AU2001267890A1 - N-type nitride semiconductor laminate and semiconductor device using same - Google Patents

N-type nitride semiconductor laminate and semiconductor device using same

Info

Publication number
AU2001267890A1
AU2001267890A1 AU2001267890A AU6789001A AU2001267890A1 AU 2001267890 A1 AU2001267890 A1 AU 2001267890A1 AU 2001267890 A AU2001267890 A AU 2001267890A AU 6789001 A AU6789001 A AU 6789001A AU 2001267890 A1 AU2001267890 A1 AU 2001267890A1
Authority
AU
Australia
Prior art keywords
same
type nitride
semiconductor device
laminate
nitride semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001267890A
Inventor
Yasunobu Hosokawa
Koji Tanizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of AU2001267890A1 publication Critical patent/AU2001267890A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02458—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Chemical Vapour Deposition (AREA)
  • Recrystallisation Techniques (AREA)
  • Junction Field-Effect Transistors (AREA)
AU2001267890A 2000-07-03 2001-07-02 N-type nitride semiconductor laminate and semiconductor device using same Abandoned AU2001267890A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2000201341 2000-07-03
JP2000-201341 2000-07-03
JP2001027070 2001-02-02
JP2001-27070 2001-02-02
JP2001-155577 2001-05-24
JP2001155577A JP5145617B2 (en) 2000-07-03 2001-05-24 N-type nitride semiconductor laminate and semiconductor device using the same
PCT/JP2001/005690 WO2002003474A2 (en) 2000-07-03 2001-07-02 N-type nitride semiconductor laminate and semiconductor device using same

Publications (1)

Publication Number Publication Date
AU2001267890A1 true AU2001267890A1 (en) 2002-01-14

Family

ID=27343953

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001267890A Abandoned AU2001267890A1 (en) 2000-07-03 2001-07-02 N-type nitride semiconductor laminate and semiconductor device using same

Country Status (6)

Country Link
US (1) US20030205711A1 (en)
JP (1) JP5145617B2 (en)
AU (1) AU2001267890A1 (en)
MY (1) MY143405A (en)
TW (1) TW511300B (en)
WO (1) WO2002003474A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3955367B2 (en) 1997-09-30 2007-08-08 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Optical semiconductor device and manufacturing method thereof
US6849472B2 (en) 1997-09-30 2005-02-01 Lumileds Lighting U.S., Llc Nitride semiconductor device with reduced polarization fields
KR101034055B1 (en) 2003-07-18 2011-05-12 엘지이노텍 주식회사 Light emitting diode and method for manufacturing light emitting diode
JP4583060B2 (en) * 2004-03-26 2010-11-17 京セラ株式会社 Method for manufacturing single crystal sapphire substrate and method for manufacturing nitride semiconductor light emitting device
KR100678854B1 (en) * 2004-04-13 2007-02-05 엘지이노텍 주식회사 Light emitting diode and method for manufacturing led
JP5082210B2 (en) * 2004-07-30 2012-11-28 住友化学株式会社 Nitride-based compound semiconductor and manufacturing method thereof
US20060267043A1 (en) * 2005-05-27 2006-11-30 Emerson David T Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
JP2006339550A (en) * 2005-06-06 2006-12-14 Sony Corp Semiconductor element and manufacturing method thereof, and semiconductor device and manufacturing method thereof
JP4853198B2 (en) * 2005-12-02 2012-01-11 豊田合成株式会社 Group III nitride compound semiconductor light emitting device
JP2008227103A (en) * 2007-03-12 2008-09-25 Rohm Co Ltd GaN-BASED SEMICONDUCTOR LIGHT EMITTING ELEMENT
CN101494262B (en) * 2008-01-23 2013-11-06 晶元光电股份有限公司 LED structure
JP2008252124A (en) * 2008-06-27 2008-10-16 Sumitomo Electric Ind Ltd Nitride-based semiconductor device
JP2010123920A (en) * 2008-10-20 2010-06-03 Sumitomo Electric Ind Ltd Method for manufacturing nitride semiconductor light emitting element, and method for manufacturing epitaxial wafer
JP5633154B2 (en) * 2010-02-18 2014-12-03 豊田合成株式会社 Semiconductor light emitting device manufacturing method, semiconductor light emitting device, lamp, electronic device, and mechanical device
JP5388967B2 (en) * 2010-08-09 2014-01-15 株式会社東芝 Semiconductor light emitting device
JP2013183126A (en) * 2012-03-05 2013-09-12 Sharp Corp Nitride semiconductor light-emitting element and method of manufacturing nitride semiconductor light-emitting element
WO2014057748A1 (en) * 2012-10-12 2014-04-17 住友電気工業株式会社 Group iii nitride composite substrate, manufacturing method therefor, and group iii nitride semiconductor device manufacturing method
JP2013219386A (en) * 2013-06-24 2013-10-24 Toshiba Corp Semiconductor light-emitting element
JP6124740B2 (en) * 2013-08-30 2017-05-10 シャープ株式会社 Nitride semiconductor light emitting device manufacturing method, nitride semiconductor light emitting device, and base substrate for nitride semiconductor light emitting device
JP5996499B2 (en) * 2013-09-02 2016-09-21 株式会社東芝 Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
US11322643B2 (en) 2014-05-27 2022-05-03 Silanna UV Technologies Pte Ltd Optoelectronic device
KR102318317B1 (en) 2014-05-27 2021-10-28 실라나 유브이 테크놀로지스 피티이 리미티드 Advanced electronic device structures using semiconductor structures and superlattices
KR102427203B1 (en) 2014-05-27 2022-07-29 실라나 유브이 테크놀로지스 피티이 리미티드 Electronic devices comprising n-type and p-type superlattices
KR102333773B1 (en) 2014-05-27 2021-12-01 실라나 유브이 테크놀로지스 피티이 리미티드 An optoelectronic device
GB2586862B (en) * 2019-09-06 2021-12-15 Plessey Semiconductors Ltd LED precursor incorporating strain relaxing structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3778609B2 (en) * 1996-04-26 2006-05-24 三洋電機株式会社 Manufacturing method of semiconductor device
JP3448450B2 (en) * 1996-04-26 2003-09-22 三洋電機株式会社 Light emitting device and method for manufacturing the same
JP3374737B2 (en) * 1997-01-09 2003-02-10 日亜化学工業株式会社 Nitride semiconductor device
JPH10215035A (en) * 1997-01-30 1998-08-11 Toshiba Corp Compound semiconductor element and manufacture thereof
JP3744211B2 (en) * 1997-09-01 2006-02-08 日亜化学工業株式会社 Nitride semiconductor device
JP3647236B2 (en) * 1997-12-22 2005-05-11 日亜化学工業株式会社 Nitride semiconductor laser device
JP3622562B2 (en) * 1998-03-12 2005-02-23 日亜化学工業株式会社 Nitride semiconductor light emitting diode
US7193246B1 (en) * 1998-03-12 2007-03-20 Nichia Corporation Nitride semiconductor device
JP4166885B2 (en) * 1998-05-18 2008-10-15 富士通株式会社 Optical semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
JP2002305323A (en) 2002-10-18
JP5145617B2 (en) 2013-02-20
US20030205711A1 (en) 2003-11-06
TW511300B (en) 2002-11-21
WO2002003474A2 (en) 2002-01-10
MY143405A (en) 2011-05-13
WO2002003474A3 (en) 2002-06-27

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