AU5221399A - Thermally-coupled heat dissipation apparatus for electronic devices - Google Patents

Thermally-coupled heat dissipation apparatus for electronic devices

Info

Publication number
AU5221399A
AU5221399A AU52213/99A AU5221399A AU5221399A AU 5221399 A AU5221399 A AU 5221399A AU 52213/99 A AU52213/99 A AU 52213/99A AU 5221399 A AU5221399 A AU 5221399A AU 5221399 A AU5221399 A AU 5221399A
Authority
AU
Australia
Prior art keywords
thermally
heat dissipation
electronic devices
dissipation apparatus
coupled heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU52213/99A
Inventor
Richard K. Allman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU5221399A publication Critical patent/AU5221399A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU52213/99A 1999-07-21 1999-07-21 Thermally-coupled heat dissipation apparatus for electronic devices Abandoned AU5221399A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/016503 WO2001008460A1 (en) 1999-07-21 1999-07-21 Thermally-coupled heat dissipation apparatus for electronic devices

Publications (1)

Publication Number Publication Date
AU5221399A true AU5221399A (en) 2001-02-13

Family

ID=22273251

Family Applications (1)

Application Number Title Priority Date Filing Date
AU52213/99A Abandoned AU5221399A (en) 1999-07-21 1999-07-21 Thermally-coupled heat dissipation apparatus for electronic devices

Country Status (2)

Country Link
AU (1) AU5221399A (en)
WO (1) WO2001008460A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108231708B (en) * 2016-12-14 2023-08-04 达纳加拿大公司 Heat exchanger for double-sided cooling of electronic modules
CN113775488B (en) * 2020-06-09 2024-04-19 金风科技股份有限公司 Cooling system and wind generating set

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867367A (en) * 1997-12-04 1999-02-02 Intel Corporation Quad flat pack integrated circuit package
US5953209A (en) * 1997-12-15 1999-09-14 Intel Corporation Push and pull dual-fan heat sink design
US5936836A (en) * 1997-12-19 1999-08-10 Dell U.S.A., L.P. Computer with an improved internal cooling system

Also Published As

Publication number Publication date
WO2001008460A1 (en) 2001-02-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase