ATE545156T1 - Einzelelektrontransistoren und verfahren zur herstellung in welchen ein vorspringendes teil das raum zwischen die elektroden definiert - Google Patents
Einzelelektrontransistoren und verfahren zur herstellung in welchen ein vorspringendes teil das raum zwischen die elektroden definiertInfo
- Publication number
- ATE545156T1 ATE545156T1 AT02759144T AT02759144T ATE545156T1 AT E545156 T1 ATE545156 T1 AT E545156T1 AT 02759144 T AT02759144 T AT 02759144T AT 02759144 T AT02759144 T AT 02759144T AT E545156 T1 ATE545156 T1 AT E545156T1
- Authority
- AT
- Austria
- Prior art keywords
- electrodes
- projecting feature
- electrode
- production
- space
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 6
- 239000002105 nanoparticle Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N99/00—Subject matter not provided for in other groups of this subclass
- H10N99/05—Devices based on quantum mechanical effects, e.g. quantum interference devices or metal single-electron transistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/7613—Single electron transistors; Coulomb blockade devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/962—Quantum dots and lines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/936—Specified use of nanostructure for electronic or optoelectronic application in a transistor or 3-terminal device
- Y10S977/937—Single electron transistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
- Y10T428/2462—Composite web or sheet with partial filling of valleys on outer surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24628—Nonplanar uniform thickness material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24628—Nonplanar uniform thickness material
- Y10T428/24669—Aligned or parallel nonplanarities
- Y10T428/24678—Waffle-form
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/905,471 US6653653B2 (en) | 2001-07-13 | 2001-07-13 | Single-electron transistors and fabrication methods in which a projecting feature defines spacing between electrodes |
PCT/US2002/022260 WO2003007385A1 (en) | 2001-07-13 | 2002-07-12 | Single-electron transistors and fabrication methods in which a projecting feature defines spacing between electrodes |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE545156T1 true ATE545156T1 (de) | 2012-02-15 |
Family
ID=25420883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02759144T ATE545156T1 (de) | 2001-07-13 | 2002-07-12 | Einzelelektrontransistoren und verfahren zur herstellung in welchen ein vorspringendes teil das raum zwischen die elektroden definiert |
Country Status (6)
Country | Link |
---|---|
US (2) | US6653653B2 (de) |
EP (1) | EP1407493B1 (de) |
JP (1) | JP4343683B2 (de) |
AT (1) | ATE545156T1 (de) |
TW (1) | TW558740B (de) |
WO (1) | WO2003007385A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6479892B1 (en) * | 2000-10-31 | 2002-11-12 | Motorola, Inc. | Enhanced probe for gathering data from semiconductor devices |
US7115986B2 (en) * | 2001-05-02 | 2006-10-03 | Micron Technology, Inc. | Flexible ball grid array chip scale packages |
US6653653B2 (en) * | 2001-07-13 | 2003-11-25 | Quantum Logic Devices, Inc. | Single-electron transistors and fabrication methods in which a projecting feature defines spacing between electrodes |
JP3857141B2 (ja) * | 2002-01-07 | 2006-12-13 | 富士通株式会社 | 光半導体装置及びその製造方法 |
SG104293A1 (en) | 2002-01-09 | 2004-06-21 | Micron Technology Inc | Elimination of rdl using tape base flip chip on flex for die stacking |
SG115459A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Flip chip packaging using recessed interposer terminals |
SG121707A1 (en) * | 2002-03-04 | 2006-05-26 | Micron Technology Inc | Method and apparatus for flip-chip packaging providing testing capability |
US6975035B2 (en) * | 2002-03-04 | 2005-12-13 | Micron Technology, Inc. | Method and apparatus for dielectric filling of flip chip on interposer assembly |
SG115455A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Methods for assembly and packaging of flip chip configured dice with interposer |
SG111935A1 (en) * | 2002-03-04 | 2005-06-29 | Micron Technology Inc | Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods |
SG115456A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Semiconductor die packages with recessed interconnecting structures and methods for assembling the same |
US7022287B2 (en) * | 2002-05-08 | 2006-04-04 | Sandia National Laboratories | Single particle electrochemical sensors and methods of utilization |
US20040036170A1 (en) * | 2002-08-20 | 2004-02-26 | Lee Teck Kheng | Double bumping of flexible substrate for first and second level interconnects |
US7208784B2 (en) * | 2003-10-07 | 2007-04-24 | Quantum Logic Devices, Inc. | Single-electron transistor for detecting biomolecules |
WO2005081707A2 (en) | 2003-11-20 | 2005-09-09 | Biowarn, Llc | Methodology and apparatus for the detection of biological substances |
KR100708644B1 (ko) * | 2004-02-26 | 2007-04-17 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 이를 구비한 평판 표시장치, 박막트랜지스터의 제조방법, 평판 표시장치의 제조방법, 및도너 시트의 제조방법 |
WO2005087654A1 (ja) | 2004-03-12 | 2005-09-22 | Japan Science And Technology Agency | 量子ドット操作方法および量子ドット生成操作装置 |
US6946693B1 (en) * | 2004-04-27 | 2005-09-20 | Wisconsin Alumni Research Foundation | Electromechanical electron transfer devices |
JP4112597B2 (ja) * | 2004-09-30 | 2008-07-02 | 独立行政法人科学技術振興機構 | 自己組織化材料のパターニング方法、及び自己組織化材料パターニング基板とその生産方法、並びに自己組織化材料パターニング基板を用いたフォトマスク |
JP4613314B2 (ja) * | 2005-05-26 | 2011-01-19 | 独立行政法人産業技術総合研究所 | 単結晶の製造方法 |
KR100723410B1 (ko) * | 2005-08-17 | 2007-05-30 | 삼성전자주식회사 | 자기정렬된 메탈쉴드를 구비한 저항성 탐침의 제조방법 |
KR100777973B1 (ko) * | 2006-07-13 | 2007-11-29 | 한국표준과학연구원 | 다중선형전극 센서 유닛으로 이루어진 바이오센서 |
AU2009214818B2 (en) * | 2008-02-11 | 2014-05-01 | Newsouth Innovations Pty Limited | Control and readout of electron or hole spin |
US8378895B2 (en) * | 2010-04-08 | 2013-02-19 | Wisconsin Alumni Research Foundation | Coupled electron shuttle providing electrical rectification |
PT108561B (pt) * | 2015-06-16 | 2017-07-20 | Sapec Agro S A | Mistura herbicida |
PT109118B (pt) * | 2016-01-26 | 2018-02-27 | Sapec Agro S A | Mistura herbicida compreendendo iodossulfurão-metilo ou os seus sais e flazassulfurão |
US10032897B2 (en) | 2016-06-01 | 2018-07-24 | International Business Machines Corporation | Single electron transistor with self-aligned Coulomb blockade |
CN112444540B (zh) * | 2019-09-04 | 2023-05-05 | 张家港万众一芯生物科技有限公司 | 一种生物传感器和生物传感器的制备方法 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8406955D0 (en) | 1984-03-16 | 1984-04-18 | Serono Diagnostics Ltd | Assay |
DE3513168A1 (de) | 1985-04-12 | 1986-10-16 | Thomas 8000 München Dandekar | Biosensor bestehend aus einem halbleiter auf silizium oder kohlenstoffbasis (elektronischer teil) und nukleinbasen (od. anderen biol. monomeren) |
US4894339A (en) | 1985-12-18 | 1990-01-16 | Seitaikinouriyou Kagakuhin Sinseizogijutsu Kenkyu Kumiai | Immobilized enzyme membrane for a semiconductor sensor |
JPS6350745A (ja) | 1986-08-20 | 1988-03-03 | Fuji Photo Film Co Ltd | 化学センサ− |
DE3827314C1 (de) | 1988-08-11 | 1989-10-19 | Christoff Prof. Dr. Braeuchle | |
US5219577A (en) | 1990-06-22 | 1993-06-15 | The Regents Of The University Of California | Biologically active composition having a nanocrystalline core |
GB2278235B (en) | 1991-10-21 | 1996-05-08 | Holm Kennedy James W | Method and device for biochemical sensing |
US5234848A (en) * | 1991-11-05 | 1993-08-10 | Texas Instruments Incorporated | Method for fabricating lateral resonant tunneling transistor with heterojunction barriers |
US5846708A (en) | 1991-11-19 | 1998-12-08 | Massachusetts Institiute Of Technology | Optical and electrical methods and apparatus for molecule detection |
US5405454A (en) | 1992-03-19 | 1995-04-11 | Matsushita Electric Industrial Co., Ltd. | Electrically insulated silicon structure and producing method therefor |
US5420746A (en) | 1993-04-13 | 1995-05-30 | The United States Of America As Represented By The Secretary Of The Army | Single electron device including clusters of pure carbon atoms |
GB2288274A (en) * | 1994-03-31 | 1995-10-11 | Sharp Kk | Quantum device and method of making such a device |
EP0756761B1 (de) | 1994-04-19 | 1998-06-24 | Siemens Aktiengesellschaft | Mikroelektronisches bauelement und verfahren zu dessen herstellung |
JP3149718B2 (ja) | 1995-02-03 | 2001-03-26 | 松下電器産業株式会社 | 単電子トランジスタ |
US5576563A (en) | 1995-04-24 | 1996-11-19 | Motorola Inc. | Chemical probe field effect transistor for measuring the surface potential of a gate electrode in response to chemical exposure |
DE19522351A1 (de) | 1995-06-20 | 1997-01-09 | Max Planck Gesellschaft | Verfahren zur Herstellung von Quantenstrukturen, insbesondere von Quantenpunkten und Tunnelbarrieren sowie Bauelemente mit solchen Quantenstrukturen |
CN1097857C (zh) | 1996-03-26 | 2003-01-01 | 三星电子株式会社 | 隧道效应器件及其制造方法 |
DE19621994C1 (de) | 1996-05-31 | 1997-06-12 | Siemens Ag | Einzelelektron-Speicherzellenanordnung |
US6066265A (en) | 1996-06-19 | 2000-05-23 | Kionix, Inc. | Micromachined silicon probe for scanning probe microscopy |
JP3320641B2 (ja) * | 1996-09-13 | 2002-09-03 | 株式会社東芝 | メモリセル |
US5747839A (en) | 1996-09-30 | 1998-05-05 | Motorola, Inc. | Chemical sensing trench field effect transistor |
US5922537A (en) | 1996-11-08 | 1999-07-13 | N.o slashed.AB Immunoassay, Inc. | Nanoparticles biosensor |
US6103868A (en) | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
EP0865078A1 (de) | 1997-03-13 | 1998-09-16 | Hitachi Europe Limited | Verfahren zum Ablegen von nanometrischen Partikeln |
US5900729A (en) | 1997-03-20 | 1999-05-04 | International Business Machines Corporation | Magnetic force microscopy probe with integrated coil |
US5900728A (en) | 1997-03-20 | 1999-05-04 | International Business Machines Corporation | Alternating current magnetic force microscopy system with probe having integrated coil |
US6159620A (en) | 1997-03-31 | 2000-12-12 | The Regents Of The University Of California | Single-electron solid state electronic device |
DE69825939T2 (de) | 1997-05-30 | 2005-09-15 | Matsushita Electric Industrial Co., Ltd., Kadoma | Anordnung mit Quanten-Schachteln |
JP3452764B2 (ja) | 1997-06-11 | 2003-09-29 | 科学技術振興事業団 | 超微細突起構造体の製造方法 |
US5892252A (en) | 1998-02-05 | 1999-04-06 | Motorola, Inc. | Chemical sensing trench field effect transistor and method for same |
EP1073902A2 (de) | 1998-04-20 | 2001-02-07 | University Of North Carolina At Chapel Hill | Naonometerpartikel mit reaktiver schicht |
US6211530B1 (en) | 1998-06-12 | 2001-04-03 | Motorola, Inc. | Sparse-carrier devices and method of fabrication |
WO2001013432A1 (en) | 1999-08-18 | 2001-02-22 | North Carolina State University | Sensing devices using chemically-gated single electron transistors |
US6653653B2 (en) * | 2001-07-13 | 2003-11-25 | Quantum Logic Devices, Inc. | Single-electron transistors and fabrication methods in which a projecting feature defines spacing between electrodes |
US6483125B1 (en) * | 2001-07-13 | 2002-11-19 | North Carolina State University | Single electron transistors in which the thickness of an insulating layer defines spacing between electrodes |
-
2001
- 2001-07-13 US US09/905,471 patent/US6653653B2/en not_active Expired - Fee Related
-
2002
- 2002-07-02 TW TW091114626A patent/TW558740B/zh not_active IP Right Cessation
- 2002-07-12 JP JP2003513047A patent/JP4343683B2/ja not_active Expired - Fee Related
- 2002-07-12 EP EP02759144A patent/EP1407493B1/de not_active Expired - Lifetime
- 2002-07-12 WO PCT/US2002/022260 patent/WO2003007385A1/en active Application Filing
- 2002-07-12 AT AT02759144T patent/ATE545156T1/de active
-
2003
- 2003-10-07 US US10/680,871 patent/US20040113144A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1407493B1 (de) | 2012-02-08 |
EP1407493A1 (de) | 2004-04-14 |
JP4343683B2 (ja) | 2009-10-14 |
JP2004535677A (ja) | 2004-11-25 |
US20030012930A1 (en) | 2003-01-16 |
US20040113144A1 (en) | 2004-06-17 |
US6653653B2 (en) | 2003-11-25 |
WO2003007385A1 (en) | 2003-01-23 |
TW558740B (en) | 2003-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE545156T1 (de) | Einzelelektrontransistoren und verfahren zur herstellung in welchen ein vorspringendes teil das raum zwischen die elektroden definiert | |
EP2400533A3 (de) | Diamant Feldeffekttransistor und Verfahren zur Herstellung | |
ATE468611T1 (de) | Einzelelektrontransistoren und verfahren zur herstellung | |
DE602004020538D1 (de) | Verfahren und Vorrichtung zur Laserbestrahlung, sowie Verfahren zur Herstellung von Halbleiter. | |
DE60221530D1 (de) | Verfahren und vorrichtung zum unterdrücken von tönen, die durch dem-algorithmen (cyclic dynamic element matching) verursacht werden | |
TW200520112A (en) | Method for production of a film | |
EP1326282A3 (de) | Dünnschichttransistor mit mehreren Gates | |
EP1850404A3 (de) | Feldeffekttransistor und Verfahren zu seiner Herstellung | |
ATE380391T1 (de) | Herstellungsverfahren für soi- halbleiterbauelemente | |
DE60311408D1 (de) | Elektrooptische Vorrichtung, Herstellungsverfahren derselben und elektronisches Gerät | |
EP1513198A4 (de) | Halbleitersubstratherstellungsverfahren und halbleiterbauelementeherstellungsverfahren und durch die verfahren hergestelltes halbleitersubstrat und halbleiterbauelement | |
DE60141211D1 (de) | Polysilizium-halbleiterbauteil und verfahren zu dessen herstellung | |
DE60324213D1 (de) | Vorrichtung und Methode zur Produktion von elektrisch deionisiertem Wasser | |
ATE486277T1 (de) | Feldeffektransistor mit funktionalisierter kohlenstoffnanoröhre und dessen herstellungsfervahren | |
TWI263465B (en) | Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate | |
DE68904672D1 (de) | Halbleiteranordnung, deren struktur die wirkung des parasitischen transistors erschwert und verfahren zur herstellung. | |
TWI329360B (en) | Semiconductor device production method and semiconductor device | |
DE602004003476D1 (de) | Kondensator, halbleiterbauelement mit einem kondensator und verfahren zur herstellung derselben | |
ATE520780T1 (de) | Pflanzen mit veränderten wachstumseigenschaften und verfahren zur deren herstellung | |
TW200618121A (en) | Method of forming a semiconductor device and structure thereof | |
DE60223746D1 (de) | Elektrooptische Vorrichtung, Verfahren zu deren Herstellung und elektronisches Gerät | |
EP1455330A4 (de) | Herstellungsverfahren für elektrooptische einrichtungen, durch das herstellungsverfahren hergestellte elektrooptische einrichtung | |
DE50203384D1 (de) | System zur fertigung von elektrischen und integrierten schaltkreisen | |
EP1437765A4 (de) | Herstellungsverfahren für ein halbleitersubstrat und herstellungsverfahren für einen feldeffekttransistor und halbleitersubstrat und feldeffekttransistor | |
ATE517431T1 (de) | Verfahren zur herstellung eineshalbleiterbauelements mit mos-transistoren mit gate-elektroden, die in einempaket von aufeinander abgelagerten metallschichten ausgebildet sind |