AU2066801A - Cooler for electronic devices - Google Patents

Cooler for electronic devices

Info

Publication number
AU2066801A
AU2066801A AU20668/01A AU2066801A AU2066801A AU 2066801 A AU2066801 A AU 2066801A AU 20668/01 A AU20668/01 A AU 20668/01A AU 2066801 A AU2066801 A AU 2066801A AU 2066801 A AU2066801 A AU 2066801A
Authority
AU
Australia
Prior art keywords
cooler
electronic devices
electronic
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU20668/01A
Inventor
Nil Askhatov
Lev A. Fedoseyev
Yuriy Igorevich Fedosov
Edward Lopatinsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Rotary Systems LLC
Original Assignee
Advanced Rotary Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from RU99127326/28A external-priority patent/RU99127326A/en
Application filed by Advanced Rotary Systems LLC filed Critical Advanced Rotary Systems LLC
Publication of AU2066801A publication Critical patent/AU2066801A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU20668/01A 1999-12-09 2000-12-07 Cooler for electronic devices Abandoned AU2066801A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
RO99127326 1999-12-09
RU99127326/28A RU99127326A (en) 1999-12-09 ELECTRONIC COOLING DEVICE
RO2000111919 2000-05-05
RU2000111919/28A RU2000111919A (en) 2000-05-05 ELECTRONIC COOLING DEVICE (OPTIONS)
RO2000115814 2000-06-09
RU2000115814/28A RU2000115814A (en) 2000-06-09 ELECTRONIC COOLING DEVICE
PCT/US2000/033145 WO2001043519A1 (en) 1999-12-09 2000-12-07 Cooler for electronic devices

Publications (1)

Publication Number Publication Date
AU2066801A true AU2066801A (en) 2001-06-18

Family

ID=27354209

Family Applications (1)

Application Number Title Priority Date Filing Date
AU20668/01A Abandoned AU2066801A (en) 1999-12-09 2000-12-07 Cooler for electronic devices

Country Status (5)

Country Link
KR (1) KR20010112263A (en)
CN (1) CN1345527A (en)
AU (1) AU2066801A (en)
TW (1) TWI222344B (en)
WO (1) WO2001043519A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664673B2 (en) 2001-08-27 2003-12-16 Advanced Rotary Systems Llc Cooler for electronic devices
US7071587B2 (en) * 2001-09-07 2006-07-04 Rotys Inc. Integrated cooler for electronic devices
KR100450326B1 (en) * 2002-01-22 2004-09-30 성이제 Heat sink construction of largest radiant heat area
US8295046B2 (en) * 2010-07-19 2012-10-23 Hamilton Sundstrand Corporation Non-circular radial heat sink
TWI471084B (en) * 2012-02-21 2015-01-21 Wistron Corp Heat dissipating mechanism adapted to an electronic device and electronic device therewith
US20160345468A1 (en) * 2013-04-26 2016-11-24 CoolChip Technologies, Inc. Kinetic heat sink with stationary fins
US9639125B2 (en) * 2013-10-31 2017-05-02 Microsoft Technology Licensing, Llc Centrifugal fan with integrated thermal transfer unit
US9746888B2 (en) 2014-09-12 2017-08-29 Microsoft Technology Licensing, Llc Uniform flow heat sink
US20200348089A1 (en) * 2019-04-30 2020-11-05 Hamilton Sundstrand Corporation High efficiency integrated ax-radial blower and heat exchanger

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2632598A (en) * 1950-04-05 1953-03-24 Theodore Backer Centrifugal blower
JPH03253794A (en) * 1990-03-02 1991-11-12 Nissho Giken Kk Fluid circulator and its manufacture
JP2901867B2 (en) * 1993-03-19 1999-06-07 富士通株式会社 Heat sink and heat sink mounting structure
JP2765801B2 (en) * 1993-08-20 1998-06-18 山洋電気株式会社 Electronic component cooling device
US5661638A (en) * 1995-11-03 1997-08-26 Silicon Graphics, Inc. High performance spiral heat sink
JPH09172113A (en) * 1995-12-18 1997-06-30 Nec Corp Heat sink for semiconductor device
JP3206436B2 (en) * 1996-07-03 2001-09-10 松下電器産業株式会社 Heat sink device
US5794687A (en) * 1997-08-04 1998-08-18 International Business Machine Corp. Forced air cooling apparatus for semiconductor chips

Also Published As

Publication number Publication date
TWI222344B (en) 2004-10-11
KR20010112263A (en) 2001-12-20
CN1345527A (en) 2002-04-17
WO2001043519A1 (en) 2001-06-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase