AU2001270314A1 - Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices - Google Patents

Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices

Info

Publication number
AU2001270314A1
AU2001270314A1 AU2001270314A AU7031401A AU2001270314A1 AU 2001270314 A1 AU2001270314 A1 AU 2001270314A1 AU 2001270314 A AU2001270314 A AU 2001270314A AU 7031401 A AU7031401 A AU 7031401A AU 2001270314 A1 AU2001270314 A1 AU 2001270314A1
Authority
AU
Australia
Prior art keywords
incorporation
methods
processing system
thermal processing
dielectric films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001270314A
Other languages
English (en)
Inventor
Sokol Ibrani
Ketan Itchhaporia
Jack S. Kasahara
Devendra Kumar
Vuong P. Nguyen
Jeffrey D. Womack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tel Manufacturing and Engineering of America Inc
Original Assignee
FSI International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSI International Inc filed Critical FSI International Inc
Priority claimed from PCT/US2001/021927 external-priority patent/WO2002004134A1/en
Publication of AU2001270314A1 publication Critical patent/AU2001270314A1/en
Abandoned legal-status Critical Current

Links

AU2001270314A 2000-07-12 2001-07-11 Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices Abandoned AU2001270314A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US61474600A 2000-07-12 2000-07-12
US09614746 2000-07-12
PCT/US2001/021927 WO2002004134A1 (en) 2000-07-12 2001-07-11 Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices

Publications (1)

Publication Number Publication Date
AU2001270314A1 true AU2001270314A1 (en) 2002-01-21

Family

ID=24462539

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001270314A Abandoned AU2001270314A1 (en) 2000-07-12 2001-07-11 Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices

Country Status (2)

Country Link
JP (1) JP2004502535A (https=)
AU (1) AU2001270314A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130083940A (ko) * 2008-05-09 2013-07-23 티이엘 에프에스아이, 인코포레이티드 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 공구 및 방법
KR102721924B1 (ko) * 2021-07-12 2024-10-24 시바우라 메카트로닉스 가부시끼가이샤 유기막 형성 장치 및 유기막의 제조 방법

Also Published As

Publication number Publication date
JP2004502535A (ja) 2004-01-29

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