AU2001286946A1 - Edge grip aligner with buffering capabilities - Google Patents

Edge grip aligner with buffering capabilities

Info

Publication number
AU2001286946A1
AU2001286946A1 AU2001286946A AU8694601A AU2001286946A1 AU 2001286946 A1 AU2001286946 A1 AU 2001286946A1 AU 2001286946 A AU2001286946 A AU 2001286946A AU 8694601 A AU8694601 A AU 8694601A AU 2001286946 A1 AU2001286946 A1 AU 2001286946A1
Authority
AU
Australia
Prior art keywords
edge grip
buffering capabilities
aligner
grip aligner
buffering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286946A
Other languages
English (en)
Inventor
Daniel Babbs
Matthew Coady
William J. Fosnight
Jae Hong Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Technologies Inc
Original Assignee
ASYST TECHNOLOGIES
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASYST TECHNOLOGIES, Asyst Technologies Inc filed Critical ASYST TECHNOLOGIES
Publication of AU2001286946A1 publication Critical patent/AU2001286946A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
AU2001286946A 2000-09-01 2001-08-29 Edge grip aligner with buffering capabilities Abandoned AU2001286946A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23016200P 2000-09-01 2000-09-01
US60/230,162 2000-09-01
PCT/US2001/027090 WO2002018107A1 (en) 2000-09-01 2001-08-29 Edge grip aligner with buffering capabilities

Publications (1)

Publication Number Publication Date
AU2001286946A1 true AU2001286946A1 (en) 2002-03-13

Family

ID=22864171

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286946A Abandoned AU2001286946A1 (en) 2000-09-01 2001-08-29 Edge grip aligner with buffering capabilities

Country Status (8)

Country Link
US (2) US6591960B2 (ja)
EP (1) EP1401617A1 (ja)
JP (2) JP5259907B2 (ja)
KR (1) KR100885082B1 (ja)
CN (1) CN100398272C (ja)
AU (1) AU2001286946A1 (ja)
TW (1) TW513773B (ja)
WO (1) WO2002018107A1 (ja)

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US6854948B1 (en) 2002-08-15 2005-02-15 Nanometrics Incorporated Stage with two substrate buffer station
US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
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US7665946B2 (en) * 2003-11-04 2010-02-23 Advanced Display Process Engineering Co., Ltd. Transfer chamber for flat display device manufacturing apparatus
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
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US20050183824A1 (en) * 2004-02-25 2005-08-25 Advanced Display Process Engineering Co., Ltd. Apparatus for manufacturing flat-panel display
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US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
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US8545165B2 (en) * 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
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TWI476855B (zh) * 2006-05-03 2015-03-11 Gen Co Ltd 基板傳輸設備、和使用該設備的高速基板處理系統
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JP5226508B2 (ja) * 2006-05-16 2013-07-03 ローツェ株式会社 シャトル型搬送装置
KR100751496B1 (ko) * 2006-05-25 2007-08-23 이종대 반도체 웨이퍼의 진공 및 에지 그립 얼라인 장치 및 그것을이용한 얼라인방법
US7896602B2 (en) 2006-06-09 2011-03-01 Lutz Rebstock Workpiece stocker with circular configuration
US8376428B2 (en) * 2006-11-15 2013-02-19 Dynamic Micro System Semiconductor Equipment GmbH Integrated gripper for workpiece transfer
US20080112787A1 (en) 2006-11-15 2008-05-15 Dynamic Micro Systems Removable compartments for workpiece stocker
JP5537947B2 (ja) * 2006-11-27 2014-07-02 テック・セム アーゲー オーバーヘッド型搬送システム用搬送装置
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
KR101349460B1 (ko) * 2007-06-22 2014-01-09 엘지이노텍 주식회사 서셉터 이송 장치
US8099190B2 (en) * 2007-06-22 2012-01-17 Asm International N.V. Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
US7953511B1 (en) * 2007-09-21 2011-05-31 National Semiconductor Corporation System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system
US8757345B2 (en) * 2009-04-29 2014-06-24 Novellus Systems, Inc. Magnetic rotational hardstop for robot
US8079459B2 (en) * 2009-11-19 2011-12-20 The Unites States Of America As Represented By The Secretary Of The Army Transport apparatus
US20110248738A1 (en) * 2010-04-12 2011-10-13 Sze Chak Tong Testing apparatus for electronic devices
CN102371535B (zh) * 2010-08-11 2014-07-23 中国电子科技集团公司第四十五研究所 应用于化学机械抛光设备中的硅片定位装载装置
US9176397B2 (en) * 2011-04-28 2015-11-03 Mapper Lithography Ip B.V. Apparatus for transferring a substrate in a lithography system
EP2590209A1 (en) * 2011-11-01 2013-05-08 Gintech Energy Corporation Gripper
US8322766B1 (en) 2011-11-02 2012-12-04 Gintech Energy Corporation Wafer gripper
CN104144857B (zh) * 2012-02-10 2016-11-02 株式会社汤山制作所 药剂盒
US9472433B2 (en) * 2012-09-05 2016-10-18 Murata Machinery, Ltd. Mounting port and mounting port opening/closing method
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JP2017513036A (ja) 2014-11-14 2017-05-25 マッパー・リソグラフィー・アイピー・ビー．ブイ． 貨物固定システムおよびリソグラフィシステム内で基板を移送するための方法
US9640418B2 (en) * 2015-05-15 2017-05-02 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
US11183401B2 (en) 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
US10157475B2 (en) * 2015-05-19 2018-12-18 Ismeca Semiconductor Holding Sa Component handling assembly and method of adjusting a component handling assembly
JP6701007B2 (ja) * 2016-06-27 2020-05-27 川崎重工業株式会社 ワーク保持機構
US9966292B2 (en) * 2016-07-12 2018-05-08 Globalfoundries Inc. Centering fixture for electrostatic chuck system
CN106340486A (zh) * 2016-09-26 2017-01-18 天津华海清科机电科技有限公司 晶圆夹持装置
CN108312169A (zh) * 2018-04-17 2018-07-24 丹阳市精通眼镜技术创新服务中心有限公司 一种镜片自动夹持装置和方法
TWI725818B (zh) * 2020-04-14 2021-04-21 天虹科技股份有限公司 晶圓對準機台
CN111604810B (zh) * 2020-07-24 2020-11-03 杭州众硅电子科技有限公司 一种晶圆传输设备、化学机械平坦化装置及晶圆传输方法
CN111890406B (zh) * 2020-08-07 2021-09-24 江苏昱博自动化设备有限公司 一种助力机械手用抱夹式夹具
CN113898784A (zh) * 2021-08-30 2022-01-07 江苏宣宣重工机械有限公司 一种非开挖管道矩形工作井摇管机械及矩形工作井的施工方法

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Also Published As

Publication number Publication date
US6591960B2 (en) 2003-07-15
US6729462B2 (en) 2004-05-04
JP2012147024A (ja) 2012-08-02
WO2002018107A1 (en) 2002-03-07
JP5579773B2 (ja) 2014-08-27
EP1401617A1 (en) 2004-03-31
JP5259907B2 (ja) 2013-08-07
TW513773B (en) 2002-12-11
KR100885082B1 (ko) 2009-02-25
CN1479667A (zh) 2004-03-03
KR20030036748A (ko) 2003-05-09
US20030196870A1 (en) 2003-10-23
US20020048506A1 (en) 2002-04-25
CN100398272C (zh) 2008-07-02
JP2004508700A (ja) 2004-03-18
WO2002018107A9 (en) 2003-08-14

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