AU2002211534A1 - Apparatus for providing heat dissipation for a circuit element - Google Patents

Apparatus for providing heat dissipation for a circuit element

Info

Publication number
AU2002211534A1
AU2002211534A1 AU2002211534A AU1153402A AU2002211534A1 AU 2002211534 A1 AU2002211534 A1 AU 2002211534A1 AU 2002211534 A AU2002211534 A AU 2002211534A AU 1153402 A AU1153402 A AU 1153402A AU 2002211534 A1 AU2002211534 A1 AU 2002211534A1
Authority
AU
Australia
Prior art keywords
heat dissipation
circuit element
providing heat
providing
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU2002211534A
Inventor
Kevin Charles Knoke
Robert James Ramspacher
Arnold Kay Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Licensing SAS
Original Assignee
Thomson Licensing SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing SAS filed Critical Thomson Licensing SAS
Publication of AU2002211534A1 publication Critical patent/AU2002211534A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
AU2002211534A 2000-10-27 2001-10-10 Apparatus for providing heat dissipation for a circuit element Withdrawn AU2002211534A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/698,738 US6545871B1 (en) 2000-10-27 2000-10-27 Apparatus for providing heat dissipation for a circuit element
US09698738 2000-10-27
PCT/US2001/031479 WO2002035901A1 (en) 2000-10-27 2001-10-10 Apparatus for providing heat dissipation for a circuit element

Publications (1)

Publication Number Publication Date
AU2002211534A1 true AU2002211534A1 (en) 2002-05-06

Family

ID=24806463

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211534A Withdrawn AU2002211534A1 (en) 2000-10-27 2001-10-10 Apparatus for providing heat dissipation for a circuit element

Country Status (3)

Country Link
US (1) US6545871B1 (en)
AU (1) AU2002211534A1 (en)
WO (1) WO2002035901A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW530995U (en) * 2002-02-05 2003-05-01 Wen-Chen Wei Heat sink base pad
US6728104B1 (en) * 2002-10-23 2004-04-27 Cisco Technology, Inc. Methods and apparatus for cooling a circuit board component
TW549573U (en) * 2002-11-27 2003-08-21 Via Tech Inc IC package for a multi-chip module
US6707675B1 (en) * 2002-12-18 2004-03-16 Hewlett-Packard Development Company, L.P. EMI containment device and method
US6914780B1 (en) 2003-01-16 2005-07-05 Cisco Technology, Inc. Methods and apparatus for cooling a circuit board component using a heat pipe assembly
TW556475B (en) * 2003-02-19 2003-10-01 Accton Technology Corp A cover apparatus for dissipating heat and shielding electromagnetic interference
KR100982257B1 (en) 2003-08-11 2010-09-15 엘지전자 주식회사 Memory heat-radiation structure for portable computer
US7180745B2 (en) * 2003-10-10 2007-02-20 Delphi Technologies, Inc. Flip chip heat sink package and method
TWI316387B (en) * 2003-12-30 2009-10-21 Asustek Comp Inc Electronic apparatus and shielding module thereof
US7113406B1 (en) * 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
TWI247574B (en) * 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
JP4498163B2 (en) * 2005-02-08 2010-07-07 株式会社東芝 Heat dissipation device for electronic equipment
JP2006222388A (en) * 2005-02-14 2006-08-24 Toshiba Corp Heat dissipation device and heat dissipation method of electronic apparatus
JP2006229046A (en) * 2005-02-18 2006-08-31 Toshiba Corp Heat radiator and heat radiating method for electronic apparatus
JP4445409B2 (en) * 2005-02-23 2010-04-07 株式会社東芝 Heat dissipation device for electronic equipment
JP2007012941A (en) * 2005-06-30 2007-01-18 Toshiba Corp Electronic apparatus and heat sink built therein
US7272006B2 (en) * 2005-09-30 2007-09-18 Intel Corporation IC coolant microchannel assembly with integrated attachment hardware
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US8264856B2 (en) 2006-08-18 2012-09-11 Delphi Technologies, Inc. Lightweight audio system for automotive: applications and method
US9237685B2 (en) 2006-08-18 2016-01-12 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
DE102011085870A1 (en) * 2011-11-07 2013-05-08 Lenze Automation Gmbh frequency converter
CN106922101B (en) * 2015-12-24 2018-12-21 宏达国际电子股份有限公司 Electronic device
DE112017000890T5 (en) * 2016-02-18 2018-10-31 Autonetworks Technologies, Ltd. Circuit and electrical connection box
TWI652982B (en) * 2017-12-22 2019-03-01 啓碁科技股份有限公司 Shielding structure
KR102476599B1 (en) * 2018-02-21 2022-12-12 삼성전자주식회사 Electronic device with shielding can structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5590026A (en) * 1995-07-31 1996-12-31 Borg-Warner Automotive, Inc. Apparatus for dissipating heat from an integrated circuit
FR2752661B1 (en) * 1996-08-23 1998-10-30 Giat Ind Sa METHOD FOR MANUFACTURING A DEVICE FOR DISSIPATING THERMAL ENERGY PRODUCED BY ELECTRONIC COMPONENTS IMPLANTED ON A PRINTED CIRCUIT BOARD, AND DEVICE THUS OBTAINED
JP3969772B2 (en) * 1996-10-31 2007-09-05 富士通株式会社 Microchip module unit
US5991155A (en) * 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
JP3597365B2 (en) * 1998-01-23 2004-12-08 アルプス電気株式会社 Electronics
JPH11289142A (en) * 1998-04-01 1999-10-19 Toshiba Corp Circuit module mounting structure and electronic apparatus incorporating it
JP3619670B2 (en) * 1998-05-27 2005-02-09 アルプス電気株式会社 Electronics
US6239972B1 (en) * 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions

Also Published As

Publication number Publication date
US6545871B1 (en) 2003-04-08
WO2002035901A1 (en) 2002-05-02

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