AU2000270553A1 - Photoimageable, aqueous acid soluble polyimide polymers - Google Patents
Photoimageable, aqueous acid soluble polyimide polymersInfo
- Publication number
- AU2000270553A1 AU2000270553A1 AU2000270553A AU7055300A AU2000270553A1 AU 2000270553 A1 AU2000270553 A1 AU 2000270553A1 AU 2000270553 A AU2000270553 A AU 2000270553A AU 7055300 A AU7055300 A AU 7055300A AU 2000270553 A1 AU2000270553 A1 AU 2000270553A1
- Authority
- AU
- Australia
- Prior art keywords
- photoimageable
- aqueous acid
- soluble polyimide
- acid soluble
- polyimide polymers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/136—Coating process making radiation sensitive element
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Paints Or Removers (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/547,390 US6379865B1 (en) | 2000-04-11 | 2000-04-11 | Photoimageable, aqueous acid soluble polyimide polymers |
US09547390 | 2000-04-11 | ||
PCT/US2000/021599 WO2001077753A1 (en) | 2000-04-11 | 2000-08-08 | Photoimageable, aqueous acid soluble polyimide polymers |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000270553A1 true AU2000270553A1 (en) | 2001-10-23 |
Family
ID=24184472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000270553A Abandoned AU2000270553A1 (en) | 2000-04-11 | 2000-08-08 | Photoimageable, aqueous acid soluble polyimide polymers |
Country Status (5)
Country | Link |
---|---|
US (4) | US6379865B1 (es) |
EP (1) | EP1272901A1 (es) |
AU (1) | AU2000270553A1 (es) |
MX (1) | MXPA02010019A (es) |
WO (1) | WO2001077753A1 (es) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6379865B1 (en) * | 2000-04-11 | 2002-04-30 | 3M Innovative Properties Company | Photoimageable, aqueous acid soluble polyimide polymers |
US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
US7000313B2 (en) | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
US6951707B2 (en) | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
TW550800B (en) * | 2002-05-27 | 2003-09-01 | Via Tech Inc | Integrated circuit package without solder mask and method for the same |
US6824959B2 (en) | 2002-06-27 | 2004-11-30 | Ppg Industries Ohio, Inc. | Process for creating holes in polymeric substrates |
CN1672475B (zh) * | 2002-06-27 | 2011-11-23 | Ppg工业俄亥俄公司 | 有凹入或伸长分离接头片的单层或多层印刷电路板及其制造方法 |
EP1577348B1 (en) * | 2002-12-27 | 2009-12-23 | I.S.T Corporation | Polyimide precursor liquid composition and polyimide coating film |
US7081158B2 (en) * | 2003-11-21 | 2006-07-25 | Imaje S.A. | Ink composition for continuous deflected jet printing, especially on letters and postal articles |
CN101175633B (zh) * | 2005-04-19 | 2011-12-21 | 宇部兴产株式会社 | 聚酰亚胺薄膜层合体 |
JP4752556B2 (ja) * | 2005-09-22 | 2011-08-17 | Jsr株式会社 | 着色層形成用感放射線性組成物およびカラーフィルタ |
US7998323B1 (en) * | 2006-06-07 | 2011-08-16 | Actus Potentia, Inc. | Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces |
US8703863B2 (en) * | 2007-04-25 | 2014-04-22 | Nissan Chemical Industries, Ltd. | Polyimide precursor, polyimide, and coating solution for under layer film for image formation |
US9080440B2 (en) | 2007-07-25 | 2015-07-14 | Schlumberger Technology Corporation | Proppant pillar placement in a fracture with high solid content fluid |
US8490698B2 (en) * | 2007-07-25 | 2013-07-23 | Schlumberger Technology Corporation | High solids content methods and slurries |
US20120111563A1 (en) | 2010-11-08 | 2012-05-10 | Carlos Abad | Methods to deliver fluids on a well site with variable solids concentration from solid slurries |
US9040468B2 (en) | 2007-07-25 | 2015-05-26 | Schlumberger Technology Corporation | Hydrolyzable particle compositions, treatment fluids and methods |
US8490699B2 (en) * | 2007-07-25 | 2013-07-23 | Schlumberger Technology Corporation | High solids content slurry methods |
US8936082B2 (en) | 2007-07-25 | 2015-01-20 | Schlumberger Technology Corporation | High solids content slurry systems and methods |
US10011763B2 (en) | 2007-07-25 | 2018-07-03 | Schlumberger Technology Corporation | Methods to deliver fluids on a well site with variable solids concentration from solid slurries |
US20110198089A1 (en) * | 2009-08-31 | 2011-08-18 | Panga Mohan K R | Methods to reduce settling rate of solids in a treatment fluid |
US7923415B2 (en) | 2009-08-31 | 2011-04-12 | Schlumberger Technology Corporation | Methods to reduce settling rate of solids in a treatment fluid |
US8662172B2 (en) | 2010-04-12 | 2014-03-04 | Schlumberger Technology Corporation | Methods to gravel pack a well using expanding materials |
US8511381B2 (en) | 2010-06-30 | 2013-08-20 | Schlumberger Technology Corporation | High solids content slurry methods and systems |
US8505628B2 (en) | 2010-06-30 | 2013-08-13 | Schlumberger Technology Corporation | High solids content slurries, systems and methods |
US8613314B2 (en) | 2010-11-08 | 2013-12-24 | Schlumberger Technology Corporation | Methods to enhance the productivity of a well |
US8607870B2 (en) | 2010-11-19 | 2013-12-17 | Schlumberger Technology Corporation | Methods to create high conductivity fractures that connect hydraulic fracture networks in a well |
US8998384B2 (en) * | 2011-03-31 | 2015-04-07 | Hewlett-Packard Development Company, L.P. | Circuits and methods using a non-gold corrosion inhibitor |
US9133387B2 (en) | 2011-06-06 | 2015-09-15 | Schlumberger Technology Corporation | Methods to improve stability of high solid content fluid |
US9803457B2 (en) | 2012-03-08 | 2017-10-31 | Schlumberger Technology Corporation | System and method for delivering treatment fluid |
US9863228B2 (en) | 2012-03-08 | 2018-01-09 | Schlumberger Technology Corporation | System and method for delivering treatment fluid |
US9528354B2 (en) | 2012-11-14 | 2016-12-27 | Schlumberger Technology Corporation | Downhole tool positioning system and method |
US9388335B2 (en) | 2013-07-25 | 2016-07-12 | Schlumberger Technology Corporation | Pickering emulsion treatment fluid |
US11791521B2 (en) * | 2019-09-13 | 2023-10-17 | Hutchinson Technology Incorporated | Electrode tabs and methods of forming |
US11322806B2 (en) | 2019-09-13 | 2022-05-03 | Hutchinson Technology Incorporated | Sensored battery electrode |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3892646A (en) | 1970-08-17 | 1975-07-01 | Ibm | Process for selectively forming electrophoretic coatings on electrical contacts |
US3974324A (en) * | 1972-06-23 | 1976-08-10 | General Electric Company | Method for making polyimide coated conductors in a continuous manner and products made thereby |
US4656116A (en) | 1983-10-12 | 1987-04-07 | Ciba-Geigy Corporation | Radiation-sensitive coating composition |
US4592816A (en) | 1984-09-26 | 1986-06-03 | Rohm And Haas Company | Electrophoretic deposition process |
US4877818A (en) | 1984-09-26 | 1989-10-31 | Rohm And Haas Company | Electrophoretically depositable photosensitive polymer composition |
US4698295A (en) | 1984-11-16 | 1987-10-06 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives |
US4629685A (en) | 1984-11-16 | 1986-12-16 | Ciba-Geigy Corporation | Process for irradiating polyimides |
JPS61141196A (ja) | 1984-12-13 | 1986-06-28 | 神東塗料株式会社 | 微細な導電性パターンを有する基体の選択接着方法 |
JPS61147593A (ja) | 1984-12-20 | 1986-07-05 | 神東塗料株式会社 | 導電性接着剤層を付与したフレキシブル回路基材およびその製造方法 |
US4696890A (en) * | 1985-04-11 | 1987-09-29 | Ciba-Geigy Corporation | Processes for preparing protective coatings and relief structures |
JPH0644150B2 (ja) | 1986-05-09 | 1994-06-08 | 関西ペイント株式会社 | プリント配線フオトレジスト用電着塗料組成物 |
US4832808A (en) | 1987-01-02 | 1989-05-23 | International Business Machines Corporation | Polyimides reaction products and use in electrophoretic deposition |
US4925912A (en) | 1987-12-15 | 1990-05-15 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
JP2626696B2 (ja) | 1988-04-11 | 1997-07-02 | チッソ株式会社 | 感光性重合体 |
JPH0749483B2 (ja) | 1988-05-02 | 1995-05-31 | チッソ株式会社 | 感光性重合体の製造方法 |
JPH023053A (ja) | 1988-06-20 | 1990-01-08 | Chisso Corp | チオール基を有する感光性重合体 |
US5004672A (en) | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
EP0449022A3 (en) | 1990-03-26 | 1992-03-11 | Shipley Company Inc. | Method of controlling photoresist film thickness and stability of an electrodeposition bath |
US5055164A (en) | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
US5427862A (en) | 1990-05-08 | 1995-06-27 | Amoco Corporation | Photocurable polyimide coated glass fiber |
CA2040994A1 (en) | 1990-05-08 | 1991-11-09 | David D. Ngo | Photoimageable polyimide coating |
JPH0415226A (ja) | 1990-05-10 | 1992-01-20 | Chisso Corp | ヒドロキシフェニル基を有する感光性耐熱重合体 |
US5187241A (en) | 1990-05-15 | 1993-02-16 | International Business Machines Corporation | Isoimide modifications of a polyimide and reaction thereof with nucleophiles |
JPH04146687A (ja) | 1990-10-08 | 1992-05-20 | Nippon Paint Co Ltd | ソルダーマスクされた回路基板の製法 |
US5607818A (en) | 1991-06-04 | 1997-03-04 | Micron Technology, Inc. | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
US5314789A (en) * | 1991-10-01 | 1994-05-24 | Shipley Company Inc. | Method of forming a relief image comprising amphoteric compositions |
JPH05287222A (ja) | 1992-04-10 | 1993-11-02 | Kansai Paint Co Ltd | ポジ型感光性電着塗料組成物及びそれを用いる回路板の製造方法 |
US5384229A (en) | 1992-05-07 | 1995-01-24 | Shipley Company Inc. | Photoimageable compositions for electrodeposition |
JP2000004072A (ja) | 1998-06-15 | 2000-01-07 | Dainippon Printing Co Ltd | 配線部の保護層形成方法 |
US6379865B1 (en) * | 2000-04-11 | 2002-04-30 | 3M Innovative Properties Company | Photoimageable, aqueous acid soluble polyimide polymers |
-
2000
- 2000-04-11 US US09/547,390 patent/US6379865B1/en not_active Expired - Fee Related
- 2000-08-08 EP EP00959192A patent/EP1272901A1/en not_active Withdrawn
- 2000-08-08 WO PCT/US2000/021599 patent/WO2001077753A1/en not_active Application Discontinuation
- 2000-08-08 AU AU2000270553A patent/AU2000270553A1/en not_active Abandoned
- 2000-08-08 MX MXPA02010019A patent/MXPA02010019A/es unknown
-
2002
- 2002-01-03 US US10/038,270 patent/US6559245B2/en not_active Expired - Fee Related
-
2003
- 2003-03-18 US US10/391,279 patent/US20030211425A1/en not_active Abandoned
- 2003-03-18 US US10/391,313 patent/US20030180664A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20030180664A1 (en) | 2003-09-25 |
US6379865B1 (en) | 2002-04-30 |
MXPA02010019A (es) | 2003-04-25 |
WO2001077753A1 (en) | 2001-10-18 |
US20020086236A1 (en) | 2002-07-04 |
US20030211425A1 (en) | 2003-11-13 |
EP1272901A1 (en) | 2003-01-08 |
US6559245B2 (en) | 2003-05-06 |
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