ATE80496T1 - Ausrichtungsvorrichtung eines halbleiterplaettchentraegers und verfahren zum ausrichten. - Google Patents
Ausrichtungsvorrichtung eines halbleiterplaettchentraegers und verfahren zum ausrichten.Info
- Publication number
- ATE80496T1 ATE80496T1 AT86307686T AT86307686T ATE80496T1 AT E80496 T1 ATE80496 T1 AT E80496T1 AT 86307686 T AT86307686 T AT 86307686T AT 86307686 T AT86307686 T AT 86307686T AT E80496 T1 ATE80496 T1 AT E80496T1
- Authority
- AT
- Austria
- Prior art keywords
- alignment
- plate carrier
- semiconductor plate
- chip carriers
- castellated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/784,406 US4646435A (en) | 1985-10-04 | 1985-10-04 | Chip carrier alignment device and alignment method |
EP86307686A EP0217678B1 (de) | 1985-10-04 | 1986-10-06 | Ausrichtungsvorrichtung eines Halbleiterplättchenträgers und Verfahren zum Ausrichten |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE80496T1 true ATE80496T1 (de) | 1992-09-15 |
Family
ID=25132374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT86307686T ATE80496T1 (de) | 1985-10-04 | 1986-10-06 | Ausrichtungsvorrichtung eines halbleiterplaettchentraegers und verfahren zum ausrichten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4646435A (de) |
EP (1) | EP0217678B1 (de) |
AT (1) | ATE80496T1 (de) |
DE (1) | DE3686693T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
EP0260490A1 (de) * | 1986-08-27 | 1988-03-23 | Kabushiki Kaisha Toshiba | Verbindungsschicht für ein elektronisches Bauelement und Verfahren zum Verbinden eines elektronischen Bauelementes mit einer solchen Schicht |
US5170931A (en) * | 1987-03-11 | 1992-12-15 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
US4759491A (en) * | 1987-05-18 | 1988-07-26 | American Telephone And Telegraph Company | Method and apparatus for applying bonding material to component leads |
US5098305A (en) * | 1987-05-21 | 1992-03-24 | Cray Research, Inc. | Memory metal electrical connector |
US5069626A (en) * | 1987-07-01 | 1991-12-03 | Western Digital Corporation | Plated plastic castellated interconnect for electrical components |
WO1989000346A1 (en) * | 1987-07-01 | 1989-01-12 | Western Digital Corporation | Plated plastic castellated interconnect for electrical components |
US4892245A (en) * | 1988-11-21 | 1990-01-09 | Honeywell Inc. | Controlled compression furnace bonding |
US4907342A (en) * | 1989-01-18 | 1990-03-13 | General Electric Company | Method of assembling a molded case circuit breaker current transformer assembly |
JPH03205857A (ja) * | 1990-01-06 | 1991-09-09 | Fujitsu Ltd | 樹脂封止型電子部品 |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5085362A (en) * | 1991-01-16 | 1992-02-04 | Atmel Corporation | Gravity-held alignment member for manufacture of a leadless chip carrier |
US5252079A (en) * | 1992-02-10 | 1993-10-12 | Amp Incorporated | Method of manufacture of a contact guide |
US5528463A (en) * | 1993-07-16 | 1996-06-18 | Dallas Semiconductor Corp. | Low profile sockets and modules for surface mountable applications |
EP0647091A1 (de) * | 1993-10-05 | 1995-04-05 | AT&T Corp. | Passive Ausrichtung von Bauteilen mit einem durch Mikro-Bearbeitung hergestellten Werkzeug |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
DE19600928A1 (de) * | 1996-01-12 | 1997-07-24 | Ibm | Vorrichtung zur Handhabung von Leiterplatten und deren Herstellung |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US5808875A (en) * | 1996-03-29 | 1998-09-15 | Intel Corporation | Integrated circuit solder-rack interconnect module |
US5933732A (en) * | 1997-05-07 | 1999-08-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nonvolatile devices with P-channel EEPROM devices as injector |
FR2810571A1 (fr) * | 2000-06-27 | 2001-12-28 | Eca | Dispositif et machine de prehension d'objets de petites dimensions |
US6711810B2 (en) * | 2001-09-19 | 2004-03-30 | International Business Machines Corporation | Method of assembling a land grid array module |
TW200414858A (en) * | 2003-01-15 | 2004-08-01 | Senju Metal Industry Co | Apparatus and method for aligning and attaching solder columns to a substrate |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4352449A (en) * | 1979-12-26 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | Fabrication of circuit packages |
US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
US4512509A (en) * | 1983-02-25 | 1985-04-23 | At&T Technologies, Inc. | Technique for bonding a chip carrier to a metallized substrate |
GB2138339B (en) * | 1983-04-19 | 1986-05-14 | Welwyn Electronics Ltd | Applying and securing solder-coated or solderable spheres to solderable or solder-coated terminal pads |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4479298A (en) * | 1983-07-26 | 1984-10-30 | Storage Technology Partners | Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board |
US4648666A (en) * | 1985-07-03 | 1987-03-10 | Amp Incorporated | Electrical connector |
-
1985
- 1985-10-04 US US06/784,406 patent/US4646435A/en not_active Expired - Lifetime
-
1986
- 1986-10-06 DE DE8686307686T patent/DE3686693T2/de not_active Expired - Fee Related
- 1986-10-06 EP EP86307686A patent/EP0217678B1/de not_active Expired - Lifetime
- 1986-10-06 AT AT86307686T patent/ATE80496T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3686693T2 (de) | 1993-04-22 |
EP0217678A3 (en) | 1989-08-16 |
US4646435A (en) | 1987-03-03 |
EP0217678B1 (de) | 1992-09-09 |
EP0217678A2 (de) | 1987-04-08 |
DE3686693D1 (de) | 1992-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |