AU2001287045A1 - Robust fluid flow and property microsensor made of optimal material - Google Patents
Robust fluid flow and property microsensor made of optimal materialInfo
- Publication number
- AU2001287045A1 AU2001287045A1 AU2001287045A AU8704501A AU2001287045A1 AU 2001287045 A1 AU2001287045 A1 AU 2001287045A1 AU 2001287045 A AU2001287045 A AU 2001287045A AU 8704501 A AU8704501 A AU 8704501A AU 2001287045 A1 AU2001287045 A1 AU 2001287045A1
- Authority
- AU
- Australia
- Prior art keywords
- sensor
- die
- glass
- physical property
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000463 material Substances 0.000 title claims description 74
- 239000012530 fluid Substances 0.000 title claims description 24
- 239000011521 glass Substances 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 52
- 239000010703 silicon Substances 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 15
- 238000002161 passivation Methods 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000006089 photosensitive glass Substances 0.000 claims description 5
- 230000007613 environmental effect Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 claims 19
- 239000000919 ceramic Substances 0.000 claims 3
- 230000000873 masking effect Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000000137 annealing Methods 0.000 claims 1
- 238000011049 filling Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000037361 pathway Effects 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 239000010410 layer Substances 0.000 description 18
- 230000004907 flux Effects 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 12
- 238000002955 isolation Methods 0.000 description 9
- 239000012528 membrane Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- PBZHKWVYRQRZQC-UHFFFAOYSA-N [Si+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O Chemical compound [Si+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PBZHKWVYRQRZQC-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F5/00—Measuring a proportion of the volume flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N1/2247—Sampling from a flowing stream of gas
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
- G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
- G01N25/4873—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation for a flowing, e.g. gas sample
- G01N25/488—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0011—Sample conditioning
- G01N33/0014—Sample conditioning by eliminating a gas
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/22—Devices for withdrawing samples in the gaseous state
- G01N2001/2285—Details of probe structures
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Fluid Mechanics (AREA)
- Combustion & Propulsion (AREA)
- Molecular Biology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Biomedical Technology (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Measuring Volume Flow (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/656,694 US7109842B1 (en) | 1998-12-07 | 2000-09-07 | Robust fluid flow and property microsensor made of optimal material |
| US09656694 | 2000-09-07 | ||
| PCT/US2001/027368 WO2002021083A1 (en) | 2000-09-07 | 2001-09-04 | Robust fluid flow and property microsensor made of optimal material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001287045A1 true AU2001287045A1 (en) | 2002-03-22 |
Family
ID=24634159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001287045A Abandoned AU2001287045A1 (en) | 2000-09-07 | 2001-09-04 | Robust fluid flow and property microsensor made of optimal material |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7109842B1 (ko) |
| EP (1) | EP1315949A1 (ko) |
| JP (1) | JP2004513331A (ko) |
| KR (1) | KR20030029161A (ko) |
| CN (1) | CN1236289C (ko) |
| AU (1) | AU2001287045A1 (ko) |
| WO (1) | WO2002021083A1 (ko) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7258003B2 (en) | 1998-12-07 | 2007-08-21 | Honeywell International Inc. | Flow sensor with self-aligned flow channel |
| US6794981B2 (en) * | 1998-12-07 | 2004-09-21 | Honeywell International Inc. | Integratable-fluid flow and property microsensor assembly |
| EP1351039A1 (en) * | 2002-04-03 | 2003-10-08 | Sensirion AG | Flow sensor and method for producing the same |
| DE10232072B4 (de) * | 2002-07-15 | 2005-03-24 | Robert Bosch Gmbh | Verfahren zur Reinigung eines von einem Gasstrom umströmten Messelementes |
| JP4504037B2 (ja) * | 2004-02-02 | 2010-07-14 | 大日本印刷株式会社 | 光学素子 |
| US7892488B2 (en) * | 2006-02-10 | 2011-02-22 | Honeywell International, Inc. | Thermal liquid flow sensor and method of forming same |
| US7500392B1 (en) | 2007-10-11 | 2009-03-10 | Memsys, Inc. | Solid state microanemometer device and method of fabrication |
| US8018065B2 (en) * | 2008-02-28 | 2011-09-13 | Atmel Corporation | Wafer-level integrated circuit package with top and bottom side electrical connections |
| US8261618B2 (en) * | 2010-11-22 | 2012-09-11 | General Electric Company | Device for measuring properties of working fluids |
| JP2014016237A (ja) * | 2012-07-09 | 2014-01-30 | Azbil Corp | フローセンサ |
| JP2014016238A (ja) * | 2012-07-09 | 2014-01-30 | Azbil Corp | フローセンサ |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2516873A (en) * | 1945-10-05 | 1950-08-01 | Ralph J Havens | Bolometer |
| US3680028A (en) * | 1971-04-02 | 1972-07-25 | Motorola Inc | Vertical resistor |
| US4007435A (en) * | 1973-07-30 | 1977-02-08 | Tien Tseng Ying | Sensor device and method of manufacturing same |
| CA1040746A (en) * | 1976-06-30 | 1978-10-17 | Robert W. Bertram | Thin film resistance temperature detector |
| US4400684A (en) * | 1981-08-31 | 1983-08-23 | Ford Motor Company | Fast response temperature sensor |
| DE3302080A1 (de) * | 1983-01-22 | 1984-07-26 | Leybold-Heraeus GmbH, 5000 Köln | Thermischer massendurchflussmesser, insbesondere fuer gase |
| JPS60243549A (ja) * | 1984-05-05 | 1985-12-03 | ゲゼルシヤフト、フユール、ゲレーテバウ、ミツト、ベシユレンクテル、ハフツング | ガスの触媒燃焼用のセンサの製造方法 |
| GB2162167B (en) * | 1984-06-01 | 1988-01-20 | Narumi China Corp | Ceramic substrate material |
| US4722609A (en) * | 1985-05-28 | 1988-02-02 | The United States Of America As Represented By The Secretary Of The Navy | High frequency response multilayer heat flux gauge configuration |
| JP2564845B2 (ja) * | 1987-09-04 | 1996-12-18 | 株式会社村田製作所 | 白金温度センサ |
| US5057811A (en) * | 1988-12-22 | 1991-10-15 | Texas Instruments Incorporated | Electrothermal sensor |
| US5075253A (en) * | 1989-04-12 | 1991-12-24 | Advanced Micro Devices, Inc. | Method of coplanar integration of semiconductor IC devices |
| US5032896A (en) * | 1989-08-31 | 1991-07-16 | Hughes Aircraft Company | 3-D integrated circuit assembly employing discrete chips |
| DE4012080A1 (de) * | 1990-04-14 | 1991-10-17 | Bosch Gmbh Robert | Verfahren zum aufbau von mikromechanischen sensoren |
| DE4020383C2 (de) * | 1990-06-27 | 1999-04-01 | Bosch Gmbh Robert | Verfahren zum Schutz von Katalysatoren für die Abgasreinigung sowie Wärmetönungssensor zur Durchführung des Verfahrens |
| JPH0483301A (ja) * | 1990-07-25 | 1992-03-17 | Matsushita Electric Ind Co Ltd | 薄膜サーミスタ |
| US5056362A (en) * | 1990-07-25 | 1991-10-15 | Siemens Automotive L.P. | Strengthening a silicon micromachined mass air flow sensor in the region of its hot element |
| FR2670579A1 (fr) * | 1990-12-14 | 1992-06-19 | Schlumberger Ind Sa | Capteur semi-conducteur de debit. |
| WO1992015101A1 (de) * | 1991-02-15 | 1992-09-03 | Siemens Aktiengesellschaft | Hochtemperatur-platinmetall-temperatursensor |
| DE4139631C1 (en) * | 1991-11-30 | 1993-03-11 | Robert Bosch Gmbh, 7000 Stuttgart, De | Measuring element for intake air flowmeter of IC engine - has slot in substrate board separating film resistors |
| JP2654308B2 (ja) * | 1992-03-03 | 1997-09-17 | 株式会社三協精機製作所 | 感光性ガラス基板の安定化方法 |
| US5374123A (en) * | 1992-05-20 | 1994-12-20 | Goldstar Co., Ltd. | Thermal comfort sensing device |
| DE4233284C2 (de) * | 1992-10-02 | 1997-01-30 | Kobold Klaus | Kalorimetrischer Strömungswächter |
| US5422513A (en) * | 1992-10-16 | 1995-06-06 | Martin Marietta Corporation | Integrated circuit chip placement in a high density interconnect structure |
| US5605612A (en) * | 1993-11-11 | 1997-02-25 | Goldstar Electron Co., Ltd. | Gas sensor and manufacturing method of the same |
| JP3512225B2 (ja) * | 1994-02-28 | 2004-03-29 | 株式会社日立製作所 | 多層配線基板の製造方法 |
| US5511428A (en) * | 1994-06-10 | 1996-04-30 | Massachusetts Institute Of Technology | Backside contact of sensor microstructures |
| US5666272A (en) * | 1994-11-29 | 1997-09-09 | Sgs-Thomson Microelectronics, Inc. | Detachable module/ball grid array package |
| JP3282773B2 (ja) * | 1994-12-12 | 2002-05-20 | 東京瓦斯株式会社 | 熱式流量計 |
| US5550526A (en) * | 1994-12-27 | 1996-08-27 | Lucent Technologies Inc. | Thermal detection elements with heater |
| JP3494747B2 (ja) * | 1995-03-31 | 2004-02-09 | 石塚電子株式会社 | 薄膜温度センサ及びその製造方法 |
| JPH0972763A (ja) | 1995-09-07 | 1997-03-18 | Ricoh Co Ltd | マイクロセンサ |
| US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
| US5831333A (en) * | 1996-05-14 | 1998-11-03 | Sun Microsystems, Inc. | Integrated junction temperature sensor/package design and method of implementing same |
| US5795545A (en) * | 1996-05-20 | 1998-08-18 | Motorola Inc. | Integrated ceramic exhaust gas sensors |
| EP0856825B1 (en) * | 1997-01-31 | 2004-11-17 | STMicroelectronics S.r.l. | Process for manufacturing integrated semiconductor devices comprising a chemoresistive gas microsensor |
| US6052287A (en) * | 1997-12-09 | 2000-04-18 | Sandia Corporation | Silicon ball grid array chip carrier |
| US6032527A (en) * | 1998-07-01 | 2000-03-07 | Memsys, Inc. | Solid state microanemometer |
| US6114739A (en) * | 1998-10-19 | 2000-09-05 | Agilent Technologies | Elevated pin diode active pixel sensor which includes a patterned doped semiconductor electrode |
| US6184773B1 (en) | 1998-12-07 | 2001-02-06 | Honeywell Inc. | Rugged fluid flow and property microsensor |
| US6736741B2 (en) * | 2000-03-17 | 2004-05-18 | Delbert Clarke Pile | Apparatus and method for a retractable basketball backboard and hoop assembly |
-
2000
- 2000-09-07 US US09/656,694 patent/US7109842B1/en not_active Expired - Fee Related
-
2001
- 2001-09-04 KR KR10-2003-7003402A patent/KR20030029161A/ko not_active Application Discontinuation
- 2001-09-04 EP EP01966541A patent/EP1315949A1/en not_active Withdrawn
- 2001-09-04 AU AU2001287045A patent/AU2001287045A1/en not_active Abandoned
- 2001-09-04 JP JP2002525453A patent/JP2004513331A/ja active Pending
- 2001-09-04 WO PCT/US2001/027368 patent/WO2002021083A1/en active Application Filing
- 2001-09-04 CN CNB018185290A patent/CN1236289C/zh not_active Expired - Fee Related
-
2003
- 2003-01-07 US US10/337,746 patent/US20030098771A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US7109842B1 (en) | 2006-09-19 |
| CN1236289C (zh) | 2006-01-11 |
| KR20030029161A (ko) | 2003-04-11 |
| WO2002021083A1 (en) | 2002-03-14 |
| US20030098771A1 (en) | 2003-05-29 |
| EP1315949A1 (en) | 2003-06-04 |
| CN1473261A (zh) | 2004-02-04 |
| JP2004513331A (ja) | 2004-04-30 |
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