AU2000257476A1 - Recipe cascading in a wafer processing system - Google Patents
Recipe cascading in a wafer processing systemInfo
- Publication number
- AU2000257476A1 AU2000257476A1 AU2000257476A AU5747600A AU2000257476A1 AU 2000257476 A1 AU2000257476 A1 AU 2000257476A1 AU 2000257476 A AU2000257476 A AU 2000257476A AU 5747600 A AU5747600 A AU 5747600A AU 2000257476 A1 AU2000257476 A1 AU 2000257476A1
- Authority
- AU
- Australia
- Prior art keywords
- processing system
- wafer processing
- recipe cascading
- cascading
- recipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32269—Decision, of job release, select job to be launched next in shop
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32275—Job, recipe cascading: no delay, next job is started immediatly when first is finished
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32333—Use of genetic algorithm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09521026 | 2000-03-07 | ||
US09/521,026 US6678572B1 (en) | 1998-12-31 | 2000-03-07 | Recipe cascading in a wafer processing system |
PCT/US2000/016794 WO2001067493A1 (en) | 2000-03-07 | 2000-06-16 | Recipe cascading in a wafer processing system |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000257476A1 true AU2000257476A1 (en) | 2001-09-17 |
Family
ID=24075017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000257476A Abandoned AU2000257476A1 (en) | 2000-03-07 | 2000-06-16 | Recipe cascading in a wafer processing system |
Country Status (7)
Country | Link |
---|---|
US (2) | US6678572B1 (en) |
EP (1) | EP1264332A1 (en) |
JP (3) | JP3987725B2 (en) |
KR (1) | KR100731822B1 (en) |
AU (1) | AU2000257476A1 (en) |
SG (1) | SG143963A1 (en) |
WO (1) | WO2001067493A1 (en) |
Families Citing this family (33)
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US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
SG132670A1 (en) | 2003-11-10 | 2007-06-28 | Blueshift Technologies Inc | Methods and systems for handling workpieces in a vacuum-based semiconductor handling system |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
US7068351B2 (en) * | 2004-02-20 | 2006-06-27 | Asml Netherlands B.V. | Method of controlling a lithographic processing cell, device manufacturing method, lithographic apparatus, track unit, lithographic processing cell, and computer program |
US8108470B2 (en) * | 2004-07-22 | 2012-01-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Message management system and method |
US20060182535A1 (en) * | 2004-12-22 | 2006-08-17 | Mike Rice | Cartesian robot design |
US7699021B2 (en) * | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7651306B2 (en) * | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7819079B2 (en) * | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US20060130767A1 (en) * | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Purged vacuum chuck with proximity pins |
US7625824B2 (en) * | 2005-06-16 | 2009-12-01 | Oerlikon Usa, Inc. | Process change detection through the use of evolutionary algorithms |
JP4884801B2 (en) * | 2005-10-06 | 2012-02-29 | 東京エレクトロン株式会社 | Processing system |
US7305320B2 (en) * | 2006-02-15 | 2007-12-04 | International Business Machines Corporation | Metrology tool recipe validator using best known methods |
DE102006025407A1 (en) * | 2006-05-31 | 2007-12-06 | Advanced Micro Devices, Inc., Sunnyvale | Method and system for dynamically changing the transport sequence in a cluster plant |
US20080051930A1 (en) * | 2006-07-10 | 2008-02-28 | Oh Hilario L | Scheduling method for processing equipment |
WO2008008727A2 (en) * | 2006-07-10 | 2008-01-17 | Applied Materials, Inc. | Scheduling method for processing equipment |
US7522968B2 (en) * | 2006-07-10 | 2009-04-21 | Applied Materials, Inc. | Scheduling method for processing equipment |
US20080216077A1 (en) * | 2007-03-02 | 2008-09-04 | Applied Materials, Inc. | Software sequencer for integrated substrate processing system |
US8069127B2 (en) * | 2007-04-26 | 2011-11-29 | 21 Ct, Inc. | Method and system for solving an optimization problem with dynamic constraints |
US8725667B2 (en) * | 2008-03-08 | 2014-05-13 | Tokyo Electron Limited | Method and system for detection of tool performance degradation and mismatch |
US8190543B2 (en) | 2008-03-08 | 2012-05-29 | Tokyo Electron Limited | Autonomous biologically based learning tool |
US8396582B2 (en) * | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
JP5275058B2 (en) * | 2009-01-23 | 2013-08-28 | 株式会社Sokudo | Substrate processing equipment |
JP5392190B2 (en) * | 2010-06-01 | 2014-01-22 | 東京エレクトロン株式会社 | Substrate processing system and substrate processing method |
CN103199036B (en) * | 2012-01-06 | 2015-09-09 | 沈阳新松机器人自动化股份有限公司 | The EFEM of Integrated dispatching system and dispatching method thereof |
CN104217978B (en) * | 2013-06-05 | 2017-05-17 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor lot handling system and method |
JP5987796B2 (en) * | 2013-07-24 | 2016-09-07 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
KR102037907B1 (en) * | 2017-09-11 | 2019-10-29 | 세메스 주식회사 | Substrate treating apparatus and substrate treating method |
US10698392B2 (en) * | 2018-06-22 | 2020-06-30 | Applied Materials, Inc. | Using graphics processing unit for substrate routing and throughput modeling |
WO2020056295A2 (en) | 2018-09-13 | 2020-03-19 | The Charles Stark Draper Laboratory, Inc. | Controlling robot torque and velocity based on context |
CN113361833B (en) * | 2020-03-02 | 2022-05-24 | 联芯集成电路制造(厦门)有限公司 | Chemical mechanical polishing system and related dispatching management method |
Family Cites Families (49)
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JP3115297B2 (en) | 1989-10-09 | 2000-12-04 | キヤノン株式会社 | Control device for automatic equipment |
US5305221A (en) | 1990-05-04 | 1994-04-19 | Atherton Robert W | Real world modeling and control process for integrated manufacturing equipment |
JP2753142B2 (en) * | 1990-11-27 | 1998-05-18 | 株式会社東芝 | Production management method, production management device, and manufacturing device in semiconductor device production system |
US5226118A (en) | 1991-01-29 | 1993-07-06 | Prometrix Corporation | Data analysis system and method for industrial process control systems |
US5428555A (en) | 1993-04-20 | 1995-06-27 | Praxair, Inc. | Facility and gas management system |
US5841660A (en) * | 1993-05-04 | 1998-11-24 | Motorola, Inc. | Method and apparatus for modeling process control |
US5764520A (en) * | 1993-05-04 | 1998-06-09 | Motorola, Inc. | Control of lots in a continuous environment |
TW276353B (en) * | 1993-07-15 | 1996-05-21 | Hitachi Seisakusyo Kk | |
JP3334970B2 (en) * | 1993-10-29 | 2002-10-15 | 松下電器産業株式会社 | Production progress management support method and apparatus |
TW311190B (en) | 1994-01-19 | 1997-07-21 | Tokyo Electron Co Ltd | |
JP2982038B2 (en) * | 1994-04-01 | 1999-11-22 | 東京エレクトロン株式会社 | Scheduling method and apparatus for processing of object to be processed |
JP2918464B2 (en) * | 1994-04-08 | 1999-07-12 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JPH07297258A (en) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | Carrying equipment of plate body |
US5444632A (en) | 1994-04-28 | 1995-08-22 | Texas Instruments Incorporated | Apparatus and method for controlling and scheduling processing machines |
US5841659A (en) * | 1994-05-26 | 1998-11-24 | Matsushita Electric Industrial Co., Ltd. | Production plan generating method and apparatus |
US5696689A (en) * | 1994-11-25 | 1997-12-09 | Nippondenso Co., Ltd. | Dispatch and conveyer control system for a production control system of a semiconductor substrate |
JP3315844B2 (en) * | 1994-12-09 | 2002-08-19 | 株式会社東芝 | Scheduling device and scheduling method |
JPH08222616A (en) * | 1995-02-13 | 1996-08-30 | Dainippon Screen Mfg Co Ltd | Substrate processor |
US5591299A (en) | 1995-04-28 | 1997-01-07 | Advanced Micro Devices, Inc. | System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools |
US5612886A (en) | 1995-05-12 | 1997-03-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Method and system for dynamic dispatching in semiconductor manufacturing plants |
TW372926B (en) | 1996-04-04 | 1999-11-01 | Applied Materials Inc | Method and system of processing semiconductor workpieces and robot for use in said system |
US5975740A (en) | 1996-05-28 | 1999-11-02 | Applied Materials, Inc. | Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme |
US5801945A (en) | 1996-06-28 | 1998-09-01 | Lam Research Corporation | Scheduling method for robotic manufacturing processes |
JPH10135098A (en) * | 1996-09-09 | 1998-05-22 | Hitachi Ltd | System and method for production |
US5928389A (en) * | 1996-10-21 | 1999-07-27 | Applied Materials, Inc. | Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool |
JP3684056B2 (en) * | 1996-11-15 | 2005-08-17 | 株式会社日立国際電気 | Substrate transport control method for semiconductor manufacturing equipment |
US5855681A (en) * | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
US5909994A (en) * | 1996-11-18 | 1999-06-08 | Applied Materials, Inc. | Vertical dual loadlock chamber |
US6152070A (en) * | 1996-11-18 | 2000-11-28 | Applied Materials, Inc. | Tandem process chamber |
US6224312B1 (en) * | 1996-11-18 | 2001-05-01 | Applied Materials, Inc. | Optimal trajectory robot motion |
US5943230A (en) * | 1996-12-19 | 1999-08-24 | Applied Materials, Inc. | Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system |
JPH10303126A (en) * | 1997-02-28 | 1998-11-13 | Nikon Corp | Method for deciding moving sequence |
US5914879A (en) | 1997-03-04 | 1999-06-22 | Advanced Micro Devices | System and method for calculating cluster tool performance metrics using a weighted configuration matrix |
JPH10256342A (en) * | 1997-03-06 | 1998-09-25 | Kokusai Electric Co Ltd | Transfer control method |
US5950170A (en) * | 1997-04-11 | 1999-09-07 | Vanguard International Semiconductor Corporation | Method to maximize capacity in IC fabrication |
US5838565A (en) | 1997-05-15 | 1998-11-17 | Vanguard International Semiconductor Corporation | Manufacturing control method for IC plant batch sequential machine |
US5841677A (en) | 1997-05-21 | 1998-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for dispatching lots in a factory |
JPH10335415A (en) * | 1997-05-30 | 1998-12-18 | Dainippon Screen Mfg Co Ltd | Method for setting treating time |
US6201999B1 (en) * | 1997-06-09 | 2001-03-13 | Applied Materials, Inc. | Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool |
JP3824743B2 (en) * | 1997-07-25 | 2006-09-20 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JPH11163087A (en) * | 1997-12-01 | 1999-06-18 | Toshiba Microelectronics Corp | Substrate processing device and transportation scheduling method |
JPH11227931A (en) * | 1998-02-10 | 1999-08-24 | Yaskawa Electric Corp | Conveying order deciding method and its device |
US6122566A (en) | 1998-03-03 | 2000-09-19 | Applied Materials Inc. | Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system |
US6336204B1 (en) | 1998-05-07 | 2002-01-01 | Applied Materials, Inc. | Method and apparatus for handling deadlocks in multiple chamber cluster tools |
US6292708B1 (en) | 1998-06-11 | 2001-09-18 | Speedfam-Ipec Corporation | Distributed control system for a semiconductor wafer processing machine |
JP3487774B2 (en) | 1998-11-19 | 2004-01-19 | 沖電気工業株式会社 | Transport method in semiconductor device manufacturing process |
AU3108500A (en) | 1998-12-31 | 2000-07-24 | Silicon Valley Group, Inc. | Method and apparatus for synchronizing a substrate processing system |
US6418356B1 (en) * | 1998-12-31 | 2002-07-09 | Silicon Valley Group, Inc. | Method and apparatus for resolving conflicts in a substrate processing system |
US6408220B1 (en) | 1999-06-01 | 2002-06-18 | Applied Materials, Inc. | Semiconductor processing techniques |
-
2000
- 2000-03-07 US US09/521,026 patent/US6678572B1/en not_active Expired - Lifetime
- 2000-06-16 JP JP2001566169A patent/JP3987725B2/en not_active Expired - Fee Related
- 2000-06-16 EP EP00942927A patent/EP1264332A1/en not_active Withdrawn
- 2000-06-16 KR KR1020027011752A patent/KR100731822B1/en active IP Right Grant
- 2000-06-16 SG SG200405029-0A patent/SG143963A1/en unknown
- 2000-06-16 WO PCT/US2000/016794 patent/WO2001067493A1/en active Application Filing
- 2000-06-16 AU AU2000257476A patent/AU2000257476A1/en not_active Abandoned
-
2003
- 2003-10-14 US US10/685,934 patent/US7052919B2/en not_active Expired - Lifetime
-
2006
- 2006-12-28 JP JP2006354540A patent/JP4903553B2/en not_active Expired - Fee Related
-
2007
- 2007-04-23 JP JP2007112748A patent/JP4912947B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3987725B2 (en) | 2007-10-10 |
US6678572B1 (en) | 2004-01-13 |
JP4912947B2 (en) | 2012-04-11 |
JP2003526916A (en) | 2003-09-09 |
WO2001067493A1 (en) | 2001-09-13 |
US7052919B2 (en) | 2006-05-30 |
JP4903553B2 (en) | 2012-03-28 |
JP2007214550A (en) | 2007-08-23 |
KR20030007454A (en) | 2003-01-23 |
US20040087187A1 (en) | 2004-05-06 |
KR100731822B1 (en) | 2007-06-25 |
EP1264332A1 (en) | 2002-12-11 |
SG143963A1 (en) | 2008-07-29 |
JP2007281490A (en) | 2007-10-25 |
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