GB2364179A - A heat dissipation device - Google Patents
A heat dissipation device Download PDFInfo
- Publication number
- GB2364179A GB2364179A GB0015937A GB0015937A GB2364179A GB 2364179 A GB2364179 A GB 2364179A GB 0015937 A GB0015937 A GB 0015937A GB 0015937 A GB0015937 A GB 0015937A GB 2364179 A GB2364179 A GB 2364179A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat dissipation
- heat
- dissipation device
- improved structure
- finned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An improved structure for a heat dissipation device comprises a heat-conductive heat collection seat (2), a finned heat dissipation sleeve (3), a hood (4) and a fan (5) wherein the base seat (21) of the collection seat has a plurality of fixing hole (211) for mounting at a position on a CPU, characterized in that the heat-conductive heat collection seat (2) is constituted of a one-piece heat-conductive tube (22) and the base seat (21).
Description
2364179 TITLE: AN IMPROVED STRUCTURE FOR A HEAT DISSIPATION DEVICE
BACKGROUND OF THE INVENTION
(a) Technical Field of the Invention
The present invention relates to a heat dissipation device, and in particular, to an improved structure for a heat dissipation device which is mounted close to the CPU of a PC to dissipate heat energy produced therefrom.
(b) Description of the Prior Art
When a PC is in operation, due to heat energy produced by the PC, the temperature within the computer increases If the CPU is overheated, the entire computer will not function normally Therefore, heat dissipation device is installed to the CPU to dissipate heat Referring to Fig 1, there is shown a conventional heat dissipation device 1 comprising a base seat 11, and a heat conductive tube 13, and the device 1 is used to dissipate heat A fan 15 is mounted to withdraw hot air, but if the heat energy cannot be collected at a specific location the fan 15 cannot be effectively performed its function In the conventional structure, the heat energy at the base seat 11 is collected but the heat conductive tube 13 is mounted onto the base seat 11 with a plastic body 12 The heat conduction of plastic body 12 is poor, and the plastic body 12 may be dislocated after a period of time As a result, the heat energy of the base seat 11 cannot be effectively transmitted to the heat conductive tube 13 Due to collection of excessive heat within the computer, the CPU may be malfunctioned or damaged.
Referring to Fig 2, there is shown a CPU 9 being slotted onto a mother board 7 The heat dissipation device 14 has a heat dissipation fin 16 having the size of the CPU 9 The top of the fin 16 is mounted with a fan 15.
However, such heat dissipation device 14 does not have a heat collection system and the heat energy cannot be collected As a result, the efficiency of heat dissipation is poor, and the heat energy will remain at the fin 16 and flow back to the CPU 9 The excessive heat at the CPU 9 will damage the CPU 9 and cause a malfunction to the CPU 9.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention is to provide an improved structure for a heat dissipation device comprising a heatconductive heat collection seat, a finned heat dissipation sleeve, a hood, a fan, a base seat with a plurality of fixing holes for mounting at an appropriate position above a CPU, characterized in that the heat-conductive heat collection seat is constituted from a one-piece heat-conductive tube and the base seat.
Yet another object of the present invention is to provide an improved structure for a heat dissipation device, wherein the heat dissipation effect of this device is excellent.
Another object of the present invention is to provide an improved structure for a heat dissipation device, wherein the heat energy can be effectively collected for dissipation.
A further object of the present invention is to provide an improved structure for a heat dissipation device, wherein the heat collection seat is a one piece structure.
The foregoing objects and summary provide only a brief introduction to the present invention To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the invention and the claims should be read in conjunction with the accompanying drawings Throughout the specification and drawings identical reference numerals refer to identical or similar parts Many other advantages and features of the present invention will become manifest to those versed in the art upon making reference to the detailed description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig 1 is a perspective exploded view of a conventional heat dissipation device.
Fig 2 is a schematic view of a conventional heat dissipation device.
Fig 3 is a perspective exploded view of a heat dissipation device of the present invention.
Fig 4 is a perspective view of the heat dissipation device of the present invention.
Fig 5 is a preferred embodiment of the dissipation device of the present invention mounted onto a mother board of a computer.
Fig 6 is another preferred embodiment of the dissipation device of the present invention mounted onto a mother board of a computer.
Figs 7 to 9 are heat dissipation steps in accordance with the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiment illustrated in the drawings Specific language will be used to describe same It will, nevertheless, be understood that no limitation of the scope of the invention is thereby intended, such alterations and further modifications in the illustrated device, and such further applications of the principles of the invention as illustrated herein being contemplated as would normally occur to one skilled in the art to which the invention relates.
Referring to Figs 3 and 4, there is shown an improved structure for a heat dissipation device comprising a heat-conductive heat collection seat 2, a finned heat dissipation sleeve 3, a hood 4, a fan 5, and a plurality of screws 6.
The heat-conductive heat collection seat 2 comprises a one-piece heatconductive tube 22 and a base seat 21 having a plurality of fixing holes 211.
The plurality of screws 6 are used to secure the heat dissipation device of the present invention onto the top of the CPU of a computer The center of the finned heat dissipation sleeve 3 is provided with an elongated hollow slot 32 such that the heat-conductive tube 22 can be inserted within the slot 32 as a shaft center of the dissipation device A plurality of heat dissipation plates 31 are provided to the sleeve 32 in such a way that the dissipation plates 31 are extended outward The external shape of the finned heat dissipation sleeve 3 is substantially a square shape, and a fan-like gap 33 is formed between a pair of individual heat dissipation plate 31 The hood 4 being substantially a box- like structure comprises four blocking plates 43 mounted perpendicularly to each other along their side edges The top of the four blocking plates 43 is covered with a top blocking plate 44 with a center cavity 41 forming into a square-shaped body The center cavity slot 41 is formed within the square- shaped body, and the capacity of the cavity slot 4 is slightly larger than the size of the finned heat dissipation sleeve 3, such that the hood 4 can be mounted onto the top of the finned heat dissipation sleeve 3 The surroundings of the top blocking plate 44 are provided with a plurality of bottom screw holes 42 such that the fan 5 can be mounted onto the top screw holes 51 provided on the edge of fan 15 by screws 6 and the fan is secured at the bottom screw holes 42 of the hood 4 The center of the top blocking plate 44 is provided with a circular opening allowing the air to be withdrawn by the fan 5.
Referring to Fig 5, a plurality of screws 6 are used to mount at the fixing holes 211 of the base seat 21 and the heat dissipation device is fixed to the top of the CPU 8 located on the mother board 7.
Referring to Fig 6, the heat dissipation device of the present invention can be applied to another type of CPU 9 which is inserted into slots on a mother board 7 A plurality of screws 6 pass through a plurality of fixing holes 21 on the base plate 21 and then the heat dissipation device of the present invention is mounted to the CPU 9.
Referring to Figs 7,8 and 9, the arrow indicates the directions of heat flow.
As shown in Fig 7, the heat from the CPU 8 is transmitted via the base seat 21 of the heat-conductive heat collection seat 2 and collected at the heat conductive tube 22 The heat-conductive heat collection seat 2 comprises a one-piece heat dissipation tube 22 and the base seat 21 such that the heat energy is effectively collected at the heat conductive tube 22.
Referring to Fig 8, the heat energy of the heat-conductive tube 22 is dissipated out via the heat dissipation plates 31, and the remaining heat energy which cannot be self-dissipated is collected at the fan-like gaps 33 formed between two individual heat dissipation plates 31.
As shown in Fig 9, the rest of the heat energy, and the heat energy collected at the gap 33 are gathered within the hood 4 The convection current by the fan 5 draws away the heat Thus, the CPU 8 at the mother board 7 will not be overheated but can operate normally to provide effective working condition.
It will be understood that each of the elements described above, or two or more together may also find a useful application in other types of methods differing from the type described above.
While certain novel features of this invention have been shown and described and are pointed out in the annexed claimn, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.
Claims (4)
1 An improved structure for a heat dissipation device comprising a heatconductive heat collection seat, a finned heat dissipation sleeve, a hood,
a fan and a base seat having a plurality of fixing holes for mounting at a position on a CPU, characterized in that the heat-conductive heat collection seat is constituted of an one-piece heat-conductive tube and the base seat.
2 An improved structure for a heat dissipation device as set forth in Claim 1, wherein the center of the finned heat dissipation sleeve is an elongated hollow slot for the mounting of the heat-conductive tube.
3 An improved structure for a heat dissipation device as set forth in Claim 2, wherein the finned heat dissipation sleeve comprises a plurality of outwardly and radially arranged heat dissipation plates, and the external shape of the finned heat dissipation sleeve is a square, and a fan-like gap is formed between each individual heat dissipation plates.
4 An improved structure for a heat dissipation device as set forth in Claim 1, wherein the hood is formed from four blocking plates perpendicularly to each other, and the top of the four blocking plates is covered with a top blocking plate forming into a square-shaped body, and a cavity slot is formed within the square-shaped body, and the capacity of the cavity slot is slightly larger than the size of the finned heat dissipation sleeve, and the hood is mounted onto the top portion of the finned heat dissipation sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0015937A GB2364179A (en) | 2000-06-30 | 2000-06-30 | A heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0015937A GB2364179A (en) | 2000-06-30 | 2000-06-30 | A heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0015937D0 GB0015937D0 (en) | 2000-08-23 |
| GB2364179A true GB2364179A (en) | 2002-01-16 |
Family
ID=9894652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0015937A Withdrawn GB2364179A (en) | 2000-06-30 | 2000-06-30 | A heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2364179A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2390482A (en) * | 2002-07-01 | 2004-01-07 | Chin-Kuang Luo | Heat dissipating device |
| WO2007095369A2 (en) * | 2006-02-14 | 2007-08-23 | Intel Corporation | Quasi-radial heatsink with rectangular form factor and uniform fin length |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4449164A (en) * | 1982-09-27 | 1984-05-15 | Control Data Corporation | Electronic module cooling system using parallel air streams |
| US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
| US4695924A (en) * | 1986-07-17 | 1987-09-22 | Zenith Electronics Corporation | Two piece heat sink with serrated coupling |
-
2000
- 2000-06-30 GB GB0015937A patent/GB2364179A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4449164A (en) * | 1982-09-27 | 1984-05-15 | Control Data Corporation | Electronic module cooling system using parallel air streams |
| US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
| US4695924A (en) * | 1986-07-17 | 1987-09-22 | Zenith Electronics Corporation | Two piece heat sink with serrated coupling |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2390482A (en) * | 2002-07-01 | 2004-01-07 | Chin-Kuang Luo | Heat dissipating device |
| WO2007095369A2 (en) * | 2006-02-14 | 2007-08-23 | Intel Corporation | Quasi-radial heatsink with rectangular form factor and uniform fin length |
| WO2007095369A3 (en) * | 2006-02-14 | 2007-11-15 | Intel Corp | Quasi-radial heatsink with rectangular form factor and uniform fin length |
| US7471518B2 (en) | 2006-02-14 | 2008-12-30 | Intel Corporation | Quasi-radial heatsink with rectangular form factor and uniform fin length |
| US7646607B2 (en) | 2006-02-14 | 2010-01-12 | Intel Corporation | Quasi-radial heatsink with rectangular form factor and uniform fin length |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0015937D0 (en) | 2000-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |