AU2001285710A1 - Method for producing an electrically conductive structure on a non-planar surface and the use of said method - Google Patents
Method for producing an electrically conductive structure on a non-planar surface and the use of said methodInfo
- Publication number
- AU2001285710A1 AU2001285710A1 AU2001285710A AU8571001A AU2001285710A1 AU 2001285710 A1 AU2001285710 A1 AU 2001285710A1 AU 2001285710 A AU2001285710 A AU 2001285710A AU 8571001 A AU8571001 A AU 8571001A AU 2001285710 A1 AU2001285710 A1 AU 2001285710A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- electrically conductive
- planar surface
- conductive structure
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Materials For Photolithography (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10045072 | 2000-09-12 | ||
DE10045072A DE10045072A1 (en) | 2000-09-12 | 2000-09-12 | Method for producing an electrically conductive structure on a non-planar surface and use of the method |
PCT/DE2001/003166 WO2002023961A1 (en) | 2000-09-12 | 2001-08-17 | Method for producing an electrically conductive structure on a non-planar surface and the use of said method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001285710A1 true AU2001285710A1 (en) | 2002-03-26 |
Family
ID=7655924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001285710A Abandoned AU2001285710A1 (en) | 2000-09-12 | 2001-08-17 | Method for producing an electrically conductive structure on a non-planar surface and the use of said method |
Country Status (7)
Country | Link |
---|---|
US (1) | US6998222B2 (en) |
EP (1) | EP1317875A1 (en) |
JP (1) | JP2004509455A (en) |
CN (1) | CN1283133C (en) |
AU (1) | AU2001285710A1 (en) |
DE (1) | DE10045072A1 (en) |
WO (1) | WO2002023961A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI658483B (en) * | 2016-04-08 | 2019-05-01 | 許銘案 | Charging coil and the manufacturing method for making the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61247090A (en) * | 1985-04-24 | 1986-11-04 | 日本ペイント株式会社 | Manufacture of circuit board having solder through hole |
JPS63220249A (en) | 1987-03-10 | 1988-09-13 | Japan Radio Co Ltd | Method for forming circuit pattern on curved surface |
US4800836A (en) * | 1987-03-27 | 1989-01-31 | Kabushiki Kaisha Toshiba | Resist coating apparatus |
US5004672A (en) * | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
JPH0476985A (en) | 1990-07-18 | 1992-03-11 | Cmk Corp | Manufacture of printed circuit board |
JPH05247386A (en) * | 1991-11-27 | 1993-09-24 | Hitachi Chem Co Ltd | Positive-type photosensitive anionic electrodeposition coating resin composition, coating therefrom, bath therefor, coating method and production of printed circuit board |
US5323047A (en) * | 1992-01-31 | 1994-06-21 | Sgs-Thomson Microelectronics, Inc. | Structure formed by a method of patterning a submicron semiconductor layer |
JP3202839B2 (en) | 1993-01-26 | 2001-08-27 | 松下電工株式会社 | Manufacturing method of three-dimensional circuit board |
JPH07273432A (en) | 1994-03-30 | 1995-10-20 | Kansai Paint Co Ltd | Manufacture of printed wiring board |
WO1995028820A1 (en) | 1994-04-15 | 1995-10-26 | Philips Electronics N.V. | Method of manufacturing a device, by irradiating some parts of the surface of the device directly through a mask, and other parts indirectly through the mask and via a reflecting surface, thereby producing a pattern |
GB2291216B (en) | 1994-06-30 | 1998-01-07 | Matsushita Electric Works Ltd | Method of manufacturing a printed circuit board |
CN1086101C (en) | 1994-07-08 | 2002-06-05 | 松下电工株式会社 | Method of manufacturing a printed circuit board |
JPH11218938A (en) | 1998-01-30 | 1999-08-10 | Hitachi Cable Ltd | Fixing jig for three-dimensional formed product |
DE19817852B4 (en) * | 1998-04-22 | 2009-04-16 | Theodor Dr. Doll | Use production of inductors with microtechniques |
-
2000
- 2000-09-12 DE DE10045072A patent/DE10045072A1/en not_active Ceased
-
2001
- 2001-08-17 WO PCT/DE2001/003166 patent/WO2002023961A1/en active Application Filing
- 2001-08-17 JP JP2002526808A patent/JP2004509455A/en not_active Withdrawn
- 2001-08-17 AU AU2001285710A patent/AU2001285710A1/en not_active Abandoned
- 2001-08-17 EP EP01964918A patent/EP1317875A1/en not_active Withdrawn
- 2001-08-17 CN CN01815517.0A patent/CN1283133C/en not_active Expired - Fee Related
- 2001-08-17 US US10/380,293 patent/US6998222B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2004509455A (en) | 2004-03-25 |
WO2002023961A1 (en) | 2002-03-21 |
DE10045072A1 (en) | 2002-04-04 |
CN1456032A (en) | 2003-11-12 |
US20040096781A1 (en) | 2004-05-20 |
CN1283133C (en) | 2006-11-01 |
EP1317875A1 (en) | 2003-06-11 |
US6998222B2 (en) | 2006-02-14 |
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