AU2002221941A1 - Interconnecting flexible printed boards - Google Patents

Interconnecting flexible printed boards

Info

Publication number
AU2002221941A1
AU2002221941A1 AU2002221941A AU2194102A AU2002221941A1 AU 2002221941 A1 AU2002221941 A1 AU 2002221941A1 AU 2002221941 A AU2002221941 A AU 2002221941A AU 2194102 A AU2194102 A AU 2194102A AU 2002221941 A1 AU2002221941 A1 AU 2002221941A1
Authority
AU
Australia
Prior art keywords
flexible printed
printed boards
interconnecting flexible
interconnecting
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002221941A
Other languages
English (en)
Inventor
Arno Hohmann
Rudolf Zapf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of AU2002221941A1 publication Critical patent/AU2002221941A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AU2002221941A 2000-12-15 2001-12-06 Interconnecting flexible printed boards Abandoned AU2002221941A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10062840 2000-12-15
DE2000162840 DE10062840A1 (de) 2000-12-15 2000-12-15 Durchkontaktierung von flexiblen Leiterplatten
PCT/EP2001/014351 WO2002049403A1 (de) 2000-12-15 2001-12-06 Durchkontaktierung von flexiblen leiterplatten

Publications (1)

Publication Number Publication Date
AU2002221941A1 true AU2002221941A1 (en) 2002-06-24

Family

ID=7667477

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002221941A Abandoned AU2002221941A1 (en) 2000-12-15 2001-12-06 Interconnecting flexible printed boards

Country Status (3)

Country Link
AU (1) AU2002221941A1 (de)
DE (1) DE10062840A1 (de)
WO (1) WO2002049403A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10304867B4 (de) * 2003-02-06 2008-06-19 Hubertus Dipl.-Ing. Hein Verfahren und Vorrichtung zur Herstellung einer Leiterplattenanordnung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2353061A (en) * 1940-10-29 1944-07-04 Ibm Circuit connecting device
GB1565207A (en) * 1975-09-05 1980-04-16 Sinclair Radionics Printed circuits
FR2468279A1 (fr) * 1979-10-19 1981-04-30 Dujardin Editions Procede de fabrication de plaques comportant au moins un circuit imprime
JPS63296387A (ja) * 1987-05-28 1988-12-02 Ibiden Co Ltd Ｉｃカ−ド用プリント配線板
JPH02186693A (ja) * 1989-01-13 1990-07-20 Casio Comput Co Ltd 両面基板の製造方法
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
JPH03225991A (ja) * 1990-01-31 1991-10-04 Fujikura Ltd フレキシブルプリント配線板及びその製造方法
DE4239228A1 (de) * 1992-11-21 1994-06-01 Alois Kornexl Vorrichtung zum dosierten Aufbringen von Klebstoffen
DE4439108C1 (de) * 1994-11-02 1996-04-11 Lpkf Cad Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten
DE19735387A1 (de) * 1997-08-14 1999-02-18 Siemens Ag Trägerkarte und Halbleitermodul für eine derartige Trägerkarte
US6353420B1 (en) * 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna

Also Published As

Publication number Publication date
WO2002049403A1 (de) 2002-06-20
DE10062840A1 (de) 2002-06-20

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