US20020069661A1 - Forced convection cooling system for electronic equipment - Google Patents
Forced convection cooling system for electronic equipment Download PDFInfo
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- US20020069661A1 US20020069661A1 US10/022,517 US2251701A US2002069661A1 US 20020069661 A1 US20020069661 A1 US 20020069661A1 US 2251701 A US2251701 A US 2251701A US 2002069661 A1 US2002069661 A1 US 2002069661A1
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- 238000001816 cooling Methods 0.000 title claims abstract description 50
- 239000003570 air Substances 0.000 claims abstract description 68
- 239000012080 ambient air Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000010267 cellular communication Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 230000009972 noncorrosive effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 241000405070 Percophidae Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
Definitions
- FIG. 7B is a bottom view of the cooling system illustrated in FIG. 7A with the partial enclosure member in place;
- the cooling system of the invention is applicable to a variety of systems needing to more efficiently dissipate heat.
- the cooling system of the invention is particularly useful with systems having a heat dissipating element positioned in an environment that is not environmentally suited rotating fans or that is not easily accessible.
- FIG. 1 illustrates a particular embodiment of the invention where the elements dissipating heat are both in hostile environmental conditions and not easily accessible. That is, FIG. 1 generally illustrates an active cellular communication base station antenna system 10 utilizing a cooling system 12 of the present invention. Since the cooling system 12 has no moving parts at the remote location of the antenna subsystem 14 , a more efficient and durable cooling system is achieved for the antenna system 10 .
- the base station antenna system 10 includes an antenna subsystem 14 mounted in a raised fashion on a support structure 16 .
- Control equipment 20 for the antenna subsystem 14 is preferably positioned remote from the support structure 16 , for example, on a base 17 .
- the cooling system 12 can include a finned heat exchanger 22 connected to the antenna subsystem 14 for dissipating heat generated by the antenna subsystem 14 , an ejector assembly 24 having nozzles or ejectors 26 positioned between each pair of fins, and an air compressing mechanism 23 that can be located remote from the ejectors 26 and the antenna subsystem, for example, on base 17 .
- the heat exchanger 22 is conductively connected to one or more electrical or heat producing components of the antenna subsystem 14 . As such, heat generated by the antenna subsystem 14 is drawn therefrom into the heat exchanger 22 , by heat conduction.
- the heat exchanger 22 can be formed of a highly heat conductive material to aid in the heat conduction process. Heat generated by the electrical components of the antenna subsystem 14 flows through the conductive connectors into the heat exchanger 22 .
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling system for telecommunication equipment including a heat exchanger having outwardly protruding, parallel fins to dissipate heat. Each pair of fins forming an elongated channel. The system includes an ejector positioned within each channel to direct pressurized air through the channels while dragging ambient air through the channels along with the pressurized air. The pressurized and ambient air passing through the channels increases the ability of the fins to dissipate heat. Since the source of pressurized air can be remote from the telecommunications equipment in a protected and easily accessed location, the ejectors provide a rugged cooling mechanism adjacent the heat exchanger with no moving parts.
Description
- 1. Field of the Invention
- The present invention, in certain respects, relates to cooling electronic equipment. In other respects, the present invention relates to cooling telecommunication equipment in harsh environments.
- 2. Description of Background Information
- There is an ongoing need to cool high power electronic equipment efficiently and reliably. This is especially true with cellular communication base station antennas. These antennas are generally mounted atop high towers or masts in order to effectively transmit and receive signals. The environment in which these antennas are positioned is often hostile due to high temperatures, dust and other particles in the air, as well as to birds and insects. Therefore, previous attempts to cool such antennas have been ineffective. Atop towers and masts, use of conventional fans and blowers have limited life expectancy and are difficult to service. Natural convection heat exchangers are also deficient due to their excessive size and weight, which results in decreased efficiency. A harsh environment further decreases the efficiency of natural convention heat exchangers.
- Thus, there is a need for an efficient cooling system that is impervious to environmental conditions.
- The present invention is provided to improve cooling systems and cooling methods for electrical systems. More specifically, improved systems and methods are presented to provide a cooling system for electrical equipment of active cellular communication base station antennas that is efficient and that can be employed in hostile environmental conditions.
- A cooling system of the invention can include a finned, heat exchanger connected to a base station antenna atop a tower or pole. Air nozzles can be positioned in between pairs of fins and pressurized air forced through the nozzles blows between the pairs of fins to cool the fins. Ambient air surrounding the fins and nozzles can be dragged along with the pressurized air to further aid in cooling the fins. The pressurized air can be supplied to the nozzles from a remote source off the tower or pole so that the air source can be easily accessed or repaired.
- The present invention is further described in the detailed description which follows, by reference to the noted drawings by way of non-limiting exemplary embodiments, in which like reference numerals represent similar parts throughout the several views of the drawings, and wherein:
- FIG. 1 is a perspective view of a cellular communication base station antenna system illustrating a cooling system of the present invention;
- FIG. 2 is a front view of a portion of the cooling system illustrated in FIG. 1;
- FIG. 3 is a bottom view of the cooling system illustrated in FIG. 2;
- FIG. 4 is a sectional view of the cooling system taken along line4-4 in FIG. 3;
- FIG. 5 is a schematic view of the pneumatic system of the cooling system illustrated in FIG. 1;
- FIG. 6 is a cross-sectional view of the cooling system taken along line6-6 in FIG. 4;
- FIG. 7A is a front view of the cooling system similar to FIG. 2, but with a partial enclosure member installed thereon;
- FIG. 7B is a bottom view of the cooling system illustrated in FIG. 7A with the partial enclosure member in place;
- FIG. 8A is a front view of the cooling system similar to FIG. 2, but with a full enclosure member installed thereon;
- FIG. 8B is a bottom view of the cooling system illustrated in FIG. 8A with the full enclosure member in place;
- FIG. 9 is an alternate embodiment of the cooling system illustrating horizontally extending fins and nozzles;
- FIG. 10 is an alternate embodiment of the cooling system illustrating a pair of stacked heat exchangers;
- FIG. 11 is a bottom view of an embodiment of the cooling system for which testing was performed;
- FIG. 12 is a perspective of the cooling system shown in FIG. 11 showing a series of power resistors conductively connected thereto;
- FIG. 13 is a chart showing measured air flow velocities for heat exchanger channels with and without a cover on the heat exchanger;
- FIG. 14 is a graph showing the computed relation between the mean temperature difference and the velocity of air flow through the heat exchanger channels;
- FIG. 15 is similar to FIG. 2 but illustrates the nozzles and manifold at the bottom of the heat exchanger;
- FIG. 16 is a longitudinal cross-sectional view of the nozzle of the invention similar to FIG. 4, but illustrating a cover in a closed position mounted on the nozzle, with no air flowing through the nozzle; and
- FIG. 17 is a cross-sectional view similar to FIG. 16, but illustrating the cover in an open position with air flowing through the nozzle.
- The cooling system of the invention is applicable to a variety of systems needing to more efficiently dissipate heat. The cooling system of the invention is particularly useful with systems having a heat dissipating element positioned in an environment that is not environmentally suited rotating fans or that is not easily accessible. FIG. 1 illustrates a particular embodiment of the invention where the elements dissipating heat are both in hostile environmental conditions and not easily accessible. That is, FIG. 1 generally illustrates an active cellular communication base
station antenna system 10 utilizing acooling system 12 of the present invention. Since thecooling system 12 has no moving parts at the remote location of theantenna subsystem 14, a more efficient and durable cooling system is achieved for theantenna system 10. - The base
station antenna system 10 includes anantenna subsystem 14 mounted in a raised fashion on asupport structure 16.Control equipment 20 for theantenna subsystem 14 is preferably positioned remote from thesupport structure 16, for example, on a base 17. Thecooling system 12 can include afinned heat exchanger 22 connected to theantenna subsystem 14 for dissipating heat generated by theantenna subsystem 14, anejector assembly 24 having nozzles orejectors 26 positioned between each pair of fins, and anair compressing mechanism 23 that can be located remote from theejectors 26 and the antenna subsystem, for example, on base 17. - The
antenna subsystem 14 can be of any type and is illustrated as being mounted on a support structure such asmast 16 as illustrated in FIG. 1. Of course,antenna subsystem 14 can be mounted on any appropriate support structure that raises the antenna to its appropriate height. This may include a truss structure and can includesupport structures 16 mounted on the ground or on another structure, such as a building.Control equipment 20 for the basestation antenna system 10 can be positioned as appropriate and is preferably positioned remote from thesupport structure 16 and on base 17. Thecontrol equipment 20 for the basestation antenna system 10 can be operatively connected to theantenna subsystem 14 in a usual manner, such as via a series of cables 21. - The
heat exchanger 22 is conductively connected to one or more electrical or heat producing components of theantenna subsystem 14. As such, heat generated by theantenna subsystem 14 is drawn therefrom into theheat exchanger 22, by heat conduction. Theheat exchanger 22 can be formed of a highly heat conductive material to aid in the heat conduction process. Heat generated by the electrical components of theantenna subsystem 14 flows through the conductive connectors into theheat exchanger 22. - As shown in FIGS. 2 and 3, the
heat exchanger 22 can be equipped with a series of spaced,heat dissipating fins 32 that extend outwardly from abody portion 34 of the heat exchanger. Thefins 32 increase the area of anexterior surface 35 of theheat exchanger 22 and therefore increase the heat exchanging capacity of theheat exchanger 22. Heat flowing into theheat exchanger 22 from theantenna subsystem 14 is liberated from theexterior surface 35 into the atmosphere through heat convection. Thefins 32 can be formed in various configurations depending on the desired heat exchanging properties. For example, thefins 32 can be substantially flat or can be corrugated. - Natural convection from ambient airflow dissipates heat from the
heat exchanger 22 and provides a flow of cooling medium such as atmospheric air across theexterior surface 35 of theheat exchanger 22. An increase in the area of theexterior surface 35, such as by addingfins 32, corresponds to an increase in heat dissipation possible by theheat exchanger 22. - As illustrated in FIGS. 1 and 2, the
ejector assembly 24 has a series of ejectors ornozzles 26 that can be connected to amanifold structure 28. Themanifold structure 28 can be, in turn, connected to aconduit 30 that extends from thecompressing mechanism 23 so that air can be supplied to the manifold 28 byconduit 30. - Although the
manifold structure 28 can take numerous forms, one form is illustrated in FIGS. 2 and 3. The illustratedmanifold structure 28 can extend along theheat exchanger 22 transverse to thefins 32 while extending through thefins 32 and can include a series ofejectors 26 connected thereto. The manifold structure can be connected to theconduit 30 on oneend 36, while being sealed on anopposite end 38. As such, pressurized air from thecompressor 23 can enter themanifold structure 28 at theend 36 thereof and can exit through each of theejectors 26. Themanifold structure 28 can be a tubular member with a series of spaced openings for attachment toejectors 26, which correspond to the cavities between each pair offins 32. Themanifold structure 28 can be formed of any suitable material. Preferably,manifold 28 is formed from a non-corrosive material such as stainless steel or plastics. As illustrated in FIG. 1, themanifold structure 28 may be mounted to a portion of theantenna subsystem 14, for example with a pair of connecting members 39 (see also FIG. 2), such that theejectors 26 are disposed betweencorresponding fins 32 of theheat exchanger 22. The manifold 28 may be mounted on the bottom side of the finned heat exchanger, thus using the natural convection flow effect of upwardly increasing temperature. - As illustrated in FIG. 4, an
ejector 26 can be secured within acorresponding opening 40 within themanifold structure 28 in any appropriate manner. For example, theejectors 26 may be securely press-fit within the correspondingopenings 40, or that they may be welded in position. Also, it may be advantageous for theejectors 26 to be removably connected to themanifold structure 28, such as by a threaded connection, as illustrated. - As further shown in FIG. 4, each of the
ejectors 26 has acentral opening 42 that extends longitudinally though anejector body 44. One (entry) end 48 of thecentral opening 42 is communicated with anair pathway 46 of themanifold structure 28, while an opposite (exit) end 50 of thecentral opening 42 communicates with the atmosphere. Thecentral opening 42 may be configured with a venturi shape, as shown in FIG. 4 to increase the velocity of air flowing therethrough. Although the dimensions of the nozzle can vary depending upon the desired performance and size characteristics, theentry end 48 can exhibit an approximately 120 degree converging funnel shape and thecentral opening 42 can exhibit an approximately 10-20 degree diverging funnel shape. Also, theexit diameter 110 of the nozzle is preferably approximately 1.5 times larger than therestrictor diameter 120, as seen in FIG. 4. - It may be advantageous for each
ejector 26 to include a polymer cover to protect the exit end 50 of thecentral opening 42. One preferred design is a “duckbill”elastomeric cover 52 which remains closed as seen in FIG. 16 when no air passes throughnozzle 26 and then, as seen in FIG. 17, cover 52 opens when air is forced throughnozzle 26. Thus, thecover 52 can keep unwanted debris from enteringnozzle 26 and keeps thenozzle 26 free from clogging. - As shown in FIG. 1, it may be preferable for the
heat exchanger 22 and theejector assembly 24 to be mounted on theantenna subsystem 14 such that theejectors 26 point generally downwardly. In this manner, thecentral openings 42 of theejectors 26 may be less prone to contamination and/or damage than in an upwardly pointing configuration. On the other hand, as seen in FIG. 15, upwardly pointing nozzles are thermally more effective, as the flow increases by natural convection effects. - It is noted that the cooling system of the present invention can be made generally impervious to environmental conditions by enclosing all of the mechanical mechanisms such as an
air compressor 23 within anenclosure 18, as shown in FIG. 1. It is noted that thecompressing mechanism 23 may require relatively little maintenance, since it can be disposed within theenclosure 18 and is not exposed to severe environmental conditions. Furthermore, theconduit 30 may be formed of any appropriate material such as weather resistant hose or pipe to avoid degradation of theconduit 30, for example, a suitable medium-pressure polymer hose or non-corrosive pipe could be employed. The other structures such as themanifold structure 28 and theejectors 26 may also be formed of non-corrosive materials to avoid degradation. In a case where thecompressing mechanism 23 requires servicing, the compressingstructure 23 is readily accessible and serviceable. - The general operation of the cooling system of the present invention is as follows. FIG. 5 shows a schematic diagram representing the
cooling system 12 of the present invention. As shown, thecompressing mechanism 23 preferably includes anelectric motor 54, which is operatively coupled to apneumatic compressing structure 56. Thepneumatic compressing structure 56 compresses air from the atmosphere through aserviceable inlet filter 57 and produces a flow of compressed air. The compressingstructure 56 is connected to avalve 58, which allows the compressingstructure 56 to be isolated and the flow of compressed air to be redirected, preferably into the atmosphere, so that the various components of thecooling system 12 may be serviced. Agauge 60 is communicated with the air flow between the compressingstructure 56 and thevalve 58 to monitor the pressure of the air therein. Apressure reducing valve 62 maintains the air flow to theejector assembly 24 at a constant pressure. It may also be advantageous to include amicronic filter 64, which screens particles from the air flow in order to prevent clogging of thecentral openings 42 of theejectors 26. The air flow is then communicated to theejector assembly 24 via theconduit 30. - Referring to FIG. 6, the
compressing mechanism 23 produces a compressed fluid such ascompressed air 25, which is directed to theejectors 26. Theejectors 26 then emit and direct a pressurized stream of air (indicated at A in FIG. 6) between the correspondingfins 32 of theheat exchanger 22. The stream of air A then flows generally between thefins 32 and within a channel orcavity 66, cooperatively formed betweenadjacent fins 32 and asurface 33 of thebody portion 34, along the length of theheat exchanger 22. - The venturi configuration of the
central openings 42, as described previously, serves to increase the velocity of the pressurized air flowing through theejectors 26. Therefore, upon exit from eachejector 26, the corresponding stream of air A has a relatively high velocity. It is preferred that the velocity will be as high as possible. Sonic or supersonic velocities give better cooling performance. It is noted that a velocity of the total air flow in between the fins of about 2 m/sec may be advantageous for inducing efficient forced convection. The high velocity air A exiting theejector 26 “pulls” or “drags” the atmospheric air proximate the exit end 50 of theejector 26 producing a pressure differential (i.e., a suction force toward the exit end 50). As such, air from the atmosphere is pulled (indicated at B in FIG. 6) into the stream of air (indicated at C in FIG. 6) exiting theejector 26 and forced down thechannel 66. Therefore, volumetric flow rate of air traveling across theexterior surface 35 of theheat exchanger 22 is increased, effectively increasing the heat dissipation capacity of theheat exchanger 22. - Various configurations are possible for the
cooling system 1. For example, the shape and spacing of thefins 32 can be varied as well as the shape and specific dimensions of theejectors 26 to obtain desired relationships and cooling characteristics for the desired implementation of the cooling system. Additionally, the manner of providing compressed air or other fluid toejectors 26 can take various forms, such utilizing a single, integrally formedmanifold 28. - There are various additional embodiments of the cooling system of the present invention that are possible. The embodiments shown and described herein are exemplary examples and are illustrated with respect to the illustrated system of FIGS.1-6. Other embodiments are, of course, possible.
- FIGS. 7A and 7B show a
partial enclosure member 70 attached to theheat exchanger 22. Thepartial enclosure member 70 serves to overlay and enclose a portion of thechannels 66 of theheat exchanger 22. Thepartial enclosure member 70 prevents the air stream from exiting the correspondingchannels 66 prior to reaching the far end of eachchannel 66 to thereby maintain a high volumetric flow rate across theheat exchanger 22. Since the air stream is substantially prevented from dispersing into the atmosphere until the stream passes over a significant surface area of theheat exchanger 22, the efficiency of thecooling system 12 may be enhanced.Enclosure member 70 can be positioned at various positions with respect to thenozzles 26. For example, theenclosure member 70 can begin to cover thechannels 66 at thenozzles 26 such that theedge 71 of thecover 70 is aligned with thenozzles 26 and is positioned over thenozzles 26, as illustrated in FIG. 7A. Alternatively, the beginning of thecover 70 can be positioned upstream or downstream ofchannel 66 with respect to eachnozzle 26 to permit the desired amount of ambient air adjacent eachnozzle 26 to be “dragged” into and throughchannel 66 by the air exiting fromnozzle 26. - FIGS. 8A and 8B show a
full enclosure member 72 attached to theheat exchanger 22. Similar to the embodiment illustrated in FIGS. 7A and 7B, the air streams are directed over a significant surface area of theheat exchanger 22 to enhance the efficiency thereof.Member 72 has anedge 73 that is preferably positioned over thenozzles 26. With either of the embodiments shown in FIGS. 7A through 8B, it may be preferable for theenclosure members enclosure members heat exchanger 22. It is contemplated that among the many options in forming theenclosure members enclosure members enclosure members - FIG. 9 illustrates an additional embodiment of a
heat exchanger 22′ andejector assembly 24′ of the cooling system of the present invention. In this embodiment, theheat exchanger 22′ includes a laterally extending, longitudinally spaced series offins 32′. Additionally, for this embodiment, themanifold structure 28′ may extend the length of theheat exchanger 22′ and include a greater amount ofejectors 26′ disposed withinchannels 66′ of theheat exchanger 22′. As shown, theejector assembly 24′ utilizes a larger number ofejectors 26′ as compared with the embodiment illustrated in FIGS. 1-8B. It is noted that a rate of air flow through eachejector 26′ may be relatively lower than that through eachejector 26 sincemore ejectors 26′ are used, however, as shown, the air streams (indicated at D in FIG. 9) have a relatively shorter distance to travel if thefins 32′ are shorter and are directed along a width of theheat exchanger 22′. As such, an average flow rate across theheat exchanger 22′ may be comparable to that acrossheat exchanger 22. This embodiment may have the advantage of producing lower temperature differences between air entering thechannels 66 and the air exiting thechannels 66 to ambient air, thus, keeping the heat exchanger at a more uniform temperature. - FIG. 10 shows yet another embodiment of the invention in the form of a set of
stacked heat exchangers 82. It is contemplated that two ormore heat exchangers 82 may be utilized in this embodiment. As shown, this embodiment includes oneejector assembly 24 for each of theheat exchangers 82. Theejector assemblies 24 are interconnected at a connectingstructure 84, which is connected to theconduit 30. This embodiment may be used to enhance the efficiency of the cooling system of the present invention, or may be used to cool separate components of theantenna subsystem 14 The following includes a tested configuration of the cooling system of the invention along with observations and data from conducted tests. The tested configuration and resulting data is not meant to be limiting with respect to the scope of the present invention but illustrates specific performance characteristics associated with a specific configuration of an apparatus employing some of the principles of the invention. - FIGS. 11 and 12 show a test embodiment of a heat exchanger at100 and
ejector assembly 101, as tested. Theejector assembly 101 includes a series of fifteen laterally spacedejectors 102. As shown, theheat exchanger 100 includes sixteenfins 104, extending upwardly from abody portion 105 of theheat exchanger 100. Thefins 104 extend the length of theheat exchanger 100 and are laterally spaced from each other along the width of thebody portion 105. There is approximately 13 mm betweenadjacent fins 104, forming fifteen channels (c1 to c15), each having a width of approximately 13 mm, across the width of theheat exchanger 100. Each channel c1 to c15 has a cross-sectional area of approximately 2.4 cm2, providing a total flow area of approximately 36 cm2. - As further shown, four
power resistors 106 are attached to an opposite side of thebody portion 105. Thepower resistors 106 allow the amount of heat input to theheat exchanger 100 to be predetermined and controlled. A pair ofthermocouples 108 measure a temperature gradient of theheat exchanger 100 between one end (proximate the ejector assembly) and an opposite end (opposite the ejector assembly 101) thereof. The test were conducted under 3 bar and 3.5 bar (gauge) pressures feeding theejector assembly 101. The heat load from thepower resistors 106 was 147 watts. The ambient temperature was 26° C. and varied ±1° C. during the test period. - FIG. 13 shows the measured air velocities within the channels (c1-c15) of the
heat exchanger 100 with a cover (similar to the embodiment illustrated in FIG. 7A) and without a cover (similar to the embodiment illustrated in FIG. 2). The average air velocity was approximately 2.17 m/sec. The average temperature difference between thethermocouples 108 was approximately 12.6° C. The amplification ratio between the volumetric flow rate of the air through the channels (c1-c15) and the air exiting theejectors 102 was found to be ε=30.5; meaning the volume flow rate of air through the channels was 30.5 times the volume flow rate of air through the ejectors. Furthermore, the convection factor of theheat exchanger 100, as tested with theejector assembly 101, was approximately 38 W/(m2° C.), compared with approximately 5.5 W/(m2° C.) for natural convection. - FIG. 14 shows a computed model of the relation between the air speed (in m/sec) of the air flowing through the channels of the heat exchanger and the average temperature difference (in degrees Celsius) between the temperature of the fins of the heat exchanger and the temperature of the ambient air. As shown, for natural convection (air speed equal to approximately 0 m/sec), the mean temperature difference is approximately 88° C., while for an air speed of approximately 2.5 m/sec, the mean temperature difference is approximately 11° C.; meaning heat is more rapidly liberated from the heat exchanger under forced convection. As stated previously, the average air velocity as tested was approximately 2.17 m/sec. From the computed model described above, this velocity corresponds to a mean temperature difference of approximately 13° C. The measured mean temperature difference of the cooling system, as tested, was approximately 14° C., which closely correlates to the computed model. As such, it is shown that the computed efficiency of the cooling system is possible with the present invention.
- While the invention has been described with reference to the certain illustrated embodiments, the words which have been used herein are words of description, rather than words or limitation. Changes may be made, within the purview of the appended claims, without departing from the scope and spirit of the invention in its aspects. Although the invention has been described herein with reference to particular structures, acts, and materials, the invention is not to be limited to the particulars disclosed, but rather extends to all equivalent structures, acts, and materials, such as are within the scope of the appended claims.
Claims (10)
1. A cooling system comprising:
a heat exchanger having two spaced, longitudinally extending fins protruding from an outwardly facing surface, each of said fins having a first end and a second end, said fins and said surface forming a longitudinal cavity extending between said first and second ends of said fins; and
an ejector coupled to said heat exchanger and positioned within said cavity and between said fins such that a gap exists between said ejector and each of said fins, said ejector having an exit opening facing toward a far end of said cavity to direct air passing through said ejector and ambient air along said cavity toward said far end to dissipate heat from said fins.
2. The cooling system of claim 1 , wherein
said fins are substantially parallel to each other.
3. A system according to claim 1 , further comprising:
a cover positioned over a portion of said cavity.
4. A system according to claim 1 , wherein
said apparatus is coupled to a top of a telecommunications antenna.
5. A system according to claim 1 , further comprising:
an air compressor fluidly coupled to said ejector and positioned off of said antenna.
6. A system for cooling telecommunications electronic equipment comprising:
a heat exchanger including a heat exchanger body and a pair of elongated, flat or corrugated fins protruding outwardly from said heat exchanger, each of said pair of fins being substantially parallel and in spaced relation to each other, and a longitudinally extending channel formed between said pair of fins and extending the length of said pair of fins;
means for directing pressurized air through said channel while dragging ambient air through said channel to dissipate heat in said pair of fins.
7. A system according to claim 6 , further comprising:
means for sending or receiving telecommunication signals.
8. A method of cooling telecommunication equipment, comprising:
providing an antenna with a heat exchanger on a support structure;
directing pressurized air from a compressor remote and spaced from said support structure to said heat exchanger;
forcing the pressurized air over the heat exchanger to dissipate heat from the heat exchanger;
forming a negative pressure in an area adjacent the heat exchanger; and
dragging ambient air adjacent the heat exchanger away from the heat exchanger to further dissipate heat from the heat exchanger.
9. A system according to claim 6 , wherein
said fins are substantially flat.
10. A system according to claim 6 , wherein
said fins are corrugated.
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US10/022,517 US20020069661A1 (en) | 2000-12-12 | 2001-12-20 | Forced convection cooling system for electronic equipment |
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US09/733,957 US6427466B1 (en) | 2000-12-12 | 2000-12-12 | Forced convection cooling system for electronic equipment |
US10/022,517 US20020069661A1 (en) | 2000-12-12 | 2001-12-20 | Forced convection cooling system for electronic equipment |
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US09/733,957 Continuation US6427466B1 (en) | 2000-12-12 | 2000-12-12 | Forced convection cooling system for electronic equipment |
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US09/733,957 Expired - Fee Related US6427466B1 (en) | 2000-12-12 | 2000-12-12 | Forced convection cooling system for electronic equipment |
US10/022,517 Abandoned US20020069661A1 (en) | 2000-12-12 | 2001-12-20 | Forced convection cooling system for electronic equipment |
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Cited By (5)
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US20090272143A1 (en) * | 2008-05-02 | 2009-11-05 | Thermaltake Technology Co., Ltd. | computer cooling apparatus |
US20090288807A1 (en) * | 2008-05-20 | 2009-11-26 | Honeywell International Inc. | Blowerless heat exchanger based on micro-jet entrainment |
CN103825533A (en) * | 2014-02-26 | 2014-05-28 | 齐齐哈尔大学 | Power supplying and cooling device for communication device |
US9111918B2 (en) | 2010-11-29 | 2015-08-18 | Honeywell International Inc. | Fin fabrication process for entrainment heat sink |
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Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3559728A (en) * | 1968-11-29 | 1971-02-02 | Kooltronic Fan Co | Electronic equipment rack temperature control |
US4399484A (en) | 1981-03-10 | 1983-08-16 | The United States Of America As Represented By The Secretary Of The Air Force | Integral electric module and assembly jet cooling system |
US4589898A (en) * | 1984-12-17 | 1986-05-20 | Ppg Industries, Inc. | Method of cleaning heat transfer fins |
US4962444A (en) | 1989-01-03 | 1990-10-09 | Sunstrand Corporation | Cold chassis for cooling electronic circuit components on an electronic board |
US5067047A (en) | 1990-05-11 | 1991-11-19 | At&T Bell Laboratories | Circuit pack with inboard jet cooling |
US5428503A (en) | 1992-03-24 | 1995-06-27 | Hitachi, Ltd. | Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon |
JP3006361B2 (en) * | 1992-09-30 | 2000-02-07 | 株式会社日立製作所 | Heat sink, electronic device using the same, and electronic computer using the electronic device |
JPH08288438A (en) * | 1995-04-14 | 1996-11-01 | Hitachi Ltd | Cooling device for electronic equipment |
JP3651081B2 (en) * | 1995-10-06 | 2005-05-25 | 株式会社デンソー | Boiling cooler |
JPH11145349A (en) * | 1997-11-07 | 1999-05-28 | Hitachi Ltd | Heat sink for forced cooling |
JP2000088394A (en) * | 1998-09-16 | 2000-03-31 | Yamaha Corp | Heat exchanger |
US6127663A (en) * | 1998-10-09 | 2000-10-03 | Ericsson Inc. | Electronics cabinet cooling system |
US6219258B1 (en) * | 1999-01-29 | 2001-04-17 | Ericsson Inc. | Electronic enclosure with improved environmental protection |
-
2000
- 2000-12-12 US US09/733,957 patent/US6427466B1/en not_active Expired - Fee Related
-
2001
- 2001-12-11 AU AU2002222338A patent/AU2002222338A1/en not_active Abandoned
- 2001-12-11 WO PCT/IB2001/002412 patent/WO2002049400A2/en not_active Application Discontinuation
- 2001-12-20 US US10/022,517 patent/US20020069661A1/en not_active Abandoned
Cited By (7)
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US20090272143A1 (en) * | 2008-05-02 | 2009-11-05 | Thermaltake Technology Co., Ltd. | computer cooling apparatus |
US8302419B2 (en) * | 2008-05-02 | 2012-11-06 | Thermal Take Technology Co., Ltd. | Computer cooling apparatus |
US20090288807A1 (en) * | 2008-05-20 | 2009-11-26 | Honeywell International Inc. | Blowerless heat exchanger based on micro-jet entrainment |
US8376031B2 (en) * | 2008-05-20 | 2013-02-19 | Honeywell International Inc. | Blowerless heat exchanger based on micro-jet entrainment |
US9111918B2 (en) | 2010-11-29 | 2015-08-18 | Honeywell International Inc. | Fin fabrication process for entrainment heat sink |
US9277679B2 (en) | 2010-11-29 | 2016-03-01 | Honeywell International Inc. | Heat sink fin including angular dimples |
CN103825533A (en) * | 2014-02-26 | 2014-05-28 | 齐齐哈尔大学 | Power supplying and cooling device for communication device |
Also Published As
Publication number | Publication date |
---|---|
US20020069660A1 (en) | 2002-06-13 |
US6427466B1 (en) | 2002-08-06 |
WO2002049400A2 (en) | 2002-06-20 |
WO2002049400A3 (en) | 2002-08-22 |
AU2002222338A1 (en) | 2002-06-24 |
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