AU2001263979A1 - A smart card web and a method for its manufacture - Google Patents
A smart card web and a method for its manufactureInfo
- Publication number
- AU2001263979A1 AU2001263979A1 AU2001263979A AU6397901A AU2001263979A1 AU 2001263979 A1 AU2001263979 A1 AU 2001263979A1 AU 2001263979 A AU2001263979 A AU 2001263979A AU 6397901 A AU6397901 A AU 6397901A AU 2001263979 A1 AU2001263979 A1 AU 2001263979A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacture
- smart card
- card web
- web
- smart
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
- B32B37/206—Laminating a continuous layer between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2429/00—Carriers for sound or information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20001345 | 2000-06-06 | ||
FI20001345A FI111881B (fi) | 2000-06-06 | 2000-06-06 | Älykorttiraina ja menetelmä sen valmistamiseksi |
PCT/FI2001/000521 WO2001095252A1 (en) | 2000-06-06 | 2001-05-31 | A smart card web and a method for its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001263979A1 true AU2001263979A1 (en) | 2001-12-17 |
Family
ID=8558504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001263979A Abandoned AU2001263979A1 (en) | 2000-06-06 | 2001-05-31 | A smart card web and a method for its manufacture |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030127525A1 (ko) |
EP (1) | EP1307857A1 (ko) |
JP (1) | JP2003536151A (ko) |
KR (1) | KR100846236B1 (ko) |
AU (1) | AU2001263979A1 (ko) |
FI (1) | FI111881B (ko) |
WO (1) | WO2001095252A1 (ko) |
Families Citing this family (13)
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US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
FR2853115B1 (fr) * | 2003-03-28 | 2005-05-06 | A S K | Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede |
JP4438558B2 (ja) * | 2003-11-12 | 2010-03-24 | 株式会社日立製作所 | Rfidタグの製造方法 |
JP2005215808A (ja) * | 2004-01-28 | 2005-08-11 | Nec Corp | 価値情報管理システム及びその方法 |
TW200608305A (en) * | 2004-07-16 | 2006-03-01 | Securency Pty Ltd | Method of producing diffractive structures in security documents |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7506813B2 (en) * | 2005-01-06 | 2009-03-24 | Quad/Graphics, Inc. | Resonator use in the print field |
KR100767471B1 (ko) * | 2005-10-24 | 2007-10-17 | 금산고려홍삼 주식회사 | 황토와 홍삼 성분이 함유된 미용팩 |
CN101454787B (zh) | 2006-06-14 | 2012-08-15 | 国际商业机器公司 | 用于读取应答器的方法和系统 |
EP2218579A1 (de) * | 2009-02-13 | 2010-08-18 | Bayer MaterialScience AG | Verbessertes Verfahren zur Herstellung eines laminierten Schichtverbundes |
DE102018124853A1 (de) * | 2018-10-09 | 2020-04-09 | Burg Design Gmbh | Verfahren zur Herstellung eines Mehrschichtkörpers und ein Mehrschichtkörper |
WO2024085874A1 (en) * | 2022-10-20 | 2024-04-25 | X-Card Holdings, Llc | Core layer for information carrying card, resulting information carrying card, and methods of making the same |
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JP2000148949A (ja) * | 1998-11-06 | 2000-05-30 | Dainippon Printing Co Ltd | 非接触icカードおよびその製造方法 |
US6569280B1 (en) * | 1998-11-06 | 2003-05-27 | The Standard Register Company | Lamination by radiation through a ply |
ATE202428T1 (de) * | 1999-01-23 | 2001-07-15 | Ident Gmbh X | Rfid-transponder mit bedruckbarer oberfläche |
US6412702B1 (en) * | 1999-01-25 | 2002-07-02 | Mitsumi Electric Co., Ltd. | Non-contact IC card having an antenna coil formed by a plating method |
US6288905B1 (en) * | 1999-04-15 | 2001-09-11 | Amerasia International Technology Inc. | Contact module, as for a smart card, and method for making same |
US6248199B1 (en) * | 1999-04-26 | 2001-06-19 | Soundcraft, Inc. | Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements |
US6353420B1 (en) * | 1999-04-28 | 2002-03-05 | Amerasia International Technology, Inc. | Wireless article including a plural-turn loop antenna |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
FR2796183B1 (fr) * | 1999-07-07 | 2001-09-28 | A S K | Ticket d'acces sans contact et son procede de fabrication |
WO2001006558A1 (fr) * | 1999-07-16 | 2001-01-25 | Matsushita Electric Industrial Co., Ltd. | Emballage de dispositifs a semi-conducteurs et leur procede de fabrication |
US6557766B1 (en) * | 1999-10-01 | 2003-05-06 | Keith R. Leighton | Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process |
US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US6259408B1 (en) * | 1999-11-19 | 2001-07-10 | Intermec Ip Corp. | RFID transponders with paste antennas and flip-chip attachment |
US6478229B1 (en) * | 2000-03-14 | 2002-11-12 | Harvey Epstein | Packaging tape with radio frequency identification technology |
US6249199B1 (en) * | 2000-04-10 | 2001-06-19 | George Liu | Quick magnetizing and demagnetizing device for screwdrivers |
US6555213B1 (en) * | 2000-06-09 | 2003-04-29 | 3M Innovative Properties Company | Polypropylene card construction |
JP2002109491A (ja) * | 2000-09-29 | 2002-04-12 | Sony Corp | Icカード及びその製造方法 |
US6480110B2 (en) * | 2000-12-01 | 2002-11-12 | Microchip Technology Incorporated | Inductively tunable antenna for a radio frequency identification tag |
CA2469956C (en) * | 2001-12-24 | 2009-01-27 | Digimarc Id Systems, Llc | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
-
2000
- 2000-06-06 FI FI20001345A patent/FI111881B/fi not_active IP Right Cessation
-
2001
- 2001-05-31 EP EP01938283A patent/EP1307857A1/en not_active Withdrawn
- 2001-05-31 WO PCT/FI2001/000521 patent/WO2001095252A1/en active Application Filing
- 2001-05-31 JP JP2002502716A patent/JP2003536151A/ja active Pending
- 2001-05-31 KR KR1020027016595A patent/KR100846236B1/ko not_active IP Right Cessation
- 2001-05-31 AU AU2001263979A patent/AU2001263979A1/en not_active Abandoned
-
2002
- 2002-12-05 US US10/310,699 patent/US20030127525A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FI20001345A (fi) | 2001-12-07 |
JP2003536151A (ja) | 2003-12-02 |
US20030127525A1 (en) | 2003-07-10 |
FI111881B (fi) | 2003-09-30 |
KR100846236B1 (ko) | 2008-07-16 |
KR20030028751A (ko) | 2003-04-10 |
EP1307857A1 (en) | 2003-05-07 |
FI20001345A0 (fi) | 2000-06-06 |
WO2001095252A1 (en) | 2001-12-13 |
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