AU2002222338A1 - Forced convection cooling system for electronic equipment - Google Patents

Forced convection cooling system for electronic equipment

Info

Publication number
AU2002222338A1
AU2002222338A1 AU2002222338A AU2233802A AU2002222338A1 AU 2002222338 A1 AU2002222338 A1 AU 2002222338A1 AU 2002222338 A AU2002222338 A AU 2002222338A AU 2233802 A AU2233802 A AU 2233802A AU 2002222338 A1 AU2002222338 A1 AU 2002222338A1
Authority
AU
Australia
Prior art keywords
electronic equipment
cooling system
forced convection
convection cooling
forced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002222338A
Inventor
Avinoam Livni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celletra Ltd
Original Assignee
Celletra Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celletra Ltd filed Critical Celletra Ltd
Publication of AU2002222338A1 publication Critical patent/AU2002222338A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
AU2002222338A 2000-12-12 2001-12-11 Forced convection cooling system for electronic equipment Abandoned AU2002222338A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/733,957 2000-12-12
US09/733,957 US6427466B1 (en) 2000-12-12 2000-12-12 Forced convection cooling system for electronic equipment
PCT/IB2001/002412 WO2002049400A2 (en) 2000-12-12 2001-12-11 Forced convection cooling system for electronic equipment

Publications (1)

Publication Number Publication Date
AU2002222338A1 true AU2002222338A1 (en) 2002-06-24

Family

ID=24949762

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002222338A Abandoned AU2002222338A1 (en) 2000-12-12 2001-12-11 Forced convection cooling system for electronic equipment

Country Status (3)

Country Link
US (2) US6427466B1 (en)
AU (1) AU2002222338A1 (en)
WO (1) WO2002049400A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
US7347267B2 (en) * 2004-11-19 2008-03-25 Halliburton Energy Services, Inc. Method and apparatus for cooling flasked instrument assemblies
US7440280B2 (en) * 2006-03-31 2008-10-21 Hong Kong Applied Science & Technology Research Institute Co., Ltd Heat exchange enhancement
US20070230185A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
US8376031B2 (en) * 2008-05-20 2013-02-19 Honeywell International Inc. Blowerless heat exchanger based on micro-jet entrainment
GB2476313A (en) 2009-12-21 2011-06-22 Bombardier Transp Gmbh Cooling of electronic devices located in a ground cavity
US9111918B2 (en) 2010-11-29 2015-08-18 Honeywell International Inc. Fin fabrication process for entrainment heat sink
US9277679B2 (en) 2010-11-29 2016-03-01 Honeywell International Inc. Heat sink fin including angular dimples
CN102595858A (en) * 2012-02-20 2012-07-18 华为技术有限公司 Remote air supply system combined with an outside plate (OSP) cabinet and integral shelter
WO2013163805A1 (en) * 2012-05-03 2013-11-07 Telefonaktiebolaget L M Ericsson(Publ) Method and apparatus for cooling a telecommunication device
US9540769B2 (en) 2013-03-11 2017-01-10 International Paper Company Method and apparatus for measuring and removing rotational variability from a nip pressure profile of a covered roll of a nip press
US9638057B2 (en) 2013-03-14 2017-05-02 Rolls-Royce North American Technologies, Inc. Augmented cooling system
CN103825533B (en) * 2014-02-26 2015-12-02 齐齐哈尔大学 A kind of power supply of communication equipment and heat abstractor
CN105407685B (en) * 2014-08-21 2017-12-22 华为技术有限公司 Communication products and base station system
CN104619155A (en) * 2015-02-05 2015-05-13 刘青建 Horizontal type sand mill voltage transformation circuit heat dissipation module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559728A (en) * 1968-11-29 1971-02-02 Kooltronic Fan Co Electronic equipment rack temperature control
US4399484A (en) 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
US4589898A (en) * 1984-12-17 1986-05-20 Ppg Industries, Inc. Method of cleaning heat transfer fins
US4962444A (en) 1989-01-03 1990-10-09 Sunstrand Corporation Cold chassis for cooling electronic circuit components on an electronic board
US5067047A (en) 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
US5428503A (en) 1992-03-24 1995-06-27 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
JP3006361B2 (en) * 1992-09-30 2000-02-07 株式会社日立製作所 Heat sink, electronic device using the same, and electronic computer using the electronic device
JPH08288438A (en) * 1995-04-14 1996-11-01 Hitachi Ltd Cooling device for electronic equipment
JP3651081B2 (en) * 1995-10-06 2005-05-25 株式会社デンソー Boiling cooler
JPH11145349A (en) * 1997-11-07 1999-05-28 Hitachi Ltd Heat sink for forced cooling
JP2000088394A (en) * 1998-09-16 2000-03-31 Yamaha Corp Heat exchanger
US6127663A (en) * 1998-10-09 2000-10-03 Ericsson Inc. Electronics cabinet cooling system
US6219258B1 (en) * 1999-01-29 2001-04-17 Ericsson Inc. Electronic enclosure with improved environmental protection

Also Published As

Publication number Publication date
US20020069660A1 (en) 2002-06-13
WO2002049400A2 (en) 2002-06-20
US20020069661A1 (en) 2002-06-13
US6427466B1 (en) 2002-08-06
WO2002049400A3 (en) 2002-08-22

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