AU2001286668A1 - Sputtering targets - Google Patents

Sputtering targets

Info

Publication number
AU2001286668A1
AU2001286668A1 AU2001286668A AU8666801A AU2001286668A1 AU 2001286668 A1 AU2001286668 A1 AU 2001286668A1 AU 2001286668 A AU2001286668 A AU 2001286668A AU 8666801 A AU8666801 A AU 8666801A AU 2001286668 A1 AU2001286668 A1 AU 2001286668A1
Authority
AU
Australia
Prior art keywords
sputtering targets
sputtering
targets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286668A
Inventor
Jaeyeon Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/643,038 external-priority patent/US6497797B1/en
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2001286668A1 publication Critical patent/AU2001286668A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
AU2001286668A 2000-08-21 2001-08-21 Sputtering targets Abandoned AU2001286668A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/643,038 2000-08-21
US09/643,038 US6497797B1 (en) 2000-08-21 2000-08-21 Methods of forming sputtering targets, and sputtering targets formed thereby
US30047301P 2001-06-22 2001-06-22
US60/300,473 2001-06-22
PCT/US2001/026347 WO2002016667A2 (en) 2000-08-21 2001-08-21 Sputtering targets

Publications (1)

Publication Number Publication Date
AU2001286668A1 true AU2001286668A1 (en) 2002-03-04

Family

ID=26971802

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286668A Abandoned AU2001286668A1 (en) 2000-08-21 2001-08-21 Sputtering targets

Country Status (2)

Country Link
AU (1) AU2001286668A1 (en)
WO (1) WO2002016667A2 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215639A (en) * 1984-10-09 1993-06-01 Genus, Inc. Composite sputtering target structures and process for producing such structures
JPS6199674A (en) * 1984-10-22 1986-05-17 Hitachi Ltd Sputtering electrode
JPS6342369A (en) * 1986-08-08 1988-02-23 Fujitsu Ltd Sputtering treatment device
JP2624727B2 (en) * 1987-11-17 1997-06-25 日立金属株式会社 Method for producing Co-Ni-Cr alloy target material
US5428882A (en) * 1993-04-05 1995-07-04 The Regents Of The University Of California Process for the fabrication of aluminum metallized pyrolytic graphite sputtering targets
JP2720755B2 (en) * 1993-04-23 1998-03-04 三菱マテリアル株式会社 Ti target material for magnetron sputtering
JPH0860353A (en) * 1994-08-24 1996-03-05 Ulvac Japan Ltd Sputtering cathode
JPH08325719A (en) * 1995-05-29 1996-12-10 Sony Corp Sputtering device
US6068742A (en) * 1996-07-22 2000-05-30 Balzers Aktiengesellschaft Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source

Also Published As

Publication number Publication date
WO2002016667A2 (en) 2002-02-28
WO2002016667B1 (en) 2002-08-01
WO2002016667A3 (en) 2002-06-06

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