ATE70663T1 - Verfahren zur bildung hermetisch geschlossener elektrischer durchfuehrungsleiter. - Google Patents

Verfahren zur bildung hermetisch geschlossener elektrischer durchfuehrungsleiter.

Info

Publication number
ATE70663T1
ATE70663T1 AT85901155T AT85901155T ATE70663T1 AT E70663 T1 ATE70663 T1 AT E70663T1 AT 85901155 T AT85901155 T AT 85901155T AT 85901155 T AT85901155 T AT 85901155T AT E70663 T1 ATE70663 T1 AT E70663T1
Authority
AT
Austria
Prior art keywords
region
planar
periphery
feedthrough conductor
insulative layer
Prior art date
Application number
AT85901155T
Other languages
English (en)
Inventor
Kurt E Petersen
Original Assignee
Concha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Concha Corp filed Critical Concha Corp
Application granted granted Critical
Publication of ATE70663T1 publication Critical patent/ATE70663T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Ladders (AREA)
  • Cylinder Crankcases Of Internal Combustion Engines (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Resistance Heating (AREA)
AT85901155T 1984-01-25 1985-01-24 Verfahren zur bildung hermetisch geschlossener elektrischer durchfuehrungsleiter. ATE70663T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/573,508 US4525766A (en) 1984-01-25 1984-01-25 Method and apparatus for forming hermetically sealed electrical feedthrough conductors
PCT/US1985/000131 WO1985003381A1 (en) 1984-01-25 1985-01-24 Method and apparatus for forming hermetically sealed electrical feedthrough conductors
EP85901155A EP0169241B1 (de) 1984-01-25 1985-01-24 Verfahren zur bildung hermetisch geschlossener elektrischer durchführungsleiter

Publications (1)

Publication Number Publication Date
ATE70663T1 true ATE70663T1 (de) 1992-01-15

Family

ID=24292270

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85901155T ATE70663T1 (de) 1984-01-25 1985-01-24 Verfahren zur bildung hermetisch geschlossener elektrischer durchfuehrungsleiter.

Country Status (6)

Country Link
US (1) US4525766A (de)
EP (1) EP0169241B1 (de)
JP (1) JPS61501236A (de)
AT (1) ATE70663T1 (de)
DE (1) DE3584917D1 (de)
WO (1) WO1985003381A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0711461B2 (ja) * 1986-06-13 1995-02-08 株式会社日本自動車部品総合研究所 圧力検出器
US4769622A (en) * 1986-11-28 1988-09-06 General Instrument Corporation Reed switch having improved glass-to-metal seal
GB8718637D0 (en) * 1987-08-06 1987-09-09 Spectrol Reliance Ltd Sealing electrical feedthrough
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
US5738270A (en) * 1994-10-07 1998-04-14 Advanced Bionics Corporation Brazeless ceramic-to-metal bonding for use in implantable devices
US5513793A (en) * 1994-10-07 1996-05-07 Advanced Bionics Corporation Brazeless ceramic-to-metal bond for use in implantable devices
JP3077543B2 (ja) * 1995-01-13 2000-08-14 セイコーエプソン株式会社 被覆導電体およびその製造方法、およびこれを用いた電子部品、電子機器
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US5817984A (en) * 1995-07-28 1998-10-06 Medtronic Inc Implantable medical device wtih multi-pin feedthrough
US5871513A (en) * 1997-04-30 1999-02-16 Medtronic Inc. Centerless ground feedthrough pin for an electrical power source in an implantable medical device
JPH1174396A (ja) * 1997-08-28 1999-03-16 Kyocera Corp 高周波用入出力端子ならびに高周波用半導体素子収納用パッケージ
US6516808B2 (en) 1997-09-12 2003-02-11 Alfred E. Mann Foundation For Scientific Research Hermetic feedthrough for an implantable device
US6244104B1 (en) 1998-12-04 2001-06-12 Bridgestone/Firestone Research, Inc. Method for preparing an innerliner of a pneumatic tire for the quick bonding of an electronic monitoring device
US6309494B1 (en) 1998-12-04 2001-10-30 Bridgestone/Firestone Research, Inc. Method of attaching sensitive electronic equipment to the inner surface of a tire
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
AU2629901A (en) 2000-01-06 2001-07-16 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (mems)
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US7161476B2 (en) 2000-07-26 2007-01-09 Bridgestone Firestone North American Tire, Llc Electronic tire management system
US8266465B2 (en) 2000-07-26 2012-09-11 Bridgestone Americas Tire Operation, LLC System for conserving battery life in a battery operated device
CA2676101C (en) 2000-07-26 2016-12-06 Bridgestone/Firestone, Inc. Electronic tire management system
GB0122165D0 (en) * 2001-09-13 2001-10-31 Randox Lab Ltd Method of sealing electrodes
US20030191505A1 (en) * 2002-04-09 2003-10-09 Mark Gryzwa Magnetic structure for feedthrough filter assembly
US6848316B2 (en) * 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
US6759309B2 (en) * 2002-05-28 2004-07-06 Applied Materials, Inc. Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates
US6945331B2 (en) * 2002-07-31 2005-09-20 Schlumberger Technology Corporation Multiple interventionless actuated downhole valve and method
US7719854B2 (en) 2003-07-31 2010-05-18 Cardiac Pacemakers, Inc. Integrated electromagnetic interference filters and feedthroughs
US7622782B2 (en) * 2005-08-24 2009-11-24 General Electric Company Pressure sensors and methods of making the same
US7998777B1 (en) 2010-12-15 2011-08-16 General Electric Company Method for fabricating a sensor
US9010200B2 (en) 2012-08-06 2015-04-21 Amphenol Thermometrics, Inc. Device for measuring forces and method of making the same
WO2016176491A1 (en) * 2015-04-28 2016-11-03 Applied Materials, Inc. Method and apparatus for fabricating battery with mesa structures and battery comprising same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU38614A1 (de) * 1959-05-06
US3174112A (en) * 1960-07-29 1965-03-16 Westinghouse Electric Corp Semiconductor devices providing the functions of a plurality of conventional components
US3318744A (en) * 1963-03-27 1967-05-09 Reeves Bros Inc Method of laminating polyurethane foam
US4193836A (en) * 1963-12-16 1980-03-18 Signetics Corporation Method for making semiconductor structure
US3386008A (en) * 1964-08-31 1968-05-28 Cts Corp Integrated circuit
US3397447A (en) * 1964-10-22 1968-08-20 Dow Corning Method of making semiconductor circuits
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
JPS6030102B2 (ja) * 1980-07-14 1985-07-15 ヤマハ株式会社 半導体装置の製法

Also Published As

Publication number Publication date
DE3584917D1 (de) 1992-01-30
US4525766A (en) 1985-06-25
EP0169241A4 (de) 1988-04-26
JPS61501236A (ja) 1986-06-19
EP0169241A1 (de) 1986-01-29
EP0169241B1 (de) 1991-12-18
WO1985003381A1 (en) 1985-08-01

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties