AU2001272702A1 - Method for fabrication of on-chip inductors and related structure - Google Patents

Method for fabrication of on-chip inductors and related structure

Info

Publication number
AU2001272702A1
AU2001272702A1 AU2001272702A AU7270201A AU2001272702A1 AU 2001272702 A1 AU2001272702 A1 AU 2001272702A1 AU 2001272702 A AU2001272702 A AU 2001272702A AU 7270201 A AU7270201 A AU 7270201A AU 2001272702 A1 AU2001272702 A1 AU 2001272702A1
Authority
AU
Australia
Prior art keywords
fabrication
related structure
chip inductors
inductors
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001272702A
Inventor
David Howard
Qizhi Liu
Bin Zhao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conexant Systems LLC
Original Assignee
Conexant Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conexant Systems LLC filed Critical Conexant Systems LLC
Publication of AU2001272702A1 publication Critical patent/AU2001272702A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
AU2001272702A 2000-07-28 2001-07-27 Method for fabrication of on-chip inductors and related structure Abandoned AU2001272702A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/627,505 US6309922B1 (en) 2000-07-28 2000-07-28 Method for fabrication of on-chip inductors and related structure
US09/627,505 2000-07-28
US09627505 2000-07-28
PCT/IB2001/001351 WO2002011208A2 (en) 2000-07-28 2001-07-27 Method for fabrication of on-chip inductors and related structure

Publications (1)

Publication Number Publication Date
AU2001272702A1 true AU2001272702A1 (en) 2002-02-13

Family

ID=24514926

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001272702A Abandoned AU2001272702A1 (en) 2000-07-28 2001-07-27 Method for fabrication of on-chip inductors and related structure

Country Status (3)

Country Link
US (2) US6309922B1 (en)
AU (1) AU2001272702A1 (en)
WO (1) WO2002011208A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534406B1 (en) * 2000-09-22 2003-03-18 Newport Fab, Llc Method for increasing inductance of on-chip inductors and related structure
US6387747B1 (en) * 2001-05-31 2002-05-14 Chartered Semiconductor Manufacturing Ltd. Method to fabricate RF inductors with minimum area
US6444517B1 (en) * 2002-01-23 2002-09-03 Taiwan Semiconductor Manufacturing Company High Q inductor with Cu damascene via/trench etching simultaneous module
US6852605B2 (en) * 2003-05-01 2005-02-08 Chartered Semiconductor Manufacturing Ltd. Method of forming an inductor with continuous metal deposition
US20050086780A1 (en) * 2003-10-23 2005-04-28 Chartered Semiconductor Manufacturing Ltd. Method of fabricating circular or angular spiral MIM capacitors
US7795708B2 (en) * 2006-06-02 2010-09-14 Honeywell International Inc. Multilayer structures for magnetic shielding
WO2010064412A1 (en) * 2008-12-04 2010-06-10 日本電気株式会社 Bias circuit and method for making bias circuit
JP5574639B2 (en) * 2009-08-21 2014-08-20 三菱電機株式会社 Semiconductor device and manufacturing method thereof
WO2011033496A1 (en) * 2009-09-16 2011-03-24 Maradin Technologies Ltd. Micro coil apparatus and manufacturing methods therefor
US8618631B2 (en) * 2012-02-14 2013-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. On-chip ferrite bead inductor
US20140292460A1 (en) * 2013-03-29 2014-10-02 Samsung Electro-Mechanics Co., Ltd. Inductor and method for manufacturing the same
US10380624B2 (en) * 2014-03-31 2019-08-13 Microsoft Technology Licensing, Llc Subset multi-objective optimization in a social network
CN115513187B (en) * 2022-11-23 2023-04-07 广东工业大学 Chip of integrated on-chip inductor, integrated circuit and electronic device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58101439A (en) 1981-12-12 1983-06-16 Toshiba Corp Manufacture of semiconductor device
JPS5963707A (en) * 1982-10-04 1984-04-11 Matsushita Electric Ind Co Ltd Magnetic thin film body
JPH02262308A (en) * 1989-03-31 1990-10-25 Toshiba Lighting & Technol Corp Plane inductor
US5227659A (en) * 1990-06-08 1993-07-13 Trustees Of Boston University Integrated circuit inductor
JPH07183458A (en) * 1993-12-24 1995-07-21 Toshiba Corp Semiconductor device
US5446311A (en) * 1994-09-16 1995-08-29 International Business Machines Corporation High-Q inductors in silicon technology without expensive metalization
US5635892A (en) 1994-12-06 1997-06-03 Lucent Technologies Inc. High Q integrated inductor
AU2821497A (en) * 1996-05-03 1997-11-26 Motorola, Inc. Integrable circuit inductor
US5652173A (en) * 1996-05-09 1997-07-29 Philips Electronics North America Corporation Monolithic microwave circuit with thick conductors
US5793272A (en) 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
KR100243658B1 (en) * 1996-12-06 2000-02-01 정선종 Inductor device using substrate biasing technigue and method for fabricating the same
JPH1167541A (en) * 1997-08-26 1999-03-09 Toshiba Corp Inductor device
US6013939A (en) * 1997-10-31 2000-01-11 National Scientific Corp. Monolithic inductor with magnetic flux lines guided away from substrate
US6191468B1 (en) * 1999-02-03 2001-02-20 Micron Technology, Inc. Inductor with magnetic material layers

Also Published As

Publication number Publication date
US6309922B1 (en) 2001-10-30
US20020011646A1 (en) 2002-01-31
WO2002011208A3 (en) 2002-07-18
US7173318B2 (en) 2007-02-06
WO2002011208A2 (en) 2002-02-07

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