AU2001296533A1 - System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlay - Google Patents
System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlayInfo
- Publication number
- AU2001296533A1 AU2001296533A1 AU2001296533A AU9653301A AU2001296533A1 AU 2001296533 A1 AU2001296533 A1 AU 2001296533A1 AU 2001296533 A AU2001296533 A AU 2001296533A AU 9653301 A AU9653301 A AU 9653301A AU 2001296533 A1 AU2001296533 A1 AU 2001296533A1
- Authority
- AU
- Australia
- Prior art keywords
- overlay
- wafer alignment
- mitigating effects
- reticle rotation
- facilitating wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24257400P | 2000-10-23 | 2000-10-23 | |
US60242574 | 2000-10-23 | ||
US09/788,905 US6552790B1 (en) | 2001-02-20 | 2001-02-20 | System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlay |
US09788905 | 2001-02-20 | ||
PCT/US2001/030931 WO2002035288A1 (en) | 2000-10-23 | 2001-10-02 | System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlay |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001296533A1 true AU2001296533A1 (en) | 2002-05-06 |
Family
ID=26935176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001296533A Abandoned AU2001296533A1 (en) | 2000-10-23 | 2001-10-02 | System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlay |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1330681B1 (de) |
AU (1) | AU2001296533A1 (de) |
TW (1) | TW508641B (de) |
WO (1) | WO2002035288A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI338819B (en) | 2006-06-23 | 2011-03-11 | Ind Tech Res Inst | Recticle pattern applied to mix-and-match lithography process and alignment method of thereof |
CN101750899B (zh) * | 2008-12-04 | 2011-06-22 | 上海华虹Nec电子有限公司 | 光刻版图及其测量光刻形变的方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4595295A (en) | 1982-01-06 | 1986-06-17 | International Business Machines Corporation | Alignment system for lithographic proximity printing |
JPH0616478B2 (ja) | 1983-12-19 | 1994-03-02 | 株式会社ニコン | 投影露光装置の位置合せ装置 |
US4769523A (en) | 1985-03-08 | 1988-09-06 | Nippon Kogaku K.K. | Laser processing apparatus |
US4662754A (en) * | 1985-12-20 | 1987-05-05 | The Perkin-Elmer Corporation | Method for facilitating the alignment of a photomask with individual fields on the surfaces of a number of wafers |
JP2676933B2 (ja) * | 1988-09-05 | 1997-11-17 | キヤノン株式会社 | 位置検出装置 |
US5656229A (en) | 1990-02-20 | 1997-08-12 | Nikon Corporation | Method for removing a thin film layer |
JPH0444307A (ja) * | 1990-06-12 | 1992-02-14 | Nec Corp | 半導体装置の製造方法 |
US5272501A (en) | 1991-08-28 | 1993-12-21 | Nikon Corporation | Projection exposure apparatus |
US5699260A (en) * | 1995-03-14 | 1997-12-16 | Analog Devices, Incorporated | Technique for optimizing the number of IC chips obtainable from a wafer |
US6159644A (en) * | 1996-03-06 | 2000-12-12 | Hitachi, Ltd. | Method of fabricating semiconductor circuit devices utilizing multiple exposures |
US6269322B1 (en) * | 1999-03-11 | 2001-07-31 | Advanced Micro Devices, Inc. | System and method for wafer alignment which mitigates effects of reticle rotation and magnification on overlay |
US6639676B1 (en) * | 1999-10-21 | 2003-10-28 | Koninklijke Philips Electronics N.V. | Method for determining rotational error portion of total misalignment error in a stepper |
-
2001
- 2001-10-02 WO PCT/US2001/030931 patent/WO2002035288A1/en active Application Filing
- 2001-10-02 AU AU2001296533A patent/AU2001296533A1/en not_active Abandoned
- 2001-10-02 EP EP01977412.4A patent/EP1330681B1/de not_active Expired - Lifetime
- 2001-10-23 TW TW90126118A patent/TW508641B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1330681A1 (de) | 2003-07-30 |
TW508641B (en) | 2002-11-01 |
WO2002035288A1 (en) | 2002-05-02 |
EP1330681B1 (de) | 2013-09-18 |
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