AU1051600A - Method for making a hybrid smart card by double face printing - Google Patents
Method for making a hybrid smart card by double face printingInfo
- Publication number
- AU1051600A AU1051600A AU10516/00A AU1051600A AU1051600A AU 1051600 A AU1051600 A AU 1051600A AU 10516/00 A AU10516/00 A AU 10516/00A AU 1051600 A AU1051600 A AU 1051600A AU 1051600 A AU1051600 A AU 1051600A
- Authority
- AU
- Australia
- Prior art keywords
- making
- smart card
- double face
- face printing
- hybrid smart
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9814363 | 1998-11-16 | ||
FR9814363A FR2786009B1 (en) | 1998-11-16 | 1998-11-16 | METHOD FOR MANUFACTURING A HYBRID CHIP CARD BY DOUBLE-SIDED PRINTING |
PCT/FR1999/002693 WO2000030032A1 (en) | 1998-11-16 | 1999-11-04 | Method for making a hybrid smart card by double face printing |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1051600A true AU1051600A (en) | 2000-06-05 |
Family
ID=9532770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU10516/00A Abandoned AU1051600A (en) | 1998-11-16 | 1999-11-04 | Method for making a hybrid smart card by double face printing |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1051600A (en) |
FR (1) | FR2786009B1 (en) |
WO (1) | WO2000030032A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2817373B1 (en) * | 2000-11-30 | 2003-02-07 | D Vito Antoine Orazio | METHOD OF MANUFACTURING PORTABLE OBJECTS OF THE CONTACTLESS CARD TYPE |
DE10139395A1 (en) * | 2001-08-10 | 2003-03-06 | Infineon Technologies Ag | Contacting of semiconductor chips in chip cards |
DE10151941A1 (en) * | 2001-10-22 | 2003-01-02 | Infineon Technologies Ag | Chip card or storage card, such as a multimedia card is configured as a TSLP package so that higher production rates can be achieved with lower production costs |
FR2880160B1 (en) * | 2004-12-28 | 2007-03-30 | K Sa As | DOUBLE-SIDED ELECTRONIC MODULE FOR HYBRID CHIP CARD |
DE102005038132B4 (en) | 2005-08-11 | 2008-04-03 | Infineon Technologies Ag | Chip module and chip card |
DE102008019571A1 (en) * | 2008-04-18 | 2009-10-22 | Giesecke & Devrient Gmbh | Chip card and method for its production |
EP2189928A1 (en) * | 2008-11-21 | 2010-05-26 | Gemalto SA | Device with integrated circuit equipped with different connection means |
US9196554B2 (en) | 2013-10-01 | 2015-11-24 | Infineon Technologies Austria Ag | Electronic component, arrangement and method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4105869C2 (en) * | 1991-02-25 | 2000-05-18 | Edgar Schneider | IC card and method of making it |
US5574470A (en) * | 1994-09-30 | 1996-11-12 | Palomar Technologies Corporation | Radio frequency identification transponder apparatus and method |
FR2726106B1 (en) * | 1994-10-21 | 1996-11-29 | Solaic Sa | ELECTRONIC CARD FOR USE WITH A CONTACTLESS CARD READER AND A CONTACT CARD READER |
EP0706152B1 (en) * | 1994-11-03 | 1998-06-10 | Fela Holding AG | Base sheet for chip card |
FR2753305B1 (en) * | 1996-09-12 | 1998-11-06 | Schlumberger Ind Sa | METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR NON-CONTACT MEMORY CARDS |
-
1998
- 1998-11-16 FR FR9814363A patent/FR2786009B1/en not_active Expired - Fee Related
-
1999
- 1999-11-04 WO PCT/FR1999/002693 patent/WO2000030032A1/en active Application Filing
- 1999-11-04 AU AU10516/00A patent/AU1051600A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR2786009A1 (en) | 2000-05-19 |
FR2786009B1 (en) | 2001-01-26 |
WO2000030032A1 (en) | 2000-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ZA975252B (en) | A method for producing embossing plates. | |
IL138462A0 (en) | Method for making tamper-preventing, contact-type smart cards | |
AU7623800A (en) | Method for manufacturing a data storage card | |
HUP9901769A3 (en) | Data carrier, method for producing the data carrier as well as antifalsification paper | |
AU1432800A (en) | Method for transferring information | |
AU3315300A (en) | Method for communicating information | |
AUPO951497A0 (en) | A method for data compression | |
AU4323499A (en) | Method for making a printhead | |
AU2048700A (en) | A method for increasing electronic business | |
AU5666000A (en) | Method for a multiple smart card simulator | |
AU2939399A (en) | Method for making chip cards | |
AU1051600A (en) | Method for making a hybrid smart card by double face printing | |
AU2001263979A1 (en) | A smart card web and a method for its manufacture | |
AU1373601A (en) | A method for providing up-to-date information on road flooding | |
AU6576300A (en) | Method for making smart card with reduced format | |
AU4693399A (en) | Identification system for producing documents | |
AU3935999A (en) | Method for making a flexographic print block | |
AU1167200A (en) | Method for controlling the use of a smart card | |
AU7922198A (en) | Method for making paper using a gelling system | |
AU1798300A (en) | Method for producing calcium pantothenate | |
AU1217495A (en) | Process for producing printed smart cards | |
AU1029700A (en) | Method for transmitting voice information in a radiocommunication system | |
AU7010100A (en) | Method for making a mini-smart card | |
AU6705800A (en) | Method for making a smart card with contact | |
EP1099984A4 (en) | Method for producing printing plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |