EP1344251A2 - A high-performance fin configuration for air-cooled heat dissipation device - Google Patents

A high-performance fin configuration for air-cooled heat dissipation device

Info

Publication number
EP1344251A2
EP1344251A2 EP01995316A EP01995316A EP1344251A2 EP 1344251 A2 EP1344251 A2 EP 1344251A2 EP 01995316 A EP01995316 A EP 01995316A EP 01995316 A EP01995316 A EP 01995316A EP 1344251 A2 EP1344251 A2 EP 1344251A2
Authority
EP
European Patent Office
Prior art keywords
conductive ring
integrated circuit
core
surface area
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01995316A
Other languages
German (de)
French (fr)
Inventor
Seri Lee
Lloyd Pollard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of EP1344251A2 publication Critical patent/EP1344251A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates generally to a heat dissipation system and method for an integrated circuit assembly, and more particularly to a system and method of dissipating heat from an integrated circuit device.
  • heat sinks typically consist of a flat base plate, which is mounted on to the integrated circuit device on one side.
  • the heat sinks further include an array of fins running perpendicular to the flat base plate on the other side.
  • the integrated circuit devices (which are the heat sources) have a significantly smaller footprint size than the flat base plate of the heat sink.
  • the flat base plate of the heat sink has a large footprint, that is requires more motherboard real estate than the integrated circuit device in contact there with.
  • the larger size of the base plate causes the outermost part of the base plate that is not directly in contact with the integrated circuit device to have a significantly lower temperature than the part of the base plate that is directly in contact with the integrated circuit device.
  • the base plate of prior art heat sink designs is at the same level as the integrated circuit device to which it is attached. Consequently, the flat base plate configuration of the heat sink generally ends up consuming more motherboard real estate than the integrated circuit device on which it is mounted.
  • the larger footprint size of the base plate prevents other motherboard components, such as low-cost capacitors, from encroaching around or on the microprocessor.
  • the large amounts of heat produced by many of such integrated circuits, and the increasing demand for motherboard real estate need to be taken into consideration when designing the integrated circuit mounting and packaging devices.
  • Figure 1 is an isometric view of a prior art heat sink attached to a i o microprocessor on an assembled motherboard.
  • Figure 2 is an isometric view of one embodiment of an enhanced heat dissipation device according to the present invention.
  • Figure 3 is an isometric view showing the enhanced heat dissipation device of Figure 2 attached to a microprocessor on an assembled motherboard.
  • Figure 4 is a flow diagram of one exemplary method of forming the heat dissipation device of Figure 2.
  • This document describes, among other things, an enhanced heat dissipation device that allows electronic components to encroach on a microprocessor while
  • Figure 1 shows an isometric view 100 of a prior art heat sink 110 mounted on a microprocessor 120 of an assembled mother board 130. Also, shown in Figure 1 are low-cost capacitors 140 mounted around the heat sink 110 and on the mother board 130.
  • the prior art heat sink 100 has a flat base plate 150 including an array of fins 160 extending perpendicularly away from the flat base plate 150.
  • This configuration of the heat sink 110 dictates the use of the flat base plate 110, with the array of fms 160 for dissipating heat from the microprocessor 120.
  • Increasing the heat dissipation using the prior art heat sink 110 shown in Figure 1, generally requires enlarging the surface area of the flat base plate 150 and/or the array of fins 160. This in turn results in consuming more motherboard real estate.
  • the microprocessor 120 (which is the heat source) have a smaller footprint size than the flat base plate 150 configuration of the heat sink 110 shown in Figure 1.
  • a larger footprint size of the flat base plate 150 can cause the outermost part of the flat base plate 150 (the portion that is not directly in contact with the integrated circuit device) to have a significantly lower temperature than the part of the flat base plate 150 that is directly in contact with the integrated circuit device. Consequently, the prior art heat sink 110 with the larger flat base plate 150 is not effective in dissipating heat from the integrated circuit device.
  • the packaged units and integrated circuit device sizes are decreasing, while the amount of heat generated by these components is increasing.
  • the prior art heat sink 110 configuration dictates that the array of fins 160 extend to the edge of the flat base plate 150 to extract heat from the integrated circuit device. Also, the prior art heat sink 110 requires increasing the size of the array of fms 160 to increase the heat dissipation. In order to enlarge the fins 120 laterally, the flat base plate 150 has to increase in size. Enlarging the flat base plate 150 consumes more motherboard real estate. Consuming more motherboard real estate is generally not a viable option in an environment where system packaging densities are increasing with each successive, higher performance, integrated circuit device generation. Also, the prior art heat sink 110 is at the same level as the integrated circuit device on which it is mounted.
  • FIG 2 is an isometric view of one embodiment of the enhanced heat dissipation device 200 according to the present invention. Shown in Figure 2 is the enhanced heat dissipation device 200 including a thermally conductive core 210, and a first conductive ring 220. Also, shown in Figure 2 is the thermally conductive core 210 having upper and lower outer surface areas 230 and 240. The first conductive ring 220 includes a first array of radially extending fins 250.
  • the first conductive ring 220 including the first array of radially extending fins 250 is thermally coupled to the upper outer surface area 230 of the thermally conductive core 210.
  • Figure 2 further shows an optional second conductive ring 290 thermally coupled to the lower outer surface area 240 of the thermally conductive core 210.
  • the thermally conductive core has an axis 260.
  • the upper and lower outer surface areas 230 and 240 are parallel to the axis 260.
  • the thermally conductive core 260 further has a base 270.
  • the base 270 is disposed such a way that it is in close proximity to the lower outer surface area 240 and perpendicular to the axis 260.
  • the upper and lower outer surface areas 230 and 240 can be concentric to the axis 260.
  • the first conductive ring 220 is thermally coupled to the upper outer surface area such that components can be mounted around and in close proximity to the lower outer surface area and below the first conductive ring when the device 200 is mounted on to an integrated circuit device. In some embodiments, the components can encroach on to the integrated circuit device without mechanically interfering with the device 200.
  • the thermally conductive core 210 can be a solid body.
  • the solid body can be cylindrical, conical, square, rectangular, or any other similar shapes that facilitates in mounting on to the integrated circuit device and in attaching the first conductive ring 220 to the upper outer surface area 230.
  • the thermally conductive core 210 can include heat transport mediums such as one or more heat pipes, a liquid, a thermo-siphon, or other such heat transport medium that enhance heat dissipation from the integrated circuit device.
  • the device 200 including the thermally conductive core 210 and the first conductive ring 220, can be made from materials such as aluminum, copper, or any other materials that are capable of dissipating heat away from the integrated circuit device.
  • the first array of radially extending fins 250 can be made of a first plurality of folded fins.
  • the first plurality of folded fins can also be made of alternating deep and shallow folds 280 and 285 from a continuous ribbon such that the alternating deep and shallow folds 280 and 285 wrap around the upper outer surface area 230.
  • the shallow folds have a first depth
  • the deep folds have a second depth
  • the first depth is less than the second depth.
  • the thermally conductive core 210 can have a plurality of slots 287 parallel to the axis 260 and around the upper outer surface area 230.
  • the first plurality of folded fins can be attached to the plurality of slots 287.
  • the first conductive ring 220 has a first outer diameter and the second conductive ring 290 has a second outer diameter.
  • the second outer diameter is less than the first outer diameter.
  • the first conductive ring 220 has a first depth and the second outer ring 290 has a second depth.
  • the first and second outer diameters including the first and second depths are of sufficient size to allow components to be mounted around and in close proximity to the integrated circuit device when the device is mounted on the integrated circuit device.
  • the second conductive ring 290 can have second array of radially extending fins 292.
  • the second array of radially extending fins are thermally coupled to the lower outer surface area 240 of the thermally conductive core 210.
  • the second array can include a second plurality of folded fins.
  • the second plurality of folded fins can be made from a plurality of alternating deep and shallow folds from a continuous ribbon similar to the first plurality of folded fins shown in Figure 2.
  • FIG 3 is an isometric view 300 showing the enhanced heat dissipation device 200 shown in Figure 2, attached to the microprocessor 120 on an assembled motherboard 130.
  • the microprocessor 120 has a front side 340 and a back side 330.
  • the front side 340 is disposed across from the back side 330.
  • the front side 340 is attached to the assembled motherboard 130 having components such as the low-cost capacitors 140 and other such electrical components.
  • first and second conductive rings 220 and 290 including the first and second plurality of folded fins 250 and 292 are of sufficient size so as to allow low-cost capacitors 140 mounted on the assembled board 130 to encroach around the microprocessor 120. It can also be seen the low-cost capacitors 140 are below the first conductive ring 220 and around the second conductive ring 290.
  • the first conductive ring 220 is larger than the second conductive ring 290, thereby increasing the heat dissipation rate without increasing a footprint size of the base 270 of the heat dissipation device 200 any more than the back side 330 of the microprocessor 120.
  • the coinciding footprint sizes of the base 270 of the heat dissipation device 200 and the back side 330 of the microprocessor 120 enables the base 270 and the back side 330 of the microprocessor 120 to have same heat transfer rates. This in turn increases the efficiency of heat transfer between the base 270 and the back side 330 of the microprocessor 120.
  • the thermally conductive core 210 further has a top surface 275 disposed across from the base 270.
  • the top surface 275 is perpendicular to the axis 260 and is in close proximity to the second conductive ring 290.
  • a heat transport medium can be attached to the top surface 275 to introduce a heat transfer medium 297 such as air in a direction shown in Figure 2, to enhance the heat dissipation by the heat dissipation device 200.
  • a heat transport medium 295 such as a heat pipe, or other such medium can be included in the thermally conductive core 210 to further enhance the heat transfer from the heat dissipation device 200.
  • Figure 4 is a flow diagram illustrating generally a method 400 of forming an enhanced heat dissipation device to extract heat from an integrated circuit device mounted on an assembled printed circuit board.
  • Method 400 begins with action 410 of forming a thermally conductive core having upper and lower core surface areas.
  • the next action 420 requires forming a first array of radially extending fins.
  • the next action 430 is to form a first conductive ring having a first diameter from the formed first array of radially extending fins.
  • the next action 440 requires attaching the first conductive ring to the upper core surface area such that the lower core surface area has sufficient space below the first conductive ring to allow components to be mounted in close proximity and around the lower core surface area.
  • forming the first array of radially extending fins further includes forming a first conductive ribbon, and forming a first alternative series of deep and shallow folds from the first conductive ribbon, and further forming a first conductive ring from the formed first alternative series of deep and shallow folds.
  • the method 400 further includes forming a second array of radially extending fins, and forming a second conductive ring having a second diameter from the formed second array. Further, the second conductive ring is attached to the lower core surface area of the thermally conductive core such that the second diameter is sufficient to allow the components to encroach around the integrated circuit device.
  • forming the second array of radially extending fins further includes forming a second conductive ribbon, and forming a second alternative series of deep and shallow folds from the second conductive ribbon, and further forming a second conductive ring from the formed second alternative series of deep and shallow folds. The second diameter of the second conductive ring is less than the first diameter of the first conductive ring.
  • the enhanced heat dissipation device is made of thermally conductive materials such as copper, aluminum, or any other such material capable of extracting heat away from the integrated circuit device.
  • the thermally conductive core can include heat transport mediums such as one or more heat pipes, a liquid, a thermo-siphon, or other similar heat transport medium suitable for enhancing the extraction of heat from the integrated circuit device.
  • the above-described device and method provides, among other things, an enhanced heat dissipation using an array of radially extending fins where possible, to allow electronic components to encroach around an integrated circuit device it is mounted on, while maintaining high performance and cost effectiveness by leveraging currently enabled high volume manufacturing techniques

Abstract

An enhanced heat dissipation system and a method to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper surface area. The thermally conductive core includes the first array and the lower outer surface area are of sufficient size to allow components on a motherboard to encroach on to the integrated circuit device when the heat dissipation device is mounted on to the integrated circuit device.

Description

A HIGH-PERFORMANCE FIN CONFIGURATION FOR AIR-COOLED HEAT DISSIPATION DEVICE
Technical Field This invention relates generally to a heat dissipation system and method for an integrated circuit assembly, and more particularly to a system and method of dissipating heat from an integrated circuit device.
Background Integrated circuit devices, microprocessors and other related computer components are becoming more and more powerful with increasing capabilities, resulting in increasing amounts of heat generated from these components. Packaged units and integrated circuit device sizes of these components are decreasing or remaining the same, but the amount of heat energy given off by these components per unit volume, mass, surface area or any other such metric is increasing. In current packaging techniques, heat sinks typically consist of a flat base plate, which is mounted on to the integrated circuit device on one side. The heat sinks further include an array of fins running perpendicular to the flat base plate on the other side. Generally, the integrated circuit devices (which are the heat sources) have a significantly smaller footprint size than the flat base plate of the heat sink. The flat base plate of the heat sink has a large footprint, that is requires more motherboard real estate than the integrated circuit device in contact there with. The larger size of the base plate causes the outermost part of the base plate that is not directly in contact with the integrated circuit device to have a significantly lower temperature than the part of the base plate that is directly in contact with the integrated circuit device. Furthermore, as computer-related equipment becomes more powerful, more components are being placed inside the equipment and on the motherboard which further requires more motherboard real estate. In addition, the base plate of prior art heat sink designs is at the same level as the integrated circuit device to which it is attached. Consequently, the flat base plate configuration of the heat sink generally ends up consuming more motherboard real estate than the integrated circuit device on which it is mounted. As a result, the larger footprint size of the base plate prevents other motherboard components, such as low-cost capacitors, from encroaching around or on the microprocessor. Thus, the large amounts of heat produced by many of such integrated circuits, and the increasing demand for motherboard real estate need to be taken into consideration when designing the integrated circuit mounting and packaging devices.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for an enhanced heat dissipation 5 device and method that conserve motherboard real estate and allows electronic components to encroach on and around the microprocessor.
Brief Description of the Drawings
Figure 1 is an isometric view of a prior art heat sink attached to a i o microprocessor on an assembled motherboard.
Figure 2 is an isometric view of one embodiment of an enhanced heat dissipation device according to the present invention.
Figure 3 is an isometric view showing the enhanced heat dissipation device of Figure 2 attached to a microprocessor on an assembled motherboard.
15
Figure 4 is a flow diagram of one exemplary method of forming the heat dissipation device of Figure 2.
Detailed Description In the following detailed description of the embodiments, reference is made
20 to the accompanying drawings that illustrate the present invention and its practice. In the drawings, like numerals describe substantially similar components throughout the several views. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may
25 be made without departing from the scope of the present invention. Moreover, it is to be understood that the various embodiments of the invention, although different, are not necessarily mutually exclusive. For example, a particular feature, structure, or characteristic described in one embodiment may be included in other embodiments. The following detailed description is, therefore, not to be
30 taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.
This document describes, among other things, an enhanced heat dissipation device that allows electronic components to encroach on a microprocessor while
35 maintaining high performance and cost effectiveness by leveraging currently enabled high-volume manufacturing techniques.
Figure 1 shows an isometric view 100 of a prior art heat sink 110 mounted on a microprocessor 120 of an assembled mother board 130. Also, shown in Figure 1 are low-cost capacitors 140 mounted around the heat sink 110 and on the mother board 130.
The prior art heat sink 100 has a flat base plate 150 including an array of fins 160 extending perpendicularly away from the flat base plate 150. This configuration of the heat sink 110 dictates the use of the flat base plate 110, with the array of fms 160 for dissipating heat from the microprocessor 120. Increasing the heat dissipation using the prior art heat sink 110 shown in Figure 1, generally requires enlarging the surface area of the flat base plate 150 and/or the array of fins 160. This in turn results in consuming more motherboard real estate.
Generally, the microprocessor 120 (which is the heat source) have a smaller footprint size than the flat base plate 150 configuration of the heat sink 110 shown in Figure 1. A larger footprint size of the flat base plate 150 can cause the outermost part of the flat base plate 150 (the portion that is not directly in contact with the integrated circuit device) to have a significantly lower temperature than the part of the flat base plate 150 that is directly in contact with the integrated circuit device. Consequently, the prior art heat sink 110 with the larger flat base plate 150 is not effective in dissipating heat from the integrated circuit device. Furthermore, the packaged units and integrated circuit device sizes are decreasing, while the amount of heat generated by these components is increasing. The prior art heat sink 110 configuration dictates that the array of fins 160 extend to the edge of the flat base plate 150 to extract heat from the integrated circuit device. Also, the prior art heat sink 110 requires increasing the size of the array of fms 160 to increase the heat dissipation. In order to enlarge the fins 120 laterally, the flat base plate 150 has to increase in size. Enlarging the flat base plate 150 consumes more motherboard real estate. Consuming more motherboard real estate is generally not a viable option in an environment where system packaging densities are increasing with each successive, higher performance, integrated circuit device generation. Also, the prior art heat sink 110 is at the same level as the integrated circuit device on which it is mounted. It can be seen in Figure 1, that the flat base plate 150 configuration of the prior art heat sink 110 mounted on the microprocessor 120 generally prevents other motherboard components, such as low-cost capacitors 140, from encroaching around the microprocessor 120. Figure 2 is an isometric view of one embodiment of the enhanced heat dissipation device 200 according to the present invention. Shown in Figure 2 is the enhanced heat dissipation device 200 including a thermally conductive core 210, and a first conductive ring 220. Also, shown in Figure 2 is the thermally conductive core 210 having upper and lower outer surface areas 230 and 240. The first conductive ring 220 includes a first array of radially extending fins 250. The first conductive ring 220, including the first array of radially extending fins 250 is thermally coupled to the upper outer surface area 230 of the thermally conductive core 210. Figure 2 further shows an optional second conductive ring 290 thermally coupled to the lower outer surface area 240 of the thermally conductive core 210.
The thermally conductive core has an axis 260. In some embodiments, the upper and lower outer surface areas 230 and 240 are parallel to the axis 260. The thermally conductive core 260 further has a base 270. In some embodiments, the base 270 is disposed such a way that it is in close proximity to the lower outer surface area 240 and perpendicular to the axis 260. The upper and lower outer surface areas 230 and 240 can be concentric to the axis 260. The first conductive ring 220 is thermally coupled to the upper outer surface area such that components can be mounted around and in close proximity to the lower outer surface area and below the first conductive ring when the device 200 is mounted on to an integrated circuit device. In some embodiments, the components can encroach on to the integrated circuit device without mechanically interfering with the device 200.
The thermally conductive core 210 can be a solid body. The solid body can be cylindrical, conical, square, rectangular, or any other similar shapes that facilitates in mounting on to the integrated circuit device and in attaching the first conductive ring 220 to the upper outer surface area 230. The thermally conductive core 210 can include heat transport mediums such as one or more heat pipes, a liquid, a thermo-siphon, or other such heat transport medium that enhance heat dissipation from the integrated circuit device. The device 200, including the thermally conductive core 210 and the first conductive ring 220, can be made from materials such as aluminum, copper, or any other materials that are capable of dissipating heat away from the integrated circuit device.
The first array of radially extending fins 250 can be made of a first plurality of folded fins. The first plurality of folded fins can also be made of alternating deep and shallow folds 280 and 285 from a continuous ribbon such that the alternating deep and shallow folds 280 and 285 wrap around the upper outer surface area 230. The shallow folds have a first depth, and the deep folds have a second depth, and the first depth is less than the second depth. The thermally conductive core 210 can have a plurality of slots 287 parallel to the axis 260 and around the upper outer surface area 230. The first plurality of folded fins can be attached to the plurality of slots 287.
The first conductive ring 220 has a first outer diameter and the second conductive ring 290 has a second outer diameter. The second outer diameter is less than the first outer diameter. The first conductive ring 220 has a first depth and the second outer ring 290 has a second depth. The first and second outer diameters including the first and second depths are of sufficient size to allow components to be mounted around and in close proximity to the integrated circuit device when the device is mounted on the integrated circuit device. The second conductive ring 290 can have second array of radially extending fins 292. The second array of radially extending fins are thermally coupled to the lower outer surface area 240 of the thermally conductive core 210. The second array can include a second plurality of folded fins. The second plurality of folded fins can be made from a plurality of alternating deep and shallow folds from a continuous ribbon similar to the first plurality of folded fins shown in Figure 2.
Figure 3 is an isometric view 300 showing the enhanced heat dissipation device 200 shown in Figure 2, attached to the microprocessor 120 on an assembled motherboard 130. In the example embodiment shown in Figure 3, the microprocessor 120 has a front side 340 and a back side 330. The front side 340 is disposed across from the back side 330. The front side 340 is attached to the assembled motherboard 130 having components such as the low-cost capacitors 140 and other such electrical components. The base 270 shown in Figure 2, of the enhanced heat dissipation device 200 attached to the back side 330 of the microprocessor 120. It can be seen from Figure 3 that the first and second conductive rings 220 and 290 including the first and second plurality of folded fins 250 and 292 are of sufficient size so as to allow low-cost capacitors 140 mounted on the assembled board 130 to encroach around the microprocessor 120. It can also be seen the low-cost capacitors 140 are below the first conductive ring 220 and around the second conductive ring 290.
Also, it can be seen in Figure 3 that the first conductive ring 220 is larger than the second conductive ring 290, thereby increasing the heat dissipation rate without increasing a footprint size of the base 270 of the heat dissipation device 200 any more than the back side 330 of the microprocessor 120. The coinciding footprint sizes of the base 270 of the heat dissipation device 200 and the back side 330 of the microprocessor 120 enables the base 270 and the back side 330 of the microprocessor 120 to have same heat transfer rates. This in turn increases the efficiency of heat transfer between the base 270 and the back side 330 of the microprocessor 120.
The thermally conductive core 210 further has a top surface 275 disposed across from the base 270. In some embodiments, the top surface 275 is perpendicular to the axis 260 and is in close proximity to the second conductive ring 290. A heat transport medium can be attached to the top surface 275 to introduce a heat transfer medium 297 such as air in a direction shown in Figure 2, to enhance the heat dissipation by the heat dissipation device 200. A heat transport medium 295 such as a heat pipe, or other such medium can be included in the thermally conductive core 210 to further enhance the heat transfer from the heat dissipation device 200.
Figure 4 is a flow diagram illustrating generally a method 400 of forming an enhanced heat dissipation device to extract heat from an integrated circuit device mounted on an assembled printed circuit board. Method 400 as shown in Figure 4, begins with action 410 of forming a thermally conductive core having upper and lower core surface areas. The next action 420 requires forming a first array of radially extending fins. The next action 430 is to form a first conductive ring having a first diameter from the formed first array of radially extending fins. The next action 440, requires attaching the first conductive ring to the upper core surface area such that the lower core surface area has sufficient space below the first conductive ring to allow components to be mounted in close proximity and around the lower core surface area.
In some embodiments, forming the first array of radially extending fins further includes forming a first conductive ribbon, and forming a first alternative series of deep and shallow folds from the first conductive ribbon, and further forming a first conductive ring from the formed first alternative series of deep and shallow folds.
In some embodiments, the method 400 further includes forming a second array of radially extending fins, and forming a second conductive ring having a second diameter from the formed second array. Further, the second conductive ring is attached to the lower core surface area of the thermally conductive core such that the second diameter is sufficient to allow the components to encroach around the integrated circuit device. In some embodiments, forming the second array of radially extending fins further includes forming a second conductive ribbon, and forming a second alternative series of deep and shallow folds from the second conductive ribbon, and further forming a second conductive ring from the formed second alternative series of deep and shallow folds. The second diameter of the second conductive ring is less than the first diameter of the first conductive ring.
In some embodiments, the enhanced heat dissipation device is made of thermally conductive materials such as copper, aluminum, or any other such material capable of extracting heat away from the integrated circuit device. In some embodiments, the thermally conductive core can include heat transport mediums such as one or more heat pipes, a liquid, a thermo-siphon, or other similar heat transport medium suitable for enhancing the extraction of heat from the integrated circuit device.
Conclusion The above-described device and method provides, among other things, an enhanced heat dissipation using an array of radially extending fins where possible, to allow electronic components to encroach around an integrated circuit device it is mounted on, while maintaining high performance and cost effectiveness by leveraging currently enabled high volume manufacturing techniques

Claims

WHAT IS CLAIMED IS:
1. An enhanced heat dissipation device, comprising: a thermally conductive core, wherein the thermally conductive core has 5 upper and lower outer surface areas; and a first conductive ring having a first array of radially extending fins, the array being thermally coupled to the upper outer surface area of the thermally conductive core.
0 2. The device of claim 1, wherein the thermally conductive core further has an axis, wherein the upper and lower outer surface areas are parallel to the axis, wherein the thermally conductive core further has a base, wherein the base is disposed such that it is perpendicular to the axis and in close proximity to the lower outer surface area. 5
3. The device of claim 2, wherein the upper and lower outer surface areas are concentric to the axis.
4. The device of claim 2, wherein the first conductive ring is thermally o coupled to the upper outer surface area such that components can be mounted around and in close proximity to the lower outer surface area and below the first conductive ring when the device is mounted on an integrated circuit device.
5. The device of claim 4, wherein the components can encroach on the 5 integrated circuit device without mechanically interfering with the device.
6. The device of claim 4, wherein the thermally conductive core is a solid body having a shape selected from the group consisting of cylindrical, conical, square, and rectangular. 0
7. The device of claim 4, wherein the thermally conductive core includes a heat transport medium such as one or more heat pipes, a liquid, a thermo-siphon, or other similar heat transport mediums. 5
8. The device of claim 7, wherein the thermally conductive core and the first array of radially extending fins are made from materials selected from the group consisting of aluminum, copper, and other such materials capable of extracting heat away from the integrated circuit device.
9. The device of claim 1, wherein the first array comprises a first plurality of folded fins.
10. The device of claim 9, wherein the first plurality of folded fins comprises: a plurality of alternating deep and shallow folds in a continuous ribbon such that the alternating deep and shallow folds wraps around the upper outer surface area.
11. The device of claim 10, wherein the shallow folds have a first depth and the deep folds have a second depth, wherein the first depth is less than the second depth.
12. The device of claim 10, wherein the thermally conductive core has a plurality of slots parallel to the axis and around the upper outer surface area, wherein the first plurality of folded fins are attached to the plurality of slots.
13. The device of claim 1, further comprising: a second conductive ring, thermally coupled to the lower outer surface area, wherein the first conductive ring has a first outer diameter and the second conductive ring has a second outer diameter, wherein the second outer diameter being less than the first outer diameter.
14. The device of claim 13, wherein the second outer diameter has a size sufficient to allow components to be mounted around and in close proximity to the second conductive ring and below the first conductive ring when the device is mounted on an integrated circuit device.
15. The device of claim 14, wherein the second conductive ring has a second array of radially extending fins, wherein the second array is coupled to the lower outer surface area of the thermally conductive core.
16. The device of claim 15, wherein the second array comprises a second plurality of folded fins.
17. The device of claim 16, wherein the second plurality of folded fins comprises: a plurality of alternating deep and shallow folds in a continuous ribbon around the lower outer surface area.
18. A heat dissipation system, comprising: an integrated circuit device, having a front side and a back side, wherein the front side is disposed across from the back side, wherein the front side is attached to a circuit board having components; an enhanced heat dissipation device comprising: a thermally conductive core, attached to the back side of the integrated circuit device, the thermally conductive core having upper and lower core surface areas, wherein the upper and lower core surface areas having a first and second length; and a first conductive ring having a first plurality of folded fins, the first plurality of folded fins thermally coupled to the upper core surface area, the first plurality of folded fins surrounding the upper core surface area, the first length of the first conductive ring being sufficient to permit components to be mounted on the circuit board and below the first conductive ring.
19. The system of claim 18, wherein the thermally conductive core further comprises a base, wherein the base is in close proximity to the lower core surface area and the base and the back side of the integrated circuit device have coinciding footprint sizes so that temperatures of the integrated circuit device, the base, the first plurality of folded fins, and the thermally conductive core are close to each other during operation to enhance heat transfer from the integrated circuit device.
20. The heat system of claim 19, further comprising: a heat transport medium, wherein the thermally conductive core further has a top surface disposed across from the base and in close proximity to the upper core surface area, wherein the heat transport medium is attached to the top surface such that a direction of flow of a cooling medium introduced by the heat transfer medium over the first plurality of folded fins enhances the heat extraction from the integrated circuit device.
21. The system of claim 20, further comprising: a second conductive ring having a second plurality of folded fins, the second plurality of folded fins thermally coupled to the lower core surface area, the second conductive ring having a second diameter, the first conductive ring 5 having a first diameter, wherein the second diameter is less than the first diameter, and sufficient to permit components to be mounted on the circuit board and below the first conductive ring.
22. The system of claim 18, wherein the integrated circuit device is a 0 microprocessor.
23. A method of forming an enhanced heat dissipation device to extract heat from an integrated circuit device mounted on an assembled printed circuit board, comprising: 5 forming a thermally conductive core having upper and lower core surface areas; forming a first array of radially extending fins; forming a first conductive ring from the formed first array, wherein the first conductive ring has a first diameter; and o attaching the first conductive ring to the upper core surface area such that the lower core surface area has sufficient space below the first conductive ring to allow components to encroach around the integrated circuit device when mounted on to the integrated circuit device.
5 24. The method of claim 23, wherein forming the first array of radially extending fins comprises: forming a first conductive ribbon; forming a first alternative series of deep and shallow folds from the first conductive ribbon; and 0 forming a first conductive ring from the formed first alternative series of deep and shallow folds.
25. The method of claim 23, further comprising: forming a second array of radially extending fins; 5 forming a second conductive ring from the formed second array, wherein the second conductive ring has a second diameter, wherein the second diameter is less than about half the first diameter; and attaching the second conductive ring to the lower core surface area such that the second diameter is of sufficient size to allow the components to be encroach around the integrated circuit device and below the first conductive ring.
26. The method of claim 25, wherein forming the second array of radially extending fins comprises: forming a second conductive ribbon; forming a second alternative series of deep and shallow folds from the second conductive ribbon; and forming a second conductive ring from the formed second alternative series of deep and shallow folds.
27. The method of claim 26, further comprising: attaching an integrated circuit device to the thermally conductive core.
28. The method of claim 27, wherein the integrated circuit device comprises a microprocessor.
29. The method of claim 27, wherein the thermally conductive core, the first conductive ring and the second conductive ring are made of a thermally conductive material.
30. The method of claim 29, wherein the thermally conductive core, the first conductive ring, and the second conductive ring are made of materials selected from the group consisting of aluminum, copper, and other such materials capable of extracting heat away from the integrated circuit device.
EP01995316A 2000-11-20 2001-10-31 A high-performance fin configuration for air-cooled heat dissipation device Withdrawn EP1344251A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/716,510 US6633484B1 (en) 2000-11-20 2000-11-20 Heat-dissipating devices, systems, and methods with small footprint
US716510 2000-11-20
PCT/US2001/045677 WO2002041395A2 (en) 2000-11-20 2001-10-31 A high-performance fin configuration for air-cooled heat dissipation device

Publications (1)

Publication Number Publication Date
EP1344251A2 true EP1344251A2 (en) 2003-09-17

Family

ID=24878282

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01995316A Withdrawn EP1344251A2 (en) 2000-11-20 2001-10-31 A high-performance fin configuration for air-cooled heat dissipation device

Country Status (12)

Country Link
US (2) US6633484B1 (en)
EP (1) EP1344251A2 (en)
JP (2) JP4801313B2 (en)
KR (2) KR100566446B1 (en)
CN (1) CN100373602C (en)
AU (1) AU2002225846A1 (en)
DE (1) DE10196917B4 (en)
GB (1) GB2384911B (en)
HK (1) HK1055509A1 (en)
MY (2) MY138068A (en)
TW (1) TW519742B (en)
WO (1) WO2002041395A2 (en)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1305131C (en) * 2000-11-20 2007-03-14 英特尔公司 High performance heat sink configurations for use in high density packaging applications
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
EP1412979B1 (en) * 2001-06-05 2005-09-07 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6691770B2 (en) * 2001-12-03 2004-02-17 Agilent Technologies, Inc. Cooling apparatus
US6681842B2 (en) * 2001-12-03 2004-01-27 Agilent Technologies, Inc. Cooling apparatus
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6575231B1 (en) * 2002-08-27 2003-06-10 Chun-Chih Wu Spiral step-shaped heat dissipating module
US20040118552A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating device
US6714415B1 (en) * 2003-03-13 2004-03-30 Intel Corporation Split fin heat sink
US6968890B1 (en) * 2003-06-11 2005-11-29 Apple Computer, Inc. Heat sink
US7861768B1 (en) 2003-06-11 2011-01-04 Apple Inc. Heat sink
TWM246683U (en) * 2003-08-13 2004-10-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
US20050211416A1 (en) * 2003-10-17 2005-09-29 Kenya Kawabata Heat sink with fins and a method for manufacturing the same
US20050167082A1 (en) * 2004-01-30 2005-08-04 Datech Technology Co., Ltd. Heat sink-type cooling device for an integrated circuit
US7265759B2 (en) 2004-04-09 2007-09-04 Nvidia Corporation Field changeable rendering system for a computing device
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US7154749B2 (en) * 2004-06-08 2006-12-26 Nvidia Corporation System for efficiently cooling a processor
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US20060054311A1 (en) * 2004-09-15 2006-03-16 Andrew Douglas Delano Heat sink device with independent parts
CN100358131C (en) * 2004-11-12 2007-12-26 华硕电脑股份有限公司 Radiator
US7195058B2 (en) * 2004-12-01 2007-03-27 International Business Machines Corporation Heat sink made from a singly extruded heatpipe
US7378288B2 (en) * 2005-01-11 2008-05-27 Semileds Corporation Systems and methods for producing light emitting diode array
US7524686B2 (en) * 2005-01-11 2009-04-28 Semileds Corporation Method of making light emitting diodes (LEDs) with improved light extraction by roughening
US9130114B2 (en) 2005-01-11 2015-09-08 SemiLEDs Optoelectronics Co., Ltd. Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication
US20060154393A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Systems and methods for removing operating heat from a light emitting diode
US7897420B2 (en) * 2005-01-11 2011-03-01 SemiLEDs Optoelectronics Co., Ltd. Light emitting diodes (LEDs) with improved light extraction by roughening
US7563625B2 (en) * 2005-01-11 2009-07-21 SemiLEDs Optoelectronics Co., Ltd. Method of making light-emitting diodes (LEDs) with improved light extraction by roughening
US7473936B2 (en) * 2005-01-11 2009-01-06 Semileds Corporation Light emitting diodes (LEDs) with improved light extraction by roughening
US7186580B2 (en) * 2005-01-11 2007-03-06 Semileds Corporation Light emitting diodes (LEDs) with improved light extraction by roughening
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
US7286352B2 (en) * 2005-04-15 2007-10-23 Hewlett-Packard Development Company, L.P. Thermally expanding base of heatsink to receive fins
US7710741B1 (en) 2005-05-03 2010-05-04 Nvidia Corporation Reconfigurable graphics processing system
JP4646219B2 (en) * 2005-06-22 2011-03-09 古河電気工業株式会社 heatsink
WO2007053939A1 (en) * 2005-11-09 2007-05-18 Tir Technology Lp. Passive thermal management system
KR100749488B1 (en) * 2005-11-30 2007-08-14 삼성에스디아이 주식회사 Plasma display device
US20070146995A1 (en) * 2005-12-27 2007-06-28 Liang-Hui Zhao Heat dissipation device
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
US20080066898A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat dissipation device
US20080247874A1 (en) * 2007-04-05 2008-10-09 Acre James A Dual flow fan heat sink application
TW200934362A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipaters having heat sinks and structure thereof
TW200934361A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipater and structure thereof
US8453715B2 (en) 2008-10-30 2013-06-04 General Electric Company Synthetic jet embedded heat sink
US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
US8365407B2 (en) * 2009-04-14 2013-02-05 Neng Tyi Precision Industries Co., Ltd. Radiator manufacturing method and aligning-and-moving mechanism thereof
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US9140502B2 (en) 2010-07-08 2015-09-22 Hamilton Sundstrand Corporation Active structures for heat exchanger
US8295046B2 (en) 2010-07-19 2012-10-23 Hamilton Sundstrand Corporation Non-circular radial heat sink
US8773854B2 (en) 2011-04-25 2014-07-08 Google Inc. Thermosiphon systems for electronic devices
US8979353B2 (en) 2011-08-11 2015-03-17 Starlights, Inc. Light fixture having modular accessories and method of forming same
US9500413B1 (en) 2012-06-14 2016-11-22 Google Inc. Thermosiphon systems with nested tubes
TWI475183B (en) * 2012-08-01 2015-03-01 Asia Vital Components Co Ltd Heat sink structure and method of manufacturing same
TWI507860B (en) 2012-08-01 2015-11-11 Asia Vital Components Co Ltd Heat sink structure and manufacturing method thereof
US9137925B2 (en) * 2013-05-08 2015-09-15 Hamilton Sundstrand Corporation Heat sink for contactor in power distribution assembly
JP6372845B2 (en) * 2014-01-16 2018-08-15 国立大学法人 鹿児島大学 heatsink
US9581322B2 (en) * 2014-09-30 2017-02-28 Aeonovalite Technologies, Inc. Heat-sink for high bay LED device, high bay LED device and methods of use thereof
US10794637B2 (en) * 2016-10-03 2020-10-06 Ge Aviation Systems Llc Circular heatsink
TWD210771S (en) * 2020-04-09 2021-04-01 宏碁股份有限公司 Heat-dissipation fin

Family Cites Families (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US896107A (en) * 1907-08-08 1908-08-18 Harry O Harrison Screw-driver.
US2337294A (en) * 1942-02-18 1943-12-21 Taylor Winfield Corp Fabrication method
US2413179A (en) * 1943-09-20 1946-12-24 Westinghouse Electric Corp Radiator
US3187082A (en) * 1961-02-01 1965-06-01 Cool Fin Electronics Corp Heat dissipating electrical shield
US3239003A (en) 1962-11-30 1966-03-08 Wakefield Engineering Co Inc Heat transfer
US3182114A (en) * 1963-01-04 1965-05-04 Fan Tron Corp Rectifier unit with heat dissipator
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US4354729A (en) 1980-12-22 1982-10-19 Amp Incorporated Preloaded electrical contact terminal
DE3151838A1 (en) * 1981-12-29 1983-07-21 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Cooling device for disc-shaped semiconductor devices
JPS58169943A (en) 1982-03-29 1983-10-06 Fujitsu Ltd Semiconductor device
US4557225A (en) 1984-01-18 1985-12-10 Mikuni Kogyo Kabushiki Kaisha Combined housing and heat sink for electronic engine control system components
EP0404277B1 (en) 1984-02-27 1994-09-28 The Whitaker Corporation Method of inserting a chip carrier contact into a housing
JPS6270686A (en) 1985-09-20 1987-04-01 Sanyo Electric Co Ltd Multicylinder rotary compressor
US4699593A (en) 1986-01-14 1987-10-13 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
US4733293A (en) 1987-02-13 1988-03-22 Unisys Corporation Heat sink device assembly for encumbered IC package
US4997034A (en) * 1987-12-23 1991-03-05 Minnesota Mining And Manufacturing Company Heat exchanger
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
JP2554746B2 (en) 1989-07-04 1996-11-13 山一電機株式会社 contact
US4959029A (en) 1989-08-18 1990-09-25 Amp Incorporated Electrical contact
US4940432A (en) 1989-09-08 1990-07-10 Amp Incorporated Contact element for test socket for flat pack electronic packages
GB9004483D0 (en) 1990-02-28 1990-04-25 Erba Carlo Spa New aryl-and heteroarylethenylene derivatives and process for their preparation
US5132875A (en) 1990-10-29 1992-07-21 Compaq Computer Corporation Removable protective heat sink for electronic components
JPH07109780B2 (en) 1991-02-19 1995-11-22 山一電機株式会社 Contacts in sockets for electrical components
JP2874470B2 (en) 1992-08-25 1999-03-24 株式会社日立製作所 Forced air-cooled inverter
JP2902531B2 (en) 1992-12-25 1999-06-07 富士通株式会社 Heat dissipation device for semiconductor device
JP2901835B2 (en) 1993-04-05 1999-06-07 株式会社東芝 Semiconductor device
US5505257A (en) 1993-06-18 1996-04-09 Goetz, Jr.; Edward E. Fin strip and heat exchanger construction
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
JP3054003B2 (en) 1993-09-01 2000-06-19 株式会社東芝 IC contactor
US5704416A (en) 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5780928A (en) * 1994-03-07 1998-07-14 Lsi Logic Corporation Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices
US5800184A (en) 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US5437327A (en) 1994-04-18 1995-08-01 Chiou; Ming Der CPU heat dissipating fan device
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
JP2636777B2 (en) 1995-02-14 1997-07-30 日本電気株式会社 Semiconductor module for microprocessor
US5661638A (en) 1995-11-03 1997-08-26 Silicon Graphics, Inc. High performance spiral heat sink
US5785116A (en) 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5777844A (en) 1996-08-30 1998-07-07 General Electric Company Electronic control with heat sink
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
JP2959506B2 (en) 1997-02-03 1999-10-06 日本電気株式会社 Multi-chip module cooling structure
JP4290232B2 (en) 1997-02-24 2009-07-01 富士通株式会社 Heat sink and information processing device using it
GB2323434B (en) * 1997-03-22 2000-09-20 Imi Marston Ltd Heat sink
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US5920458A (en) 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element
US6129239A (en) 1997-06-17 2000-10-10 Fukazawa; Noriko Pocket tissue holder with additional holding capability
US6075285A (en) 1997-12-15 2000-06-13 Intel Corporation Semiconductor package substrate with power die
US6208511B1 (en) 1998-12-31 2001-03-27 Lucent Technologies, Inc. Arrangement for enclosing a fluid and method of manufacturing a fluid retaining enclosure
US6069794A (en) 1999-02-08 2000-05-30 Chuang; Wen-Hao Bushing for combining fan and heat sink
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6189601B1 (en) 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US6075702A (en) 1999-05-26 2000-06-13 Hewlett-Packard Company Heat transfer device for a retention assembly
US6219239B1 (en) 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly
US6851467B1 (en) 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
JP3869219B2 (en) 2000-02-08 2007-01-17 山洋電気株式会社 Cooling device with heat sink
TW510642U (en) 2000-08-09 2002-11-11 Tranyoung Technology Corp Heat dissipating
JP3686005B2 (en) 2001-03-30 2005-08-24 山洋電気株式会社 Cooling device with heat sink

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0241395A2 *

Also Published As

Publication number Publication date
CN1708849A (en) 2005-12-14
WO2002041395A3 (en) 2002-08-22
AU2002225846A1 (en) 2002-05-27
GB2384911B (en) 2005-03-16
GB2384911A (en) 2003-08-06
DE10196917T5 (en) 2004-04-22
KR100566446B1 (en) 2006-03-31
HK1055509A1 (en) 2004-01-09
CN100373602C (en) 2008-03-05
JP2004523883A (en) 2004-08-05
US6633484B1 (en) 2003-10-14
GB0308872D0 (en) 2003-05-21
JP4801313B2 (en) 2011-10-26
MY138068A (en) 2009-04-30
US20020060902A1 (en) 2002-05-23
TW519742B (en) 2003-02-01
DE10196917B4 (en) 2009-11-05
KR20040014416A (en) 2004-02-14
US6535385B2 (en) 2003-03-18
KR100566447B1 (en) 2006-03-31
MY127105A (en) 2006-11-30
WO2002041395A2 (en) 2002-05-23
KR20040014415A (en) 2004-02-14
JP2004523884A (en) 2004-08-05
JP4170756B2 (en) 2008-10-22

Similar Documents

Publication Publication Date Title
US6633484B1 (en) Heat-dissipating devices, systems, and methods with small footprint
US6269864B1 (en) Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US7025125B2 (en) Heat dissipating device with heat pipe
US5933323A (en) Electronic component lid that provides improved thermal dissipation
US7697293B1 (en) Heat dissipation device
US20070000643A1 (en) Heat sink
US6845010B2 (en) High performance heat sink configurations for use in high density packaging applications
US20080156459A1 (en) Heat dissipation device with a heat pipe
US7487825B2 (en) Heat dissipation device
JP2004523911A (en) Heat dissipation device
US6479895B1 (en) High performance air cooled heat sinks used in high density packaging applications
JPH10215094A (en) Device for eliminating heat from pc card array
US20080289799A1 (en) Heat dissipation device with a heat pipe
US20080142192A1 (en) Heat dissipation device with a heat pipe
US6968890B1 (en) Heat sink
US7688590B2 (en) Thermal module and electronic apparatus using the same
US6504721B1 (en) Thermal cooling apparatus
US6501655B1 (en) High performance fin configuration for air cooled heat sinks
US6826049B2 (en) Heat sink assembly with fan-driven fluid circulation
US6518661B1 (en) Apparatus for metal stack thermal management in semiconductor devices
US20060102323A1 (en) Radially shaped heat pipe
JPH05198714A (en) Cooling structure for electronic equipment
JPH03133165A (en) Heat pipe system heat dissipating unit
JPH05291443A (en) Heat sink with heat dissipating fins and mounting structure thereof

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030530

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

17Q First examination report despatched

Effective date: 20080222

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20110405