ATE540562T1 - Verfahren und gerät zum zusammenbau einer pastille auf einem substrat durch zufuhr von lötmaterial - Google Patents

Verfahren und gerät zum zusammenbau einer pastille auf einem substrat durch zufuhr von lötmaterial

Info

Publication number
ATE540562T1
ATE540562T1 AT09172640T AT09172640T ATE540562T1 AT E540562 T1 ATE540562 T1 AT E540562T1 AT 09172640 T AT09172640 T AT 09172640T AT 09172640 T AT09172640 T AT 09172640T AT E540562 T1 ATE540562 T1 AT E540562T1
Authority
AT
Austria
Prior art keywords
substrate
component
mass
assembling
heating
Prior art date
Application number
AT09172640T
Other languages
English (en)
Inventor
Laurent Vivet
Jean-Michel Morelle
Sandra Dimelli
Laurent Deneu-Fontaine
Romaric Lenoir
Original Assignee
Valeo Etudes Electroniques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Etudes Electroniques filed Critical Valeo Etudes Electroniques
Application granted granted Critical
Publication of ATE540562T1 publication Critical patent/ATE540562T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H10W72/0711—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adornments (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT09172640T 2008-10-10 2009-10-09 Verfahren und gerät zum zusammenbau einer pastille auf einem substrat durch zufuhr von lötmaterial ATE540562T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0856876A FR2937216B1 (fr) 2008-10-10 2008-10-10 Procede et dispositif d'assemblage d'une pastille sur un substrat par apport d'une masse formant brasure.

Publications (1)

Publication Number Publication Date
ATE540562T1 true ATE540562T1 (de) 2012-01-15

Family

ID=40384759

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09172640T ATE540562T1 (de) 2008-10-10 2009-10-09 Verfahren und gerät zum zusammenbau einer pastille auf einem substrat durch zufuhr von lötmaterial

Country Status (5)

Country Link
US (2) US9167703B2 (de)
EP (1) EP2175705B1 (de)
AT (1) ATE540562T1 (de)
FR (1) FR2937216B1 (de)
PL (1) PL2175705T3 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9475151B1 (en) * 2012-10-30 2016-10-25 Western Digital (Fremont), Llc Method and apparatus for attaching a laser diode and a slider in an energy assisted magnetic recording head

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1262148A (en) * 1968-03-13 1972-02-02 Zeva Elek Zitats Ges Smits Und Soldering apparatus
US3934073A (en) * 1973-09-05 1976-01-20 F Ardezzone Miniature circuit connection and packaging techniques
DE19751352A1 (de) * 1997-11-20 1999-05-27 Leica Geosystems Ag Verfahren zur Lötbefestigung miniaturisierter Bauteile für eine Grundplatte
JP3147845B2 (ja) * 1998-02-13 2001-03-19 日本電気株式会社 チップ部品接合装置および方法
DE10042661B4 (de) * 1999-09-10 2006-04-13 Esec Trading S.A. Verfahren und Vorrichtungen für die Montage von Halbleiterchips
CA2587245C (en) * 2004-11-12 2013-12-31 Rvsi Inspection Llc Laser triangulation method for measurement of highly reflective solder balls
US20090289098A1 (en) * 2005-12-06 2009-11-26 Katsumi Terada Chip Mounting Apparatus and Chip Mounting Method
FR2905883B1 (fr) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre

Also Published As

Publication number Publication date
US20100139089A1 (en) 2010-06-10
US20140304984A1 (en) 2014-10-16
FR2937216A1 (fr) 2010-04-16
US9706665B2 (en) 2017-07-11
PL2175705T3 (pl) 2012-05-31
US9167703B2 (en) 2015-10-20
FR2937216B1 (fr) 2010-12-31
EP2175705A1 (de) 2010-04-14
EP2175705B1 (de) 2012-01-04

Similar Documents

Publication Publication Date Title
CN103406629A (zh) 全自动立式电感器件焊锡机
TW202304626A (zh) 雷射處理設備、雷射處理工件的方法及相關配置
JP2008087053A (ja) レーザ加工方法
US20080217301A1 (en) Laser beam processing machine
JP5516304B2 (ja) 落下試験機
WO2009108752A3 (en) Laser-induced structuring of substrate surfaces
WO2009063906A1 (ja) 貼合せ基板製造装置および貼合せ基板製造方法
US20220369473A1 (en) Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole
CN107363413A (zh) 蓝宝石晶片的加工方法和激光加工装置
EP2009971A4 (de) Lotschicht, substrat für einen anordnungsübergang damit und prozess zum herstellen des substrats
EP3490750A1 (de) Laserbearbeitungsvorrichtung und verfahren zum laserbearbeiten von werkstücken
ATE540562T1 (de) Verfahren und gerät zum zusammenbau einer pastille auf einem substrat durch zufuhr von lötmaterial
CN101448372B (zh) 一种防止smt器件引腿桥连的搪锡工艺
Dupont et al. 355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration
JP2015229167A (ja) レーザ加工方法
ATE445540T1 (de) Verfahren und vorrichtung zur bildung eines ballens mit weitgehend flacher ober- und unterseite
WO2008025479A3 (de) Vorhangbeschichtungsverfahren sowie eine dafür verwendete vorrichtung
Wang et al. Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance
US20210331273A1 (en) Laser processing apparatus and methods of laser-processing workpieces
KR101508039B1 (ko) 솔더볼 공급장치
JP2012114382A (ja) ボンディング装置
CN115255705B (zh) 一种可焊性测试机构及方法
JP2011511702A (ja) ウェーハスタック洗浄
TWI486227B (zh) 加錫設備與加錫方法
JP6182873B2 (ja) アンダーフィル樹脂の接触角の測定方法