ATE543850T1 - WHITE HOME CURTABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, PROCESS OF MANUFACTURING, PREFORMED HOUSING AND LED DEVICE - Google Patents

WHITE HOME CURTABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, PROCESS OF MANUFACTURING, PREFORMED HOUSING AND LED DEVICE

Info

Publication number
ATE543850T1
ATE543850T1 AT10008895T AT10008895T ATE543850T1 AT E543850 T1 ATE543850 T1 AT E543850T1 AT 10008895 T AT10008895 T AT 10008895T AT 10008895 T AT10008895 T AT 10008895T AT E543850 T1 ATE543850 T1 AT E543850T1
Authority
AT
Austria
Prior art keywords
resin composition
curtable
silicone
hybrid resin
manufacturing
Prior art date
Application number
AT10008895T
Other languages
German (de)
Inventor
Junichi Sawada
Yusuke Taguchi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Application granted granted Critical
Publication of ATE543850T1 publication Critical patent/ATE543850T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34926—Triazines also containing heterocyclic groups other than triazine groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/06—Triglycidylisocyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Abstract

A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR 1 ) (OR 2 ) 2 wherein R 1 and R 2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.
AT10008895T 2009-09-01 2010-08-26 WHITE HOME CURTABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, PROCESS OF MANUFACTURING, PREFORMED HOUSING AND LED DEVICE ATE543850T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009201559 2009-09-01

Publications (1)

Publication Number Publication Date
ATE543850T1 true ATE543850T1 (en) 2012-02-15

Family

ID=42990158

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10008895T ATE543850T1 (en) 2009-09-01 2010-08-26 WHITE HOME CURTABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, PROCESS OF MANUFACTURING, PREFORMED HOUSING AND LED DEVICE

Country Status (7)

Country Link
US (1) US8044128B2 (en)
EP (1) EP2289998B1 (en)
JP (1) JP5488326B2 (en)
KR (1) KR101725996B1 (en)
CN (1) CN102002237B (en)
AT (1) ATE543850T1 (en)
TW (1) TWI470022B (en)

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JP2011074355A (en) * 2009-09-07 2011-04-14 Nitto Denko Corp Resin composition for optical semiconductor device, optical semiconductor device lead frame obtained using the same, and optical semiconductor device
JP2011202154A (en) * 2010-03-01 2011-10-13 Yokohama Rubber Co Ltd:The Heat-curable optical semiconductor-encapsulating silicone resin composition and optical semiconductor-encapsulated product using the same
JP5647071B2 (en) * 2011-05-24 2014-12-24 日東電工株式会社 Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
FR2976946B1 (en) * 2011-06-24 2014-01-24 Arkema France COMPOSITION COMPRISING A SEMI-AROMATIC POLYAMIDE AND USES THEREOF, IN PARTICULAR FOR AN ELECTROLUMINESCENT DIODE REFLECTOR
JP5764423B2 (en) * 2011-08-02 2015-08-19 日東電工株式会社 Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device or substrate for optical semiconductor device obtained by using the same, and optical semiconductor device
JP5545601B2 (en) * 2011-11-07 2014-07-09 信越化学工業株式会社 Phosphor highly-filled wavelength conversion sheet, method for manufacturing light-emitting semiconductor device using the same, and light-emitting semiconductor device
JP5650097B2 (en) * 2011-11-09 2015-01-07 信越化学工業株式会社 Thermosetting epoxy resin composition and optical semiconductor device
KR101591134B1 (en) * 2011-11-25 2016-02-02 주식회사 엘지화학 Curable composition
TW201326245A (en) * 2011-12-26 2013-07-01 kai-xiong Cai Packaged LED with high transmittance
JP5917137B2 (en) * 2011-12-27 2016-05-11 株式会社カネカ Resin molded body for surface mount type light emitting device and light emitting device using the same
CN103208575B (en) * 2012-01-13 2017-02-08 蔡凯雄 High-transmittance packaged LED (light emitting diode)
JP5940325B2 (en) * 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 Thermally conductive silicone composition
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JP5756054B2 (en) * 2012-04-16 2015-07-29 信越化学工業株式会社 Thermosetting resin composition for LED reflector, LED reflector and optical semiconductor device using the same
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KR101905834B1 (en) * 2012-05-31 2018-10-08 엘지이노텍 주식회사 Epoxy resin composition and light emitting apparatus
JP2014135473A (en) * 2012-12-11 2014-07-24 Renesas Electronics Corp Optical coupling element
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JP5996085B2 (en) * 2013-02-27 2016-09-21 株式会社朝日ラバー White reflective film ink, white reflective film powder coating, and white reflective film manufacturing method
JP5976806B2 (en) * 2013-05-28 2016-08-24 日東電工株式会社 Epoxy resin composition for optical semiconductor device and lead frame for optical semiconductor device, encapsulated optical semiconductor element and optical semiconductor device obtained using the same
JP6048367B2 (en) * 2013-10-21 2016-12-21 信越化学工業株式会社 White thermosetting epoxy / silicone hybrid resin composition for LED reflector, and pre-mold package comprising a molded cured product of the resin composition
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CN105778506B (en) * 2014-12-25 2019-04-30 广东生益科技股份有限公司 A kind of organosilicon resin composition and prepreg, laminate, copper-clad plate and aluminum substrate using it
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JP6517043B2 (en) * 2015-02-25 2019-05-22 ルネサスエレクトロニクス株式会社 Optical coupling device, method of manufacturing optical coupling device, and power conversion system
JP6439616B2 (en) * 2015-07-14 2018-12-19 信越化学工業株式会社 Thermosetting epoxy resin composition for optical semiconductor element sealing and optical semiconductor device using the same
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Also Published As

Publication number Publication date
EP2289998A1 (en) 2011-03-02
JP2011074359A (en) 2011-04-14
CN102002237A (en) 2011-04-06
TWI470022B (en) 2015-01-21
JP5488326B2 (en) 2014-05-14
CN102002237B (en) 2013-01-02
US20110054072A1 (en) 2011-03-03
KR20110025112A (en) 2011-03-09
EP2289998B1 (en) 2012-02-01
TW201124464A (en) 2011-07-16
US8044128B2 (en) 2011-10-25
KR101725996B1 (en) 2017-04-11

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