JPH10335415A - Method for setting treating time - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain an efficient throughput of wafer treatment by carrying wafers while the cycle time is surely managed by finding the time required for carrying the substrates, the time required for treating the wafers, and the longest treating time and deciding the cyclic carrying period of a carrying mechanism based on the longest required time. SOLUTION: In a first process, the time required by transfer robots TR1 and TR2 constituting a transfer mechanism for cyclically transferring wafers while the robots TR1 and TR2 exchange the wafers by making access to applying units SC1 and SC2, developing units SD1 and SD2, and heat-treating units TU1 and TU2 which are contained in a prescribed procedure, the required treating time of the units SC1 and SC2, SD1 and SD2, and TU1 and TU2 contained in the procedure, and the longest treating time among the required treating time are found. In a second process, the cyclically transferring period of the transfer mechanism is decided based on the longest required time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention performs a series of processes including a heating process, a cooling process, and a chemical solution process on a thin substrate (hereinafter, simply referred to as a "substrate") such as a semiconductor substrate or a liquid crystal glass substrate. The present invention relates to a method for setting a processing time in a substrate processing apparatus.

[0002]

2. Description of the Related Art Conventionally, in a substrate processing apparatus as described above, a transfer robot performs a heat treatment unit for performing a heat treatment on a substrate, a cooling processing unit for performing a cooling process, and a chemical processing unit for performing a chemical solution. And a series of substrate processing is achieved.

In such a circulating transfer, a tact transfer is performed from the viewpoint of controlling the heat history in the substrate processing. Here, the tact transfer is to transfer and exchange the substrate while keeping the circulation cycle of the transfer robot constant when circulating the substrate between a plurality of processing units.
This prevents an adverse effect such as a difference in the thermal history of the substrates in the order of introduction.

[0004]

However, when performing the tact transfer as described above, it is necessary to calculate a tact time, which is a cycle in which the transfer robot makes a round, but the tact time is determined in consideration of the operation of each processing unit. Calculating the exact tact time for each procedure was a very complicated task. If a time shorter than the originally possible cycle is set by mistake, tact transfer will not be realized, and if a long time is set, the throughput of the substrate processing apparatus will increase. Was.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of setting a processing time that enables tact transfer in a substrate processing apparatus by a simple method and improves the throughput of the substrate processing apparatus.

[0006]

According to a first aspect of the present invention, there is provided a method for setting a processing time, comprising circulating a substrate by a transport mechanism among a plurality of processing units for processing the substrate. A method for setting a processing time in a substrate processing apparatus that performs a series of processing in a predetermined procedure on a substrate, wherein a transport mechanism accesses each processing unit included in the predetermined procedure and exchanges a substrate to perform one circulation transport. A first process for obtaining a maximum required time, which is a maximum value, of a transport required time for performing, a processing required for each processing of each processing unit included in the predetermined procedure, and a maximum required time. And a second step of determining a cycle of the circulating transfer of the transfer mechanism based on the second step.

Further, the method for setting the processing time according to claim 2 is as follows.
2. The method of setting a processing time according to claim 1, wherein the transfer time is determined by the transfer mechanism assuming that the substrate loading / unloading unit for loading / unloading the substrate included in the substrate processing apparatus is regarded as one processing unit included in a predetermined procedure. The time required for processing includes the time required to access the inlet to exchange the substrate, and the required processing time includes the preparation time for loading / unloading the substrate in the substrate loading / unloading unit as one processing unit included in the predetermined procedure. It is characterized by.

[0008] Further, a method for setting a processing time according to claim 3 is as follows.
2. The method for setting a processing time according to claim 1, wherein in the first step, the first transfer robot provided in the transfer mechanism accesses each processing unit in charge of the first transfer robot in a predetermined procedure to perform substrate exchange. The first value, which is the maximum value of the first transfer required time for performing one cycle transfer and the required time required for each processing of each processing unit in charge of the first transfer robot in the predetermined procedure. A step of obtaining a group maximum required time, and a step in which a second transfer robot provided in the transfer mechanism accesses each processing unit in charge of the second transfer robot in a predetermined procedure and performs one circulation transfer while exchanging substrates. The second group maximum required time, which is the maximum value of the second transport required time and the required processing time required for each processing of each processing unit assigned to the second transport robot in the predetermined procedure, is determined. The second step includes a step of determining the cycle of the circulating transfer of the first and second transfer robots based on the larger of the first group maximum required time and the second group maximum required time. It is characterized by including.

Further, the method of setting the processing time according to claim 4 is as follows.
2. The method for setting a processing time according to claim 1, wherein the required time for transporting is such that the number of processing units included in the predetermined procedure and the transport mechanism move between the processing units included in the predetermined procedure to exchange the substrate. , And the total input standby time obtained by accumulating the input standby time in each processing unit included in the predetermined procedure.

Further, the method for setting the processing time according to claim 5 is as follows.
2. The processing time setting method according to claim 1, wherein each required processing time includes: a substantial processing time required for a substantial processing in each processing unit; a processing waiting time before and after the substantial processing; The operation time of the driving mechanism in the unit and the time required for substrate replacement in each processing unit are added.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view for explaining the structure of a substrate processing apparatus for executing a processing time setting method according to one embodiment of the present invention. The substrate processing apparatus 10 includes an indexer ID as a substrate loading / unloading unit for loading / unloading a substrate, an interface IF as a substrate transporting unit connected to the exposure apparatus, and a chemical solution treatment or heat treatment on the substrate surface sandwiched between these. And first and second main body portions 20 and 30 that perform the following.

The first main body portion 20 is a portion for performing a series of processes (specifically, a resist coating process, a heating process, a cooling process, and the like) on the substrate W, and is provided around a transport robot TR1 disposed at the center. First, a coating processing unit SC1 and SC2, which are processing units for performing resist coating processing, and a heat treatment unit group T in which a plurality of processing units for performing heat treatment and the like are collected.
U1, TUP2, and TU3 are arranged.
Each of these heat treatment unit groups TU1, TUP2, TU3
Although not shown, has a structure in which various processing units are stacked in the vertical direction, and includes heating units HP1, HP2, and HP each including a hot plate for heating a substrate.
3, Cool plates CP1 and CP for cooling HP4 and substrate
In addition to a cooling unit incorporating the CP2, CP3, CP4, and CP5, an adhesion strengthening unit AH and the like are also provided.

The second main body portion 30 is a portion for performing a series of processes (specifically, a developing process, a heating process, a cooling process, etc.) on the substrate W, and a transport robot TR disposed at the center.
2, heat processing unit groups TU4 and T2, each of which includes a plurality of processing units SD1 and SD2, which are processing units for performing resist development processing, and a plurality of processing units for performing heat treatment and the like.
It has a structure in which UP5 and TU6 are arranged. These heat treatment unit groups TU4, TUP5, and TU6 also have a structure in which various processing units are vertically stacked, although not shown.

Transfer robots TR1, TR2 as transfer mechanisms
Includes a head unit 22 having a pair of arms 21 (only one arm is visible in the figure) each supporting a substrate W. Each of the arms 21 can be independently advanced and retracted toward a surrounding processing unit by a two-stage telescopic mechanism (not shown),
2 is moved up and down as a whole, and one arm 21 is opposed to a specific processing unit.
Is moved forward and backward to move up and down to receive the processed substrate, and the other arm 21 is moved forward and backward to move up and down to set the unprocessed substrate transported from the previous processing unit or the like in the currently accessed processing unit. Thus, the substrate W can be exchanged with each processing unit. Although not shown, a rotating mechanism about a vertical axis (ie, Z axis) and a lifting mechanism in ± Z direction (ie, vertical direction) are connected to the head section 22 that supports the pair of arms 21. By controlling these drive mechanisms, the head unit 22 can be brought into a state of facing an arbitrary processing unit.

A transfer position P1 for transferring a substrate between the two transfer robots TR1 and TR2 is provided at a boundary between the first main body portion 20 and the second main body portion 30.
The transfer position P1 has a support pin and
Shuttle transport mechanism that reciprocates in the X direction (not shown)
Is arranged. For example, the substrate W supported by the arm 21 of the transfer robot TR1 on the first main body portion 20 side and conveyed to the transfer position P1 is placed on the support pins moved toward the first main body portion 20 (−X direction). Is moved to the second main body portion 30 side (+ X direction), and thereafter, the second main body portion 30 that has accessed the transfer position P1
Is received by the arm 21 of the transfer robot TR2 on the side.

One end (left side in the drawing) of the first main body 20 is used to carry out the substrate W from the cassette CA and
It is connected to an indexer ID for carrying in the substrate W to A. The transfer robot 40 provided in the indexer ID takes out the substrate W from the cassette CA and sends it to the transfer robot TR1, or conversely receives the substrate W subjected to a series of processing from the transfer robot TR1, and
Return to A.

Transfer robot 40 provided for indexer ID
A first hand 41 for transferring a substrate W to and from the transfer robot TR1 on the first main body portion 20 side;
And a second hand 42 for carrying in and out the substrate W with respect to.
The transfer robot 40 receives the substrate W transferred to the transfer position P2 by the transfer robot TR1 on the first main body portion 20 side, stores the substrate W in the cassette CA, and moves the substrate W in the cassette CA out of the cassette CA. It is taken out, moved to the transfer position P2, and transferred to the transfer robot TR1. Further, the transfer robot 40 is capable of reciprocating in the Y direction on a passage provided in the indexer ID. In the illustrated position, the first hand 41
Are in the ± Z direction and the X direction (that is, on the first body portion 20 side)
To transfer the substrate W to and from the front transfer robot TR1. On the other hand, when the transfer robot 40 moves in the ± Y direction from the position shown in the drawing to be in a state of facing the front of any of the cassettes CA, the second hand 42 moves in the ± Z direction and the −X direction to The transfer of the substrate W is performed between the substrate W.

At the other end (right side in the drawing) of the second main body portion 30, an interface IF for transferring the substrate W to and from the exposure apparatus is provided. The transfer robot 50 provided on the interface IF has the same structure as the transfer robot 40 provided on the indexer ID, and the transfer robot TR2 is transferred at a transfer position P3 at a transfer position P3. From the buffer BU provided with a plurality of shelves, or take out the exposed substrate W from the buffer BU,
To return to. Although not shown, below the buffer BU, the substrate W processed by the exposure device is received and transferred to the transfer robot 50, and the substrate W from the transfer robot 50 is received and transferred to the exposure device. A transfer mechanism for transferring is provided. A table for mounting the cassette CA is also provided next to the buffer BU. The substrate W in the cassette CA loaded into the substrate processing apparatus 10 from the outside via the interface IF is directly input to the exposure apparatus. Can also be.

FIG. 2 is a block diagram illustrating the configuration of the substrate processing apparatus 10 of FIG. In the figure, an arithmetic processing unit 60 is for managing the operation of the entire substrate processing apparatus 10, and stores an input / output unit 70 including a display and a keyboard, and data necessary for the operation of the substrate processing apparatus 10. The storage unit 80 is connected, and each processing unit, the transfer robots TR1, TR2, the transfer robot 40,
Communication with the transfer robots TR1 and TR2 and transfer are performed based on data provided by the input / output unit 70 and data stored in the storage unit 80. In addition to the robots 40 and 50, the coating units SC1 and SC2, and the developing units SD1 and S
D2, an adhesion strengthening unit AH constituting the heat treatment unit groups TU1 to TU6, a post-exposure bake unit PEB, heating units HP1, HP2,..., And cooling units CP1, CP
2, CP3, ..., etc. are controlled.

FIG. 3 is a flowchart illustrating the basic operation of the substrate processing apparatus 10 shown in FIGS. Hereinafter, the operation of the device 10 will be described with reference to the illustrated flowchart.

First, in step S1, an operator inputs a lot type, a wafer flow of each lot, processing conditions, and the like via the input / output unit 70. If necessary, information on the arrangement of the respective processing units constituting the apparatus 10 and information on the transfer robots TR1, TR2 and the like are input. Then, based on the given wafer flow and the like,
The details of the operation routine of the transport robots TR1 and TR2 and the details of the processing pattern in each processing unit are determined. In addition, the wafer flow is an order (transfer order) for making a round between each unit in order to perform a series of processes of a predetermined procedure on the substrate W.
But also includes factors such as the time required for processing in each processing unit (processing time). The specific contents of the processing conditions include the processing temperature, the rotation speed, the type of the processing liquid, and the like.

Next, in step S2, step S1
Is separated into a plurality of flow groups. Specifically, the first and second body portions 20, 30
Is divided into two. That is, the transfer robot TR1 on the first main body portion 20 side
Are separated into the processing steps handled by the transfer robot TR2 and the processing steps handled by the transfer robot TR2 on the second main body portion 30 side, and a pair of flow groups are obtained as the transfer order focusing on the individual transfer robots TR1 and TR2. Thereafter, these flow groups are numbered k and flow groups FGk (= FG1, F
G2).

Next, in step S3, a required transport time ATR (k) is obtained for each flow group FGk. The required transfer time ATR (k) is a time required for the transfer robot TRk of each group to access each processing unit included in the flow group FGk and perform one cycle of transfer while exchanging the substrate W without waiting. Time. In this embodiment, the required transport time ATR (k) is determined based on the following equation: ATR (k) = TRT × PC + IWT (1) Here, the variable TRT is used to exchange the substrate by moving the transfer robot TRk between the respective processing units Ukn (where n means the target processing unit number in the flow group FGk) included in the flow group FGk. The variable PC means the number of processing units included in the flow group FGk, and the variable IWT indicates the number of processing units included in the flow group FGk. This means the total input standby time obtained by accumulating the standby time.

The inter-process transfer time TRT is a simultaneous exchange time IOT for the transfer robot TRk to exchange an unprocessed substrate W and a processed substrate W in one processing unit.
M and the maximum inter-process moving time MVTM, which is the maximum value of the inter-process moving time required when the transport robot TRk moves from one processing unit to another processing unit. Also, the number P of processing units
C is a value obtained by adding, as processing units, units related to loading and unloading of substrates, such as an indexer ID, an interface IF, and a shuttle at the transfer position P1, in addition to the original processing units such as the coating processing unit SC1 for performing substantial processing. It has become. In addition, the total charging standby time IW
T means the total time during which the transport robot TRk accesses each processing unit Ukn, unloads the processed substrate W here, and waits without loading the unprocessed substrate W into the inside, Necessary for management of heat history.

Table 1 below is a list summarizing the contents of variables used for calculating the required transfer time ATR (k).

[0027]

[Table 1]

Next, in step S4, a required processing time UCT (n) is obtained for each processing unit Ukn of each flow group FGk. The required processing time UCT (n) is the time required for each processing unit Ukn included in the flow group FGk by the transfer robot TRk of each group. In this embodiment, the required processing time UCT (n)
Is determined based on the following equation: UCT (n) = PRT + PRWT + AFWT + PRPT + IOTM (2) Here, the variable PRT means the process time for each processing unit Ukn, that is, the substantial processing time required for the substantial processing in each processing unit Ukn, and the variable PRWT means the processing before such a substantial processing. The variable AFWT means a waiting time, and the variable AFWT means a processing waiting time after such substantial processing.
RPT means the operating time of the drive mechanism in each processing unit Ukn. Since the variable IOTM has already been described in the calculation of the required transport time ATR (k), the description is omitted here.

When the target processing unit is a parallel processing unit that performs parallel processing, the process time PRT is a value obtained by dividing the substantial processing time in one parallel processing unit by the number of parallel processing units. And Here, since the parallel processing requires a long time in the heating processing during the wafer flow, etc., in order to prevent a situation in which the throughput is reduced due to a rate limiting factor, a plurality of substrates W are processed by a plurality of processing units of the same type. By performing the processing in parallel while shifting the timing, the loss of time due to the waiting of the transfer robot TRk here is prevented, and the overall throughput is increased. In addition, the waiting time before processing PRWT is determined by the substrate W in each processing unit Ukn.
Is simply a time to hold, but it is indispensable for an application in which the thermal history of the substrate W is strictly controlled. The operation time PRPT of the drive mechanism is the sum of the operation times required for operations that are outside the substantial processing time in the target processing unit and require a certain time.

In the above, the calculation of the required processing time UCT (n) for the normal processing unit has been described. However, the cycle in the unit (indexer ID, interface IF, shuttle at the transfer position P1, etc.) related to the loading / unloading of the substrate is described. It is also necessary to consider the time required for operation and board replacement. That is, for the indexer ID,
Time from when the substrate W is received until it is stored in the cassette CA to receive another substrate W and ready to transfer it to the transfer robot (maximum cycle time) IDCT
Is added to the simultaneous replacement time IOTM of the substrate W and processed as a kind of required processing time UCT (n). The interface IF is processed by adding the maximum cycle time IFIFT to the simultaneous replacement time IOTM of the substrate W as a kind of required processing time UCT (n). Further, for the shuttle at the transfer position P1, the sum of the maximum cycle time STLCT and the simultaneous replacement time IOTM of the substrate W is processed as a kind of required processing time UCT (n).

The maximum cycle time IFIFT of the interface IF is the cycle time of the transfer robot 50 when the interface IF is used only for transferring the substrate between the second main body 30 and the exposure apparatus. means. Therefore, when the interface IF is used only for transferring a substrate between the outside and the exposure apparatus (that is, when it is used only as an indexer of the exposure apparatus), the maximum cycle time IFCT is used instead of the maximum cycle time IFIFT. And the sum of the simultaneous replacement time IOTM of the substrates W is adopted as the processing required time UCT (n) of the interface IF. Further, the interface IF is connected to the second main body 30.
In the case of a combined type in which a substrate W is supplied from an external device to transfer the substrate to and from the exposure apparatus, and a cassette CA is supplied from the outside to transfer the substrate to the exposure apparatus, a margin is provided. Maximum cycle time IFIFT + IF
The value obtained by adding the simultaneous replacement time IOTM of the substrate W to the CT using the CT is used as a kind of processing required time UCT (n) of the interface IF.

Table 2 below is a list summarizing the contents of variables used for calculating the required processing time UCT (n) and the like.

[0033]

[Table 2]

Next, in step S5, step S3
The required time ATR (k) obtained in step S4 is compared with the required processing time UCT (n) obtained in step S4 to determine the maximum value.
This maximum value is defined as the shortest cycle time GCTk. At this time, the maximum cycle time IDCT of the indexer ID, the maximum cycle time IFIFT of the interface IF, IF
As described above, the CT and the maximum cycle time STLCT of the shuttle at the transfer position P1 are also subjected to comparison when determining the maximum value as one type of the required processing time UCT (n). Furthermore, each flow group FGk
The shortest cycle times GCTk are compared with each other, and the largest one is defined as the tact time of the entire substrate processing apparatus 10. Here, the tact time refers to the time from the start of operation in a certain processing unit to the start of the same operation in the same processing unit again after each transfer robot TRk starts operation in a certain processing unit. By performing such tact management, the thermal history of the substrate W to be processed can be kept constant.

Finally, in step S6, in response to a request from the operator to start processing, in addition to the conditions given in step S1, ie, the transfer order of the substrate W, the processing time, etc., the tact time obtained in steps S2 to S5 , While transporting the substrates W in the respective cassettes CA set in the indexer ID in a predetermined order,
Are sequentially subjected to predetermined processes.

FIG. 4 is a flowchart showing an example of how a specific substrate W is transported and processed in the substrate processing apparatus 10.

First, the transfer robot TR1 transfers the substrate W received from the indexer ID to the heat treatment unit group TU1.
The substrate W is transported to the adhesion enhancing unit AH provided in the substrate W, and the substrate W is subjected to a heat treatment in the adhesion enhancing gas atmosphere in the adhesion enhancing unit AH. Further, the transfer robot TR1 transfers the substrate W, which has been subjected to the heat treatment in the adhesion strengthening unit AH, to the cooling unit CP1 provided in the heat treatment unit group TU1,
The cooling process is performed on the substrate W by the cooling unit CP1.

Next, the transfer robot TR1 transfers the substrate W, which has been subjected to the heat treatment in the adhesion strengthening unit AH and the cooling unit CP1, to the coating unit SC1. The coating unit SC1 applies a resist liquid to the substrate W by spin coating.

Next, the transport robot TR1 transports the substrate W which has been subjected to the coating process in the coating process unit SC1 to one of the heating units HP1 and HP2 provided in the heat treatment unit group TU2, and the transport unit TR1 uses the heating units HP1 and HP2. This substrate W is subjected to a heat treatment. Further, the transport robot TR1
Transports the substrate W, which has been subjected to the heat treatment in the heating units HP1, HP2, to one of the cooling units CP2, CP3 provided in the heat treatment unit group TU2, and cools the substrate W in the cooling units CP2, CP3. .

Next, the transfer robot TR1 transfers the substrate W, which has been subjected to the heat treatment in the heating units HP1, HP2 and the cooling units CP2, CP3, to the coating unit SC2. In the coating processing unit SC2, the substrate W
A protective film is formed on the resist by spin coating.

Next, the transport robot TR1 transports the substrate W, which has been subjected to the coating process in the coating process unit SC2, to one of the heating units HP3, HP4 provided in the heat treatment unit group TU3, and the transport unit TR3 uses the heating units HP3, HP4. This substrate W is subjected to a heat treatment. Further, the transport robot TR1
Transports the substrate W, which has been subjected to the heat treatment in the heating units HP3, HP4, to one of the cooling units CP4, CP5 provided in the heat treatment unit group TU3, and cools the substrate W in the cooling units CP4, CP5. .

Next, the transfer robot TR1 sets the substrate W, which has been subjected to the heat treatment in the heat treatment unit group TU3 on the first main body portion 20 side, to the transfer position P1 in order to transfer the substrate W to the second main body portion 30 side. .

Next, the transfer robot TR2 ends the processing on the first main body portion 20 side and transfers the substrate W set at the transfer position P1 to the interface IF side without performing any special processing.

Next, the transport robot TR2 transports the exposed substrate W returned to the interface IF to the post-exposure bake unit PEB provided in the thermal processing unit group TU4, and performs post-bake processing in the post-exposure bake unit PEB. Apply. Further, the transfer robot TR2 removes the substrate W after the post-exposure bake unit PEB from the post-baking process, and cools the substrate W in the heat treatment unit group TU4.
The substrate W is transported to P6, and the cooling unit CP6 performs a cooling process on the substrate W.

Next, the transfer robot TR2 transfers the substrate that has been subjected to the heat treatment in the post-exposure bake unit PEB and the cooling unit CP6 to one of the development processing units SD1 and SD2. Development processing unit S
In steps D1 and SD2, development processing of the exposed resist is performed on the substrate W.

Next, the transport robot TR2 heats the substrates W having undergone the development processing in the development processing units SD1 and SD2 into the heating units HP5 and HP6 provided in the heat treatment unit group TU5.
And the heating units HP5 and HP6
The substrate W is subjected to a heat treatment. Further, the transfer robot T
R2 transports the substrate W, which has been subjected to the heat treatment in the heating units HP5, HP6, to one of the cooling units CP7, CP8 provided in the heat treatment unit group TU5, and cools the substrate W in these cooling units CP7, CP8. I do.

Next, the transfer robot TR2 sets the substrate W at the transfer position P1 so as to transfer the substrate W, which has been subjected to the heat treatment in the heat treatment unit group TU5 on the second body portion 30 side, to the first body portion 20 side.

Next, the transport robot TR for the first body part 20
1 ends the processing on the second body portion 30 side and transfers the substrate W set at the transfer position P1 to the indexer ID side without performing any special processing. Through the above steps, a series of processes on the specific substrate W in the substrate processing apparatus 10 is completed.

When the wafer flow as described above is divided into a plurality of flow groups in step S2 of FIG. 3, the first flow group FG1 becomes as shown in FIG. FG2 is as shown in FIG. For example, the number PC of processing units included in the first flow group FG1 is:
The number is 10 including the indexer ID and the shuttle at the transfer position P1, and the number PC of the processing units included in the second flow group FG2 is 8. Also, the first
In the flow group FG1, the process time PRT of the heating units HP1 and HP2 as the parallel processing units
Is a value obtained by dividing the heating time of the substrate W in each of the heating units HP1 and HP2 by 2 which is the number of parallel processing units.
For the indexer ID and the shuttle at the transfer position P1, the respective maximum cycle times IDC
The sum of T, STLCT and the simultaneous replacement time IOTM of the substrate W is processed as a kind of required processing time UCT (n).

[0050]

As is apparent from the above description, in the method according to the first aspect, the transport mechanism accesses each of the processing units included in the predetermined procedure and exchanges the substrates to perform one circulation transport. Of the maximum required time, which is the maximum value of the required time required for the transfer and the required time required for each processing of each processing unit included in the predetermined procedure.
And the second step of determining the cycle of circulating transport of the transport mechanism based on the maximum required time, so that even if the required transport time is greater in the transport step, Even when any of the required processing times is largely determined in the processing step, the substrate can be transported while the tact time is reliably managed, and the efficient throughput of the substrate processing can be maintained.

In the method according to the second aspect, the time required for the transfer is such that the transfer mechanism regards the substrate loading / unloading section of the substrate processing apparatus as one processing unit included in a predetermined procedure and accesses the processing unit to exchange the substrate. And the required processing time includes
The preparation time for carrying in and out the substrate in the substrate carrying-in / out part is included as one processing unit included in the predetermined procedure with the substrate carrying-in / out part, which is more complete in consideration of the access of the substrate carrying-in / out part of the substrate carrying mechanism. This enables efficient tact transfer.

According to a third aspect of the present invention, there is provided the first and second transfer robots in which the transfer mechanism operates individually.
The first transport robot accesses each processing unit in charge of the first transport robot in the predetermined procedure and performs a single cycle transport while performing substrate exchange, and the first transport in the predetermined procedure. The first group maximum required time, which is the maximum value of the processing time required for each processing of each processing unit in charge of the robot, is determined, and the second transfer robot is assigned to the second transfer robot in a predetermined procedure. A second transfer time required for performing one cycle transfer while accessing each processing unit and performing substrate exchange, and a process required for each process of each processing unit in charge of the second transfer robot in a predetermined procedure. And the second group maximum required time, which is the maximum value of the time, and the first and second transport robots are determined based on the larger of the first group maximum required time and the second group maximum required time. Since determining the period of the circulating transfer,
For example, when the substrate processing apparatus is divided into a plurality of processing areas to improve the transfer efficiency, for example, when the first and second transfer robots are individually operated in the plurality of processing areas, efficient tact transfer becomes possible. .

In the method according to the fourth aspect of the present invention, the required transfer time is determined by the number of the processing units included in the predetermined procedure and the transfer mechanism is moved between the processing units included in the predetermined procedure to exchange the substrates. The total input standby time, which is the sum of the input standby time of each processing unit included in the predetermined procedure, is added to the product of the transfer exchange time and the total replacement standby time. It is possible to determine an efficient tact time.

Further, in the method according to the fifth aspect, each required processing time includes each substantial processing time required for substantial processing in each processing unit, a processing standby time before and after the substantial processing, and Since the operation time of the drive mechanism in the middle and the time required for substrate replacement in each processing unit are added, even if the processing steps in each processing unit are complicated, the efficiency can be simply and reliably calculated according to the above-mentioned standard. Effective tact time can be determined.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a substrate processing apparatus according to an embodiment.

FIG. 2 is a block diagram illustrating the configuration of the apparatus in FIG.

FIG. 3 is a diagram for explaining the operation of the device of FIG. 1;

FIG. 4 is a diagram illustrating an example of a substrate processing step.

5 is a diagram showing a result of dividing the substrate processing step of FIG. 4 into two groups.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 20 1st main-body part 30 2nd main-body part 40,50 Transfer robot 60 Input-output part 70 Operation processing part 80 Storage part TR1 Transfer robot TR2 Transfer robot SC1, SC2 Coating processing unit SD1, SD2 Development processing unit TU1 TU6 Heat treatment unit group CP1 to CP8 Cooling unit HP1 to HP6 Heating unit AH Adhesion strengthening unit PEB Post-exposure bake unit BU Buffer ID Indexer IF interface

Claims (5)

[Claims] 1. A method for setting a processing time in a substrate processing apparatus for performing a series of processing in a predetermined procedure on a substrate by circulating the substrate by a transport mechanism between a plurality of processing units for processing the substrate, The transport mechanism accesses each of the processing units included in the predetermined procedure and exchanges the substrate, while performing a single cyclic transport while performing the transfer, and the processing of each processing unit included in the predetermined procedure. A first step of determining a maximum required time, which is a maximum value of each processing required time, and a second step of determining a cycle of circulating transport of the transport mechanism based on the maximum required time. , A processing time setting method. 2. The method for setting a processing time according to claim 1, wherein the required transfer time includes a substrate loading / unloading unit for loading / unloading a substrate provided in the substrate processing apparatus, in the predetermined procedure.
The processing mechanism includes a time period in which the transfer mechanism accesses the substrate loading / unloading unit and replaces the substrate, assuming that the substrate loading / unloading unit is one processing unit included in the predetermined procedure. A method for setting a processing time, comprising a preparation time for carrying in / out a substrate in a substrate carrying-in / out section. 3. The method of setting a processing time according to claim 1, wherein the first step is performed by a first transfer robot provided in the transfer mechanism, each of the processes being performed by the first transfer robot in the predetermined procedure. A first transfer required time for performing one cycle transfer while accessing the unit and performing substrate exchange, and a process required for each process of each processing unit in charge of the first transfer robot in the predetermined procedure. Obtaining a first group maximum required time which is a maximum value of the time;
A second transfer time required for the second transfer robot included in the transfer mechanism to access each processing unit in charge of the second transfer robot in the predetermined procedure and perform one cycle of transfer while exchanging substrates; Obtaining a second group maximum required time that is the maximum value of the processing required time of each processing unit required by each processing unit in charge of the second transfer robot in the predetermined procedure. The step (2) includes a step of determining a cycle of circulating transfer of the first and second transfer robots based on a larger one of the first group maximum required time and the second group maximum required time. How to set the processing time. 4. The method of setting a processing time according to claim 1, wherein the required transfer time is determined by the number of processing units included in the predetermined procedure and the number of processing units included in the predetermined procedure by the transfer mechanism. And a product obtained by adding a product obtained by multiplying a transfer exchange time for performing a substrate exchange by moving and a total insert standby time obtained by accumulating an input standby time in each processing unit included in the predetermined procedure. How to set the processing time. 5. The processing time setting method according to claim 1, wherein each of the required processing times is a substantial processing time required for a substantial processing in each processing unit, and a processing before and after the substantial processing is performed. A processing time setting method characterized by adding a standby time, an operation time of a drive mechanism in each processing unit, and a time required for substrate replacement in each processing unit.