AU6705800A - Method for making a smart card with contact - Google Patents
Method for making a smart card with contactInfo
- Publication number
- AU6705800A AU6705800A AU67058/00A AU6705800A AU6705800A AU 6705800 A AU6705800 A AU 6705800A AU 67058/00 A AU67058/00 A AU 67058/00A AU 6705800 A AU6705800 A AU 6705800A AU 6705800 A AU6705800 A AU 6705800A
- Authority
- AU
- Australia
- Prior art keywords
- making
- contact
- smart card
- smart
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/151—Die mounting substrate
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- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9909972 | 1999-07-30 | ||
FR9909972A FR2797076B1 (en) | 1999-07-30 | 1999-07-30 | METHOD FOR MANUFACTURING A CONTACT CHIP CARD |
PCT/FR2000/002048 WO2001009828A1 (en) | 1999-07-30 | 2000-07-13 | Method for making a smart card with contact |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6705800A true AU6705800A (en) | 2001-02-19 |
Family
ID=9548751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU67058/00A Abandoned AU6705800A (en) | 1999-07-30 | 2000-07-13 | Method for making a smart card with contact |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6705800A (en) |
FR (1) | FR2797076B1 (en) |
WO (1) | WO2001009828A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006120309A2 (en) * | 2005-05-11 | 2006-11-16 | Stmicroelectronics Sa | Silicon chips provided with inclined contact pads and an electronic module comprising said silicon chip |
ITTO20150230A1 (en) | 2015-04-24 | 2016-10-24 | St Microelectronics Srl | PROCEDURE FOR PRODUCING ELECTRONIC COMPONENTS, COMPONENT AND CORRESPONDING IT PRODUCT |
FR3035987A1 (en) * | 2015-05-04 | 2016-11-11 | Starchip | METHOD FOR MANUFACTURING A CHIP CARD BY PRINTING A CONDUCTIVE INK |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2684235B1 (en) * | 1991-11-25 | 1999-12-10 | Gemplus Card Int | INTEGRATED CIRCUIT CARD COMPRISING MEANS OF PROTECTING THE INTEGRATED CIRCUIT. |
EP0688051B1 (en) * | 1994-06-15 | 1999-09-15 | De La Rue Cartes Et Systemes | Fabrication process and assembly of an integrated circuit card. |
DE19621044A1 (en) * | 1996-05-24 | 1997-11-27 | Giesecke & Devrient Gmbh | Method for producing a card-shaped data carrier |
FR2761497B1 (en) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | METHOD FOR MANUFACTURING A CHIP CARD OR THE LIKE |
US6329213B1 (en) * | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
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1999
- 1999-07-30 FR FR9909972A patent/FR2797076B1/en not_active Expired - Fee Related
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2000
- 2000-07-13 WO PCT/FR2000/002048 patent/WO2001009828A1/en active Application Filing
- 2000-07-13 AU AU67058/00A patent/AU6705800A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2001009828A1 (en) | 2001-02-08 |
FR2797076B1 (en) | 2003-11-28 |
FR2797076A1 (en) | 2001-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase | ||
TH | Corrigenda |
Free format text: IN VOL 15, NO 21, PAGE(S) 4494-4498 UNDER THE HEADING APPLICATIONS LAPSED, REFUSED OR WITHDRAWN PLEASE DELETE ALL REFERENCE TO APPLICATION NO. 51465/99, 64890/99, 64891/99, 22951/00, 59659/00, 61761/00, 62537/00, 62720/00, 62911/00, 62983/00, 64395/00, 65663/00, 67057/00, 67058/00, 68327/00, 68469/00, 68477/00, 68483/00, 68490/00, 70093/00, 70094/00, 70096/00, 70098/00, AND 15446/01 |
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MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |