ATE555868T1 - Verfahren zur 'on-the-fly' laserverarbeitung bei nicht konstanter geschwindigkeit - Google Patents
Verfahren zur 'on-the-fly' laserverarbeitung bei nicht konstanter geschwindigkeitInfo
- Publication number
- ATE555868T1 ATE555868T1 AT07840316T AT07840316T ATE555868T1 AT E555868 T1 ATE555868 T1 AT E555868T1 AT 07840316 T AT07840316 T AT 07840316T AT 07840316 T AT07840316 T AT 07840316T AT E555868 T1 ATE555868 T1 AT E555868T1
- Authority
- AT
- Austria
- Prior art keywords
- fly
- constant speed
- laser processing
- group
- structures
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83208206P | 2006-07-20 | 2006-07-20 | |
US11/532,160 US8084706B2 (en) | 2006-07-20 | 2006-09-15 | System and method for laser processing at non-constant velocities |
PCT/US2007/072432 WO2008011255A2 (en) | 2006-07-20 | 2007-06-29 | Systems and methods for laser processing during periods having non-constant velocities |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE555868T1 true ATE555868T1 (de) | 2012-05-15 |
Family
ID=38805776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07840316T ATE555868T1 (de) | 2006-07-20 | 2007-06-29 | Verfahren zur 'on-the-fly' laserverarbeitung bei nicht konstanter geschwindigkeit |
Country Status (7)
Country | Link |
---|---|
US (2) | US8084706B2 (de) |
EP (1) | EP2043809B1 (de) |
JP (1) | JP2009544470A (de) |
KR (1) | KR20090045260A (de) |
AT (1) | ATE555868T1 (de) |
TW (1) | TW200807636A (de) |
WO (1) | WO2008011255A2 (de) |
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US9492886B2 (en) * | 2008-11-21 | 2016-11-15 | Precitec Kg | Method and device for monitoring a laser processing operation to be performed on a workpiece and laser processing head having such a device |
JP4612733B2 (ja) * | 2008-12-24 | 2011-01-12 | 東芝機械株式会社 | パルスレーザ加工装置 |
WO2010131687A1 (ja) * | 2009-05-12 | 2010-11-18 | オリンパスメディカルシステムズ株式会社 | 被検体内撮像システムおよび被検体内導入装置 |
DE102009023307A1 (de) * | 2009-05-29 | 2010-12-02 | Kuka Roboter Gmbh | Verfahren und Vorrichtung zur Steuerung eines Manipulators |
JP5620669B2 (ja) * | 2009-10-26 | 2014-11-05 | 東芝機械株式会社 | レーザダイシング方法およびレーザダイシング装置 |
US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
JP5452247B2 (ja) * | 2010-01-21 | 2014-03-26 | 東芝機械株式会社 | レーザダイシング装置 |
JP5981094B2 (ja) | 2010-06-24 | 2016-08-31 | 東芝機械株式会社 | ダイシング方法 |
WO2012116226A2 (en) * | 2011-02-25 | 2012-08-30 | Gsi Group Corporation | Predictive link processing |
DE112012002844T5 (de) | 2011-07-05 | 2014-04-24 | Electronic Scientific Industries, Inc. | Verfahren zur Laserbearbeitung mit einem thermisch stabilisierten akustooptischen Strahlablenker und thermisch stabilisiertes Hochgeschwindigkeits-Laserbearbeitungssystem |
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US8976343B2 (en) * | 2012-06-21 | 2015-03-10 | Kla-Tencor Corporation | Laser crystal degradation compensation |
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JP6453303B2 (ja) * | 2013-03-15 | 2019-01-16 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザビーム位置決めシステムのためのフェーズドアレイステアリング |
JP6362130B2 (ja) * | 2013-04-26 | 2018-07-25 | ビアメカニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
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TWI582559B (zh) * | 2015-01-29 | 2017-05-11 | 國立臺灣大學 | 整合數值控制機之加工軌跡配置系統、軌跡規劃裝置、軌跡規劃方法及其電腦程式產品 |
KR102387132B1 (ko) | 2015-02-27 | 2022-04-15 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 횡축 미세 기계 가공을 위한 고속 빔 조작 |
US20180207748A1 (en) * | 2017-01-23 | 2018-07-26 | Lumentum Operations Llc | Machining processes using a random trigger feature for an ultrashort pulse laser |
EP4296654A3 (de) * | 2017-03-03 | 2024-02-28 | Pacific Biosciences of California, Inc. | Hochgeschwindigkeitsabtastsystem mit beschleunigungsverfolgung |
CN116425409B (zh) * | 2023-04-14 | 2024-03-26 | 深圳市东赢激光设备有限公司 | 基于激光的大尺寸开孔方法、系统及介质 |
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-
2006
- 2006-09-15 US US11/532,160 patent/US8084706B2/en not_active Expired - Fee Related
-
2007
- 2007-06-29 EP EP07840316A patent/EP2043809B1/de not_active Not-in-force
- 2007-06-29 KR KR1020097003613A patent/KR20090045260A/ko not_active Application Discontinuation
- 2007-06-29 AT AT07840316T patent/ATE555868T1/de active
- 2007-06-29 WO PCT/US2007/072432 patent/WO2008011255A2/en active Application Filing
- 2007-06-29 JP JP2009520878A patent/JP2009544470A/ja active Pending
- 2007-07-03 TW TW096124093A patent/TW200807636A/zh unknown
-
2011
- 2011-11-23 US US13/303,327 patent/US20120083049A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20090045260A (ko) | 2009-05-07 |
EP2043809B1 (de) | 2012-05-02 |
WO2008011255A2 (en) | 2008-01-24 |
US20080029491A1 (en) | 2008-02-07 |
EP2043809A2 (de) | 2009-04-08 |
WO2008011255A3 (en) | 2008-02-28 |
TW200807636A (en) | 2008-02-01 |
US8084706B2 (en) | 2011-12-27 |
US20120083049A1 (en) | 2012-04-05 |
JP2009544470A (ja) | 2009-12-17 |
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