GB0015937D0 - An improved structure for a heat dissipation device - Google Patents

An improved structure for a heat dissipation device

Info

Publication number
GB0015937D0
GB0015937D0 GB0015937A GB0015937A GB0015937D0 GB 0015937 D0 GB0015937 D0 GB 0015937D0 GB 0015937 A GB0015937 A GB 0015937A GB 0015937 A GB0015937 A GB 0015937A GB 0015937 D0 GB0015937 D0 GB 0015937D0
Authority
GB
United Kingdom
Prior art keywords
heat dissipation
dissipation device
improved structure
improved
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0015937A
Other versions
GB2364179A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JERN RU IND CO Ltd
Original Assignee
JERN RU IND CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JERN RU IND CO Ltd filed Critical JERN RU IND CO Ltd
Priority to GB0015937A priority Critical patent/GB2364179A/en
Publication of GB0015937D0 publication Critical patent/GB0015937D0/en
Publication of GB2364179A publication Critical patent/GB2364179A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0015937A 2000-06-30 2000-06-30 A heat dissipation device Withdrawn GB2364179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0015937A GB2364179A (en) 2000-06-30 2000-06-30 A heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0015937A GB2364179A (en) 2000-06-30 2000-06-30 A heat dissipation device

Publications (2)

Publication Number Publication Date
GB0015937D0 true GB0015937D0 (en) 2000-08-23
GB2364179A GB2364179A (en) 2002-01-16

Family

ID=9894652

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0015937A Withdrawn GB2364179A (en) 2000-06-30 2000-06-30 A heat dissipation device

Country Status (1)

Country Link
GB (1) GB2364179A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004040069A (en) * 2002-07-01 2004-02-05 Chin Kuang Luo Heat dissipating device
US20070188993A1 (en) * 2006-02-14 2007-08-16 Gallina Mark J Quasi-radial heatsink with rectangular form factor and uniform fin length

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4449164A (en) * 1982-09-27 1984-05-15 Control Data Corporation Electronic module cooling system using parallel air streams
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
US4695924A (en) * 1986-07-17 1987-09-22 Zenith Electronics Corporation Two piece heat sink with serrated coupling

Also Published As

Publication number Publication date
GB2364179A (en) 2002-01-16

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)