ATE550916T1 - Elektronisches teil - Google Patents

Elektronisches teil

Info

Publication number
ATE550916T1
ATE550916T1 AT09178582T AT09178582T ATE550916T1 AT E550916 T1 ATE550916 T1 AT E550916T1 AT 09178582 T AT09178582 T AT 09178582T AT 09178582 T AT09178582 T AT 09178582T AT E550916 T1 ATE550916 T1 AT E550916T1
Authority
AT
Austria
Prior art keywords
inner layer
layer section
outer layer
electronic part
section
Prior art date
Application number
AT09178582T
Other languages
English (en)
Inventor
Isao Kanada
Hisashi Kobuke
Yusuke Takahashi
Yasuharu Miyauchi
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Application granted granted Critical
Publication of ATE550916T1 publication Critical patent/ATE550916T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/24983—Hardness

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
AT09178582T 2008-12-16 2009-12-10 Elektronisches teil ATE550916T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008320033A JP5481854B2 (ja) 2008-12-16 2008-12-16 電子部品

Publications (1)

Publication Number Publication Date
ATE550916T1 true ATE550916T1 (de) 2012-04-15

Family

ID=41786294

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09178582T ATE550916T1 (de) 2008-12-16 2009-12-10 Elektronisches teil

Country Status (4)

Country Link
US (1) US20100151217A1 (de)
EP (1) EP2200409B1 (de)
JP (1) JP5481854B2 (de)
AT (1) ATE550916T1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5929322B2 (ja) * 2012-03-01 2016-06-01 Tdk株式会社 積層型コイル部品
JP5929321B2 (ja) * 2012-03-01 2016-06-01 Tdk株式会社 積層型コイル部品
KR101550591B1 (ko) * 2011-09-07 2015-09-07 티디케이가부시기가이샤 적층형 코일 부품
JP5929052B2 (ja) * 2011-09-07 2016-06-01 Tdk株式会社 積層型コイル部品
WO2013088957A1 (ja) * 2011-12-16 2013-06-20 Tdk株式会社 抵抗体内蔵多層ガラスセラミック基板
CN104797542A (zh) * 2012-11-07 2015-07-22 旭硝子株式会社 玻璃陶瓷基板和使用了该基板的便携式电子设备用框体
JP2014183128A (ja) * 2013-03-18 2014-09-29 Fujikura Ltd 積層構造体および半導体装置
DE102013103028A1 (de) * 2013-03-25 2014-09-25 Endress + Hauser Gmbh + Co. Kg Sinterkörper mit mehreren Werkstoffen und Druckmessgerät mit einem solchen Sinterkörper
JP2014209477A (ja) * 2013-03-28 2014-11-06 Toto株式会社 固体酸化物形燃料電池セル及びその製造方法
JP6214930B2 (ja) * 2013-05-31 2017-10-18 スナップトラック・インコーポレーテッド 多層配線基板
JP6493560B2 (ja) 2015-11-30 2019-04-03 株式会社村田製作所 多層セラミック基板及び電子部品
WO2017122381A1 (ja) * 2016-01-13 2017-07-20 株式会社村田製作所 積層体及び電子部品
CN109156083B (zh) * 2016-05-17 2021-04-02 株式会社村田制作所 多层陶瓷基板及电子装置
JP7406919B2 (ja) * 2019-03-11 2023-12-28 株式会社村田製作所 積層コイル部品
JP6927251B2 (ja) * 2019-07-08 2021-08-25 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629664A (ja) * 1992-07-10 1994-02-04 Nippon Cement Co Ltd 多層セラミックス配線基板
US5411563A (en) 1993-06-25 1995-05-02 Industrial Technology Research Institute Strengthening of multilayer ceramic/glass articles
US5728470A (en) * 1994-05-13 1998-03-17 Nec Corporation Multi-layer wiring substrate, and process for producing the same
DE10010461A1 (de) * 2000-03-03 2001-09-13 Infineon Technologies Ag Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik
DE10141910B4 (de) * 2000-08-28 2008-10-16 Kyocera Corp. Glaskeramiksinterprodukt und Verfahren zu seiner Herstellung
JP3905325B2 (ja) * 2001-04-23 2007-04-18 富士通株式会社 多層プリント配線板
JP4748435B2 (ja) * 2001-08-21 2011-08-17 日本電気硝子株式会社 積層ガラスセラミック材料及び積層ガラスセラミック焼結体
JP4181778B2 (ja) * 2002-02-05 2008-11-19 ソニー株式会社 配線基板の製造方法
JP4081299B2 (ja) * 2002-05-23 2008-04-23 京セラ株式会社 ガラスセラミック焼結体および配線基板
JP2004115290A (ja) * 2002-09-24 2004-04-15 Kyocera Corp 複合酸化物焼結体及びその製造方法並びに配線基板
KR101246978B1 (ko) 2005-04-28 2013-03-25 히타치 긴조쿠 가부시키가이샤 질화규소 기판, 그 제조방법, 그것을 사용한 질화규소배선기판 및 반도체 모듈
JP4977965B2 (ja) * 2005-05-02 2012-07-18 旭硝子株式会社 無アルカリガラスおよびその製造方法
DE102005023040A1 (de) * 2005-05-13 2006-11-16 Basell Polyolefine Gmbh Polyolefinische Formmasse mit verbesserter Beständigkeit gegen thermo-oxidativen Abbau und ihre Verwendung für das Herstellen von Rohren
JP4876493B2 (ja) 2005-09-07 2012-02-15 株式会社村田製作所 多層セラミック基板および電子部品
JP2007103836A (ja) * 2005-10-07 2007-04-19 Koa Corp 低温焼結セラミック多層基板およびその製造方法
JP4994052B2 (ja) 2006-03-28 2012-08-08 京セラ株式会社 基板およびこれを用いた回路基板
WO2007142112A1 (ja) * 2006-06-02 2007-12-13 Murata Manufacturing Co., Ltd. 多層セラミック基板およびその製造方法ならびに電子部品

Also Published As

Publication number Publication date
JP5481854B2 (ja) 2014-04-23
EP2200409B1 (de) 2012-03-21
EP2200409A1 (de) 2010-06-23
JP2010147101A (ja) 2010-07-01
US20100151217A1 (en) 2010-06-17

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