AU2001285710A1 - Method for producing an electrically conductive structure on a non-planar surface and the use of said method - Google Patents

Method for producing an electrically conductive structure on a non-planar surface and the use of said method

Info

Publication number
AU2001285710A1
AU2001285710A1 AU2001285710A AU8571001A AU2001285710A1 AU 2001285710 A1 AU2001285710 A1 AU 2001285710A1 AU 2001285710 A AU2001285710 A AU 2001285710A AU 8571001 A AU8571001 A AU 8571001A AU 2001285710 A1 AU2001285710 A1 AU 2001285710A1
Authority
AU
Australia
Prior art keywords
producing
electrically conductive
planar surface
conductive structure
planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001285710A
Other languages
English (en)
Inventor
Ignaz Eisele
Florian Wiest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of AU2001285710A1 publication Critical patent/AU2001285710A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Materials For Photolithography (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2001285710A 2000-09-12 2001-08-17 Method for producing an electrically conductive structure on a non-planar surface and the use of said method Abandoned AU2001285710A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10045072 2000-09-12
DE10045072A DE10045072A1 (de) 2000-09-12 2000-09-12 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einer nichtplanen Oberfläche und Verwendung des Verfahrens
PCT/DE2001/003166 WO2002023961A1 (fr) 2000-09-12 2001-08-17 Procede pour realiser une structure electroconductrice sur une surface non plane, et mise en oeuvre de ce procede

Publications (1)

Publication Number Publication Date
AU2001285710A1 true AU2001285710A1 (en) 2002-03-26

Family

ID=7655924

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001285710A Abandoned AU2001285710A1 (en) 2000-09-12 2001-08-17 Method for producing an electrically conductive structure on a non-planar surface and the use of said method

Country Status (7)

Country Link
US (1) US6998222B2 (fr)
EP (1) EP1317875A1 (fr)
JP (1) JP2004509455A (fr)
CN (1) CN1283133C (fr)
AU (1) AU2001285710A1 (fr)
DE (1) DE10045072A1 (fr)
WO (1) WO2002023961A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658483B (zh) * 2016-04-08 2019-05-01 許銘案 充電線圈及其製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247090A (ja) * 1985-04-24 1986-11-04 日本ペイント株式会社 半田スル−ホ−ルを有する回路板の製造方法
JPS63220249A (ja) 1987-03-10 1988-09-13 Japan Radio Co Ltd 曲率面における回路パタ−ンの形成方法
US4800836A (en) * 1987-03-27 1989-01-31 Kabushiki Kaisha Toshiba Resist coating apparatus
US5004672A (en) * 1989-07-10 1991-04-02 Shipley Company Inc. Electrophoretic method for applying photoresist to three dimensional circuit board substrate
JPH0476985A (ja) * 1990-07-18 1992-03-11 Cmk Corp プリント配線板の製造法
JPH05247386A (ja) * 1991-11-27 1993-09-24 Hitachi Chem Co Ltd ポジ型感光性アニオン電着塗料樹脂組成物、ポジ型感光性アニオン電着塗料、電着塗装浴、電着塗装法及びプリント回路板の製造法
US5323047A (en) * 1992-01-31 1994-06-21 Sgs-Thomson Microelectronics, Inc. Structure formed by a method of patterning a submicron semiconductor layer
JP3202839B2 (ja) 1993-01-26 2001-08-27 松下電工株式会社 立体回路板の製造方法
JPH07273432A (ja) 1994-03-30 1995-10-20 Kansai Paint Co Ltd プリント配線板の製造法
DE69518708T2 (de) * 1994-04-15 2001-06-07 Koninkl Philips Electronics Nv Verfahren zur herstellung einer vorrichtung durch direktes bestrahlen von einigen teilen der oberflaeche der vorrichtung durch eine maske und durch indirektes bestrahlen von anderen teilen durch die maske via einer reflektierenden oberflaeche unter herstellung eines musters
GB2291216B (en) * 1994-06-30 1998-01-07 Matsushita Electric Works Ltd Method of manufacturing a printed circuit board
CN1086101C (zh) 1994-07-08 2002-06-05 松下电工株式会社 一种制造印刷电路板的方法
JPH11218938A (ja) 1998-01-30 1999-08-10 Hitachi Cable Ltd 立体成形品の固定治具
DE19817852B4 (de) * 1998-04-22 2009-04-16 Theodor Dr. Doll Nutzenfertigung von Induktivitäten mit Mikrotechniken

Also Published As

Publication number Publication date
JP2004509455A (ja) 2004-03-25
US6998222B2 (en) 2006-02-14
DE10045072A1 (de) 2002-04-04
US20040096781A1 (en) 2004-05-20
WO2002023961A1 (fr) 2002-03-21
CN1283133C (zh) 2006-11-01
CN1456032A (zh) 2003-11-12
EP1317875A1 (fr) 2003-06-11

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