technologies, Inc. Heat-sink for high bay LED device, high bay LED device and methods of use thereof
US10794637B2 (en) * 2016-10-03 2020-10-06 Ge Aviation Systems Llc Circular heatsink
TWD210771S (en) * 2020-04-09 2021-04-01 宏碁股份有限公司 Heat-dissipation fin
TWM609965U (en) * 2020-12-02 2021-04-01 訊凱國際股份有限公司 Heat dissipation fin and heat dissipator
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Also Published As

Publication number Publication date
JP2004523883A (en) 2004-08-05
CN1708849A (en) 2005-12-14
GB2384911B (en) 2005-03-16
WO2002041395A2 (en) 2002-05-23
KR20040014416A (en) 2004-02-14
KR100566447B1 (en) 2006-03-31
US20020060902A1 (en) 2002-05-23
HK1055509A1 (en) 2004-01-09
DE10196917T5 (en) 2004-04-22
KR100566446B1 (en) 2006-03-31
TW519742B (en) 2003-02-01
WO2002041395A3 (en) 2002-08-22
JP4801313B2 (en) 2011-10-26
MY138068A (en) 2009-04-30
CN100373602C (en) 2008-03-05
EP1344251A2 (en) 2003-09-17
DE10196917B4 (en) 2009-11-05
MY127105A (en) 2006-11-30
US6535385B2 (en) 2003-03-18
JP2004523884A (en) 2004-08-05
GB0308872D0 (en) 2003-05-21
KR20040014415A (en) 2004-02-14
US6633484B1 (en) 2003-10-14
GB2384911A (en) 2003-08-06
JP4170756B2 (en) 2008-10-22

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