US20050167082A1 - Heat sink-type cooling device for an integrated circuit - Google Patents

Heat sink-type cooling device for an integrated circuit Download PDF

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Publication number
US20050167082A1
US20050167082A1 US10/766,832 US76683204A US2005167082A1 US 20050167082 A1 US20050167082 A1 US 20050167082A1 US 76683204 A US76683204 A US 76683204A US 2005167082 A1 US2005167082 A1 US 2005167082A1
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United States
Prior art keywords
heat
zones
heat zone
cooling device
heat sink
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/766,832
Inventor
Nien-Lun Li
Chin-Yueh Chu
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Datech Technology Co Ltd
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Datech Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US10/766,832 priority Critical patent/US20050167082A1/en
Assigned to DATECH TECHNOLOGY CO., LTD. reassignment DATECH TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHU, CHIN-YUEH, LI, NIEN-LUN
Priority to DE202004002339U priority patent/DE202004002339U1/en
Publication of US20050167082A1 publication Critical patent/US20050167082A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a cooling device for an integrated circuit. More particularly, the invention relates to a heat sink-type cooling device for an integrated circuit, especially one which, by more than one heat zones that has height drop between each two zones, is able to match up the inner space allocation of the computer mainframe and be assembled more easily into the computer mainframe so that heat is dispersed efficiently.
  • a heat sink of the prior art (as FIG. 8 ) comprises a base 3 and plurality of fin 31 extended upward. Said plurality of fin 31 is framed by solid mental plate and is set on said base 3 having the same height. Its usage is to stick said base 3 on the heat source in the computer mainframe (such as CPU) to make said base 3 absorb the heat of the heat source and conduct it to plurality of fin to disperse heat.
  • a fan (as alternative) can be set upon said plurality of fin of the same height to inhale the air and direct it to said plurality of fin to disperse heat.
  • the above heat sink has the ability to disperse the heat of the heat source in the computer mainframe. But, because said plurality of fin of the same height 31 is set upon said base 3 , when the equipment in the computer mainframe is expanded, the height of said plurality of fin 31 affect the inner space allocation of the mainframe and the inner space allocation of the mainframe is limited by the heat sink. Therefore, usual heat sink of the prior art does not meet the need of the user.
  • the purpose of the present invention is to make a heat sink having more than one heat zone with height drop between each two zones.
  • the purpose is to make said heat sink be able to match up the inner space allocation of the computer mainframe and be installed into the computer mainframe more easily so as to efficiently disperse heat.
  • present invention is a heat sink-type cooling device for an integrated circuit
  • a heat sink-type cooling device for an integrated circuit comprising a base and plurality of fin extended upward from one end surface of said base.
  • Said plurality of fin is divided into more than one heat zones and said plurality of heat zone has height drop between each two zones.
  • said heat sink-type cooling device for an integrated circuit is able to match up the inner space allocation of the computer mainframe. Rectangular hole can also be punched on the plate of said plurality of fin which is not connected with said base so as to improve the efficiency of heat dispersing of said heat sink-type cooling device for an integrated circuit.
  • FIG. 1 is a perspective view of the first preferred embodiment according to the present invention
  • FIG. 2 is an exploded view of the structure of the first preferred embodiment according to the present invention.
  • FIG. 3 is a perspective view of the second preferred embodiment according to the present invention.
  • FIG. 4 is a perspective view of the third preferred embodiment according to the present invention.
  • FIG. 5 is a perspective view of the fourth preferred embodiment according to the present invention.
  • FIG. 6 is a perspective view of the fifth preferred embodiment according to the present invention.
  • FIG. 7 is a perspective view of the sixth preferred embodiment according to the present invention.
  • FIG. 8 is a perspective view of the prior art.
  • present invention is a heat sink-type cooling device for an integrated circuit 1 comprising a base 11 and plurality of fin 12 .
  • An end of said plurality of fin 12 is connected with an end surface of said base and is extended upward.
  • Said plurality of fin 12 is framed by bending a mental plate into more than one vertical plate 121 and plurality of horizontal plate 122 which is connected to the said vertical plate by turns.
  • said plurality of horizontal plate 122 is divided into more than one heat zone 13 , 14 wherein there is drop height between each two zones.
  • Different type of said heat sink-type cooling device for an integrated circuit 1 a, 1 b and 1 c (as FIG. 3 , FIG. 4 and FIG. 5 ) can be made according to actual requirements which has different height drop of said heat zones 13 14 .
  • said heat sink-type cooling device for an integrated circuit 1 with said heat zones having drop height between each two zones 13 and 14 is to fit in the space allocation of the computer mainframe in effect, which is to keep away from and be harmony with the electronic components and connectors on the main board, and is not limited by the original space allocation of the computer mainframe so that said heat sink-type cooling device is assembled more easily into the computer mainframe to efficiently disperse heat.
  • a brand new heat sink-type cooling device for an integrated circuit is constructed according to the structure mentioned above.
  • said heat sink-type cooling device for an integrated circuit 2 comprises a base 21 and plurality of fin 22 wherein an end of said plurality of fin 22 is connected with an end surface of said base 21 and is extended upward.
  • Said plurality of fin is divided into more than one heat zone 23 , 24 and said heat zones 23 , 24 have height drop between each two zones.
  • Said plurality of fin 22 is framed by bending a mental plate into more than one vertical plate 221 and plurality of horizontal plate 222 which is connected with said vertical plates 221 by turns.
  • Each of those horizontal plates 222 which is not connected with said base is punched with a rectangular hole 223 and on punching said rectangular holes 223 on the fins 22 , required rectangular holes 223 on the horizontal plates 222 can be punched first, and then bend said mental plate to form heat zones 23 , 24 with height drop between each two zones; or, on punching rectangular holes 223 on the horizontal plates 222 , required rectangle holes 223 on the horizontal plates 222 can be punched, and simultaneously bend said mental plate to form heat zones 23 , 24 with drop height between each two zones.
  • Said heat zones 23 , 24 which have drop height between each two zones are to keep away from and be harmony with the electronic components and connectors on the main board.
  • said heat sink-type cooling device for an integrated circuit 2 is to fit in the space allocation of the computer mainframe in effect and is not limited by the original space allocation of the computer mainframe and said heat sink-type cooling device 2 can be assembled even more easily into the computer mainframe. And by the help of the rectangular holes 223 on the horizontal plates for better ventilation, the efficiency of the heat dispersing of said heat sink-type cooling device for an integrated circuit 2 is improved and heat is dispersed efficiently.
  • said heat sink-type cooling device for an integrated circuit 3 comprises a base 41 and plurality of fin 42 extended from an end surface of said base 41 .
  • Said plurality of fin 42 is divided into more than one heat zone 43 , 44 and said heat zones 43 , 44 have height drop between each two zones.
  • Each of said plurality of heat zone 43 , 44 is framed by bending a mental plate. After said plurality of heat zone 43 , 44 is framed by bending said mental plate, a heat sink-type cooling device for an integrated circuit is made by putting it on said base 41 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink-type cooling device for an integrated circuit having a base and plurality of fin extended upward. The plurality of fins are divided into more than one heat zones and said plurality of heat zones have a height drop between each two zones wherein a rectangular hole can also be punched on the plate end of said plurality of fin which is not connected with said base. By these heat zones with height drop between each two zones, the heat sink-type cooling device is able to match up the inner space allocation of the computer mainframe and be assembled even more easily into the computer mainframe so that heat is dispersed efficiently.

Description

    FIELD OF THE INVENTION
  • The invention relates to a cooling device for an integrated circuit. More particularly, the invention relates to a heat sink-type cooling device for an integrated circuit, especially one which, by more than one heat zones that has height drop between each two zones, is able to match up the inner space allocation of the computer mainframe and be assembled more easily into the computer mainframe so that heat is dispersed efficiently.
    • DESCRIPTION OF THE RELATED ART
  • Accordingly, a heat sink of the prior art (as FIG. 8) comprises a base 3 and plurality of fin 31 extended upward. Said plurality of fin 31 is framed by solid mental plate and is set on said base 3 having the same height. Its usage is to stick said base 3 on the heat source in the computer mainframe (such as CPU) to make said base 3 absorb the heat of the heat source and conduct it to plurality of fin to disperse heat. Besides, a fan (as alternative) can be set upon said plurality of fin of the same height to inhale the air and direct it to said plurality of fin to disperse heat.
  • The above heat sink has the ability to disperse the heat of the heat source in the computer mainframe. But, because said plurality of fin of the same height 31 is set upon said base 3, when the equipment in the computer mainframe is expanded, the height of said plurality of fin 31 affect the inner space allocation of the mainframe and the inner space allocation of the mainframe is limited by the heat sink. Therefore, usual heat sink of the prior art does not meet the need of the user.
    • BRIEF SUMMARY OF THE INVENTION
  • Therefore, the purpose of the present invention is to make a heat sink having more than one heat zone with height drop between each two zones. The purpose is to make said heat sink be able to match up the inner space allocation of the computer mainframe and be installed into the computer mainframe more easily so as to efficiently disperse heat.
  • To achieve the above goals, present invention is a heat sink-type cooling device for an integrated circuit comprising a base and plurality of fin extended upward from one end surface of said base. Said plurality of fin is divided into more than one heat zones and said plurality of heat zone has height drop between each two zones. By these heat zones with height drop between each two zones, said heat sink-type cooling device for an integrated circuit is able to match up the inner space allocation of the computer mainframe. Rectangular hole can also be punched on the plate of said plurality of fin which is not connected with said base so as to improve the efficiency of heat dispersing of said heat sink-type cooling device for an integrated circuit.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will be better understood from the following detailed description of preferred embodiments of the invention, taken in conjunction with the accompanying drawings, in which
  • FIG. 1 is a perspective view of the first preferred embodiment according to the present invention;
  • FIG. 2 is an exploded view of the structure of the first preferred embodiment according to the present invention;
  • FIG. 3 is a perspective view of the second preferred embodiment according to the present invention;
  • FIG. 4 is a perspective view of the third preferred embodiment according to the present invention;
  • FIG. 5 is a perspective view of the fourth preferred embodiment according to the present invention;
  • FIG. 6 is a perspective view of the fifth preferred embodiment according to the present invention;
  • FIG. 7 is a perspective view of the sixth preferred embodiment according to the present invention; and
  • FIG. 8 is a perspective view of the prior art.
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The following descriptions of the preferred embodiments are provided to understand the features and the structures of the present invention.
  • Please refer to FIG. 1 till FIG. 5, which are a perspective view of the first preferred embodiment, an exploded view of the structure of the first preferred embodiment, a perspective view of the second preferred embodiment, a perspective view of the third preferred embodiment, and a perspective view of the fourth preferred embodiment, according to the present invention. As shown in the above figures, present invention is a heat sink-type cooling device for an integrated circuit 1 comprising a base 11 and plurality of fin 12. An end of said plurality of fin 12 is connected with an end surface of said base and is extended upward. Said plurality of fin 12 is framed by bending a mental plate into more than one vertical plate 121 and plurality of horizontal plate 122 which is connected to the said vertical plate by turns. And said plurality of horizontal plate 122 is divided into more than one heat zone 13,14 wherein there is drop height between each two zones. Different type of said heat sink-type cooling device for an integrated circuit 1 a, 1 b and 1 c (as FIG. 3, FIG. 4 and FIG. 5) can be made according to actual requirements which has different height drop of said heat zones 13 14. When assembling, said heat sink-type cooling device for an integrated circuit 1 with said heat zones having drop height between each two zones 13 and 14 is to fit in the space allocation of the computer mainframe in effect, which is to keep away from and be harmony with the electronic components and connectors on the main board, and is not limited by the original space allocation of the computer mainframe so that said heat sink-type cooling device is assembled more easily into the computer mainframe to efficiently disperse heat. Thereby, a brand new heat sink-type cooling device for an integrated circuit is constructed according to the structure mentioned above.
  • Please refer to FIG. 6, which is the perspective view of the fifth embodiment according to present invention. As shown in the above figure, said heat sink-type cooling device for an integrated circuit 2 comprises a base 21 and plurality of fin 22 wherein an end of said plurality of fin 22 is connected with an end surface of said base 21 and is extended upward. Said plurality of fin is divided into more than one heat zone 23,24 and said heat zones 23,24 have height drop between each two zones. Said plurality of fin 22 is framed by bending a mental plate into more than one vertical plate 221 and plurality of horizontal plate 222 which is connected with said vertical plates 221 by turns. Each of those horizontal plates 222 which is not connected with said base is punched with a rectangular hole 223 and on punching said rectangular holes 223 on the fins 22, required rectangular holes 223 on the horizontal plates 222 can be punched first, and then bend said mental plate to form heat zones 23,24 with height drop between each two zones; or, on punching rectangular holes 223 on the horizontal plates 222, required rectangle holes 223 on the horizontal plates 222 can be punched, and simultaneously bend said mental plate to form heat zones 23,24 with drop height between each two zones. Said heat zones 23,24 which have drop height between each two zones are to keep away from and be harmony with the electronic components and connectors on the main board. As a result, said heat sink-type cooling device for an integrated circuit 2 is to fit in the space allocation of the computer mainframe in effect and is not limited by the original space allocation of the computer mainframe and said heat sink-type cooling device 2 can be assembled even more easily into the computer mainframe. And by the help of the rectangular holes 223 on the horizontal plates for better ventilation, the efficiency of the heat dispersing of said heat sink-type cooling device for an integrated circuit 2 is improved and heat is dispersed efficiently.
  • Please refer to FIG. 7, which is the perspective view of the sixth embodiment according to present invention. As shown in the above figure, said heat sink-type cooling device for an integrated circuit 3 comprises a base 41 and plurality of fin 42 extended from an end surface of said base 41. Said plurality of fin 42 is divided into more than one heat zone 43,44 and said heat zones 43,44 have height drop between each two zones. Each of said plurality of heat zone 43,44 is framed by bending a mental plate. After said plurality of heat zone 43,44 is framed by bending said mental plate, a heat sink-type cooling device for an integrated circuit is made by putting it on said base 41.
  • The preferred embodiments herein disclosed are not intended to unnecessarily limit the scope of the invention. Therefore, simple modifications or variations belonging to the equivalent of the scope of the claims and the instructions disclosed herein for a patent are all within the scope of the present invention.

Claims (7)

1-7. (canceled)
8. A heat sink cooling device for an integrated circuit comprising:
a) a base; and
b) a plurality of heat zones having:
i) at least one first heat zone having a plurality of first heat zone fins, the plurality of first heat zone fins having a plurality of first heat zone vertical plates and a plurality of first heat zone horizontal plates, each first heat zone vertical plate is located between two first heat zone horizontal plates of the plurality of first heat zone horizontal plates, each two first heat zone horizontal plates including a first top horizontal plate and a first bottom horizontal plate, each first bottom horizontal plate is connected to the base and each first top horizontal plate is spaced apart from the base; and
ii) at least one second heat zone having a plurality of second heat zone fins, the plurality of second heat zone fins having a plurality of second heat zone vertical plates and a plurality of second heat zone horizontal plates, each second heat zone vertical plate is located between two second heat zone horizontal plates of the plurality of second heat zone horizontal plates, each two second heat zone horizontal plates including a second top horizontal plate and a second bottom horizontal plate, each second bottom horizontal plate is connected to the base and each second top horizontal plate is spaced apart from the base,
wherein each of the plurality of first heat zone vertical plates have a height that is higher than a height of each of the plurality of second heat zone vertical plates and each of the plurality of first heat zone vertical plates have a bottom in a same plane as a bottom of each of the plurality of second heat zone vertical plates.
9. The heat sink cooling device according to claim 8, wherein the plurality of heat zones includes one first heat zone and one second heat zone.
10. The heat sink cooling device according to claim 8, wherein the plurality of heat zones includes one first heat zone and two second heat zones.
11. The heat sink cooling device according to claim 8, wherein the plurality of heat zones includes two first heat zones and one second heat zone.
12. The heat sink cooling device according to claim 8, wherein each first top horizontal plate and each second top horizontal plate includes a rectangular hole.
13. The heat sink cooling device according to claim 8, wherein the plurality of heat zones are formed by bending a metal plate.
US10/766,832 2004-01-30 2004-01-30 Heat sink-type cooling device for an integrated circuit Abandoned US20050167082A1 (en)

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US10/766,832 US20050167082A1 (en) 2004-01-30 2004-01-30 Heat sink-type cooling device for an integrated circuit
DE202004002339U DE202004002339U1 (en) 2004-01-30 2004-02-16 Cooling device for integrated circuits

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US10/766,832 US20050167082A1 (en) 2004-01-30 2004-01-30 Heat sink-type cooling device for an integrated circuit
DE202004002339U DE202004002339U1 (en) 2004-01-30 2004-02-16 Cooling device for integrated circuits

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140239762A1 (en) * 2013-02-27 2014-08-28 Magnadrive Corporation Apparatus, systems and methods for reducing noise generated by rotating couplings

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224480A1 (en) * 2009-02-25 2010-09-01 Te-Lung Chen The Improved Structure of a Radiator

Citations (10)

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US3180404A (en) * 1959-12-02 1965-04-27 United Aircraft Prod Cooling electronic heat producing elements and the like
US3744559A (en) * 1971-03-03 1973-07-10 Western Electric Co Heat-transfer device for cooling heat-generating components
US6125921A (en) * 1999-03-16 2000-10-03 Chaun-Choung Industrial Corp. Radiator
US6367541B2 (en) * 1999-05-06 2002-04-09 Cool Options, Inc. Conforming heat sink assembly
US6397931B1 (en) * 2001-02-27 2002-06-04 The United States Of America As Represented By The Secretary Of The Air Force Finned heat exchanger
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6707675B1 (en) * 2002-12-18 2004-03-16 Hewlett-Packard Development Company, L.P. EMI containment device and method
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
US6748656B2 (en) * 2000-07-21 2004-06-15 Ats Automation Tooling Systems Inc. Folded-fin heatsink manufacturing method and apparatus

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180404A (en) * 1959-12-02 1965-04-27 United Aircraft Prod Cooling electronic heat producing elements and the like
US3744559A (en) * 1971-03-03 1973-07-10 Western Electric Co Heat-transfer device for cooling heat-generating components
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US6125921A (en) * 1999-03-16 2000-10-03 Chaun-Choung Industrial Corp. Radiator
US6367541B2 (en) * 1999-05-06 2002-04-09 Cool Options, Inc. Conforming heat sink assembly
US6748656B2 (en) * 2000-07-21 2004-06-15 Ats Automation Tooling Systems Inc. Folded-fin heatsink manufacturing method and apparatus
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6397931B1 (en) * 2001-02-27 2002-06-04 The United States Of America As Represented By The Secretary Of The Air Force Finned heat exchanger
US6735082B2 (en) * 2002-08-14 2004-05-11 Agilent Technologies, Inc. Heatsink with improved heat dissipation capability
US6707675B1 (en) * 2002-12-18 2004-03-16 Hewlett-Packard Development Company, L.P. EMI containment device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140239762A1 (en) * 2013-02-27 2014-08-28 Magnadrive Corporation Apparatus, systems and methods for reducing noise generated by rotating couplings

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AS Assignment

Owner name: DATECH TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, NIEN-LUN;CHU, CHIN-YUEH;REEL/FRAME:014945/0154

Effective date: 20031126

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION