AU2001278072A1 - 3-d lead inspection - Google Patents

3-d lead inspection

Info

Publication number
AU2001278072A1
AU2001278072A1 AU2001278072A AU7807201A AU2001278072A1 AU 2001278072 A1 AU2001278072 A1 AU 2001278072A1 AU 2001278072 A AU2001278072 A AU 2001278072A AU 7807201 A AU7807201 A AU 7807201A AU 2001278072 A1 AU2001278072 A1 AU 2001278072A1
Authority
AU
Australia
Prior art keywords
lead inspection
inspection
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001278072A
Inventor
Sreenivas Rao
Seow Hoon Tan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Technologies and Instruments Inc
Original Assignee
SEMICONDUCTOR TECHNOLOGIES AND
Semiconductor Technologies and Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEMICONDUCTOR TECHNOLOGIES AND, Semiconductor Technologies and Instruments Inc filed Critical SEMICONDUCTOR TECHNOLOGIES AND
Publication of AU2001278072A1 publication Critical patent/AU2001278072A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
AU2001278072A 2000-11-10 2001-07-30 3-d lead inspection Abandoned AU2001278072A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/710,448 US6532063B1 (en) 2000-11-10 2000-11-10 3-D lead inspection
US09710448 2000-11-11
PCT/US2001/023860 WO2002039100A1 (en) 2000-11-10 2001-07-30 3-d lead inspection

Publications (1)

Publication Number Publication Date
AU2001278072A1 true AU2001278072A1 (en) 2002-05-21

Family

ID=24854070

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001278072A Abandoned AU2001278072A1 (en) 2000-11-10 2001-07-30 3-d lead inspection

Country Status (4)

Country Link
US (1) US6532063B1 (en)
AU (1) AU2001278072A1 (en)
TW (1) TW511209B (en)
WO (1) WO2002039100A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6813016B2 (en) * 2002-03-15 2004-11-02 Ppt Vision, Inc. Co-planarity and top-down examination method and optical module for electronic leaded components
DE602004021240D1 (en) * 2003-03-07 2009-07-09 Ismeca Semiconductor Holding OPTICAL EQUIPMENT AND INSPECTION MODULE
TWI278910B (en) * 2005-08-09 2007-04-11 Powerchip Semiconductor Corp System and method for wafer visual inspection
CN102809874B (en) * 2012-08-08 2015-10-07 吴江市博众精工科技有限公司 A kind of reflecting piece light compensating apparatus
JP6491425B2 (en) * 2014-05-21 2019-03-27 Ｔｏｗａ株式会社 Electronic parts package side view photographing device
JP6786593B2 (en) 2015-08-26 2020-11-18 アーベーベー・シュバイツ・アーゲーＡＢＢ Ｓｃｈｗｅｉｚ ＡＧ Target inspection equipment and methods from multiple viewpoints

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696047A (en) 1985-02-28 1987-09-22 Texas Instruments Incorporated Apparatus for automatically inspecting electrical connecting pins
US4872052A (en) 1986-12-03 1989-10-03 View Engineering, Inc. Semiconductor device inspection system
US4959898A (en) * 1990-05-22 1990-10-02 Emhart Industries, Inc. Surface mount machine with lead coplanarity verifier
US5131753A (en) * 1990-07-23 1992-07-21 Motorola, Inc. Robotic placement device using compliant imaging surface
JP2530955B2 (en) * 1990-12-27 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション Inspection device and inspection method for parts with leads
US5452080A (en) * 1993-06-04 1995-09-19 Sony Corporation Image inspection apparatus and method
JPH07115300A (en) * 1993-10-18 1995-05-02 M & M Prod Kk Electronic component positioning apparatus
US5563703A (en) * 1994-06-20 1996-10-08 Motorola, Inc. Lead coplanarity inspection apparatus and method thereof
KR970053283A (en) * 1995-12-26 1997-07-31 윌리엄 이. 힐러 Measurement unit for semiconductor package contour measurement
WO1997032180A1 (en) * 1996-02-19 1997-09-04 Philips Electronics N.V. Device comprising diffuse foreground illumination for detecting an electronic component, and component-mounting machine provided with such a detection device
JPH10153413A (en) * 1996-11-21 1998-06-09 M C Electron Kk Appearance and dimension inspection device for ic lead
US6005965A (en) * 1997-04-07 1999-12-21 Komatsu Ltd. Inspection apparatus for semiconductor packages
US5956134A (en) 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
US6359694B1 (en) * 1997-11-10 2002-03-19 Siemens Aktiengesellschaft Method and device for identifying the position of an electrical component or terminals thereof, and equipping head employing same
US6055055A (en) 1997-12-01 2000-04-25 Hewlett-Packard Company Cross optical axis inspection system for integrated circuits
SG72860A1 (en) 1998-08-27 2001-03-20 Agilent Technologies Inc Leaded components inspection system
SG76564A1 (en) * 1998-11-30 2000-11-21 Rahmonic Resources Pte Ltd An apparatus and method to transport inspect and measure objects and surface details at high speeds

Also Published As

Publication number Publication date
US6532063B1 (en) 2003-03-11
WO2002039100A1 (en) 2002-05-16
TW511209B (en) 2002-11-21

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