AU2001277846A1 - Vacuum chuck with integrated electrical testing points - Google Patents
Vacuum chuck with integrated electrical testing pointsInfo
- Publication number
- AU2001277846A1 AU2001277846A1 AU2001277846A AU7784601A AU2001277846A1 AU 2001277846 A1 AU2001277846 A1 AU 2001277846A1 AU 2001277846 A AU2001277846 A AU 2001277846A AU 7784601 A AU7784601 A AU 7784601A AU 2001277846 A1 AU2001277846 A1 AU 2001277846A1
- Authority
- AU
- Australia
- Prior art keywords
- vacuum chuck
- electrical testing
- integrated electrical
- testing points
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S279/00—Chucks or sockets
- Y10S279/904—Quick change socket
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/602,813 US6570374B1 (en) | 2000-06-23 | 2000-06-23 | Vacuum chuck with integrated electrical testing points |
US09602813 | 2000-06-23 | ||
PCT/US2001/019874 WO2002000394A1 (en) | 2000-06-23 | 2001-06-21 | Vacuum chuck with integrated electrical testing points |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001277846A1 true AU2001277846A1 (en) | 2002-01-08 |
Family
ID=24412898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001277846A Abandoned AU2001277846A1 (en) | 2000-06-23 | 2001-06-21 | Vacuum chuck with integrated electrical testing points |
Country Status (9)
Country | Link |
---|---|
US (1) | US6570374B1 (en) |
EP (1) | EP1292429A1 (en) |
JP (1) | JP2004502139A (en) |
KR (1) | KR20030014724A (en) |
CN (1) | CN1460045A (en) |
AU (1) | AU2001277846A1 (en) |
DE (1) | DE10196394T1 (en) |
TW (1) | TW504431B (en) |
WO (1) | WO2002000394A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE341003T1 (en) * | 1999-02-16 | 2006-10-15 | Applera Corp | DEVICE FOR HANDLING BEADS |
US7160105B2 (en) * | 2001-06-01 | 2007-01-09 | Litrex Corporation | Temperature controlled vacuum chuck |
US20070258862A1 (en) * | 2006-05-02 | 2007-11-08 | Applera Corporation | Variable volume dispenser and method |
KR100883526B1 (en) * | 2007-01-29 | 2009-02-12 | 조문영 | Top plate of wafer chuck and its manufacturing method |
CN103116086B (en) * | 2011-11-16 | 2015-03-25 | 中国科学院金属研究所 | Equipment and method of rapid life tests of built-in multihole heater |
CN102553790A (en) * | 2011-12-27 | 2012-07-11 | 昆山弗尔赛能源有限公司 | Vacuum worktable capable of heating and accurately positioning |
US9244107B2 (en) * | 2012-11-12 | 2016-01-26 | Marvell World Trade Ltd. | Heat sink blade pack for device under test testing |
CN104407251B (en) * | 2014-11-28 | 2018-02-02 | 南京点触智能科技有限公司 | A kind of single-layer multi-point capacitive touch screen test device |
JP7350438B2 (en) * | 2019-09-09 | 2023-09-26 | 株式会社ディスコ | Chuck table and chuck table manufacturing method |
CN110823923A (en) * | 2019-10-15 | 2020-02-21 | 广东炬森智能装备有限公司 | Display screen internal circuit detection device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3437929A (en) * | 1965-08-05 | 1969-04-08 | Electroglas Inc | Automatically indexed probe assembly for testing semiconductor wafers and the like |
US3584741A (en) * | 1969-06-30 | 1971-06-15 | Ibm | Batch sorting apparatus |
US3949295A (en) | 1974-03-20 | 1976-04-06 | Western Electric Company, Inc. | Apparatus for retaining articles in an array for testing |
FR2541779B1 (en) | 1983-02-24 | 1985-06-07 | Commissariat Energie Atomique | DEVICE FOR CONTROLLING MOBILE ELECTRICAL LOADS IN AN INTEGRATED CIRCUIT IN MOS TECHNOLOGY |
US4625164A (en) * | 1984-03-05 | 1986-11-25 | Pylon Company | Vacuum actuated bi-level test fixture |
GB8815553D0 (en) | 1988-06-30 | 1988-08-03 | Mpl Precision Ltd | Vacuum chuck |
US5012187A (en) | 1989-11-03 | 1991-04-30 | Motorola, Inc. | Method for parallel testing of semiconductor devices |
US5203401A (en) * | 1990-06-29 | 1993-04-20 | Digital Equipment Corporation | Wet micro-channel wafer chuck and cooling method |
US5798286A (en) * | 1995-09-22 | 1998-08-25 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
US6228685B1 (en) * | 1994-07-07 | 2001-05-08 | Tessera, Inc. | Framed sheet processing |
US5886863A (en) * | 1995-05-09 | 1999-03-23 | Kyocera Corporation | Wafer support member |
US5703493A (en) | 1995-10-25 | 1997-12-30 | Motorola, Inc. | Wafer holder for semiconductor applications |
US5907246A (en) | 1995-11-29 | 1999-05-25 | Lucent Technologies, Inc. | Testing of semiconductor chips |
US5894225A (en) * | 1996-10-31 | 1999-04-13 | Coffin; Harry S. | Test fixture |
-
2000
- 2000-06-23 US US09/602,813 patent/US6570374B1/en not_active Expired - Fee Related
-
2001
- 2001-06-21 DE DE10196394T patent/DE10196394T1/en not_active Withdrawn
- 2001-06-21 AU AU2001277846A patent/AU2001277846A1/en not_active Abandoned
- 2001-06-21 WO PCT/US2001/019874 patent/WO2002000394A1/en not_active Application Discontinuation
- 2001-06-21 EP EP01955786A patent/EP1292429A1/en not_active Withdrawn
- 2001-06-21 CN CN01814275A patent/CN1460045A/en active Pending
- 2001-06-21 JP JP2002505162A patent/JP2004502139A/en not_active Withdrawn
- 2001-06-21 KR KR1020027017541A patent/KR20030014724A/en not_active Application Discontinuation
- 2001-06-22 TW TW090115300A patent/TW504431B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2004502139A (en) | 2004-01-22 |
US6570374B1 (en) | 2003-05-27 |
WO2002000394A1 (en) | 2002-01-03 |
TW504431B (en) | 2002-10-01 |
KR20030014724A (en) | 2003-02-19 |
CN1460045A (en) | 2003-12-03 |
EP1292429A1 (en) | 2003-03-19 |
DE10196394T1 (en) | 2003-07-31 |
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