ATE537693T1 - Vorrichtung und verfahren zum kühlen von geformten elektronischen schaltungen - Google Patents

Vorrichtung und verfahren zum kühlen von geformten elektronischen schaltungen

Info

Publication number
ATE537693T1
ATE537693T1 AT05796383T AT05796383T ATE537693T1 AT E537693 T1 ATE537693 T1 AT E537693T1 AT 05796383 T AT05796383 T AT 05796383T AT 05796383 T AT05796383 T AT 05796383T AT E537693 T1 ATE537693 T1 AT E537693T1
Authority
AT
Austria
Prior art keywords
power supply
electronic circuits
supply circuit
supply leads
external power
Prior art date
Application number
AT05796383T
Other languages
English (en)
Inventor
Sharifipour Bahman
Arian Jansen
Original Assignee
Flextronics Ap Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flextronics Ap Llc filed Critical Flextronics Ap Llc
Application granted granted Critical
Publication of ATE537693T1 publication Critical patent/ATE537693T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/28—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Rectifiers (AREA)
  • Dc-Dc Converters (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
AT05796383T 2004-09-07 2005-09-07 Vorrichtung und verfahren zum kühlen von geformten elektronischen schaltungen ATE537693T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60950704P 2004-09-07 2004-09-07
US11/220,811 US7885076B2 (en) 2004-09-07 2005-09-06 Apparatus for and method of cooling molded electronic circuits
PCT/US2005/032171 WO2006029324A2 (en) 2004-09-07 2005-09-07 An apparatus for and method of cooling molded electronic curcuits

Publications (1)

Publication Number Publication Date
ATE537693T1 true ATE537693T1 (de) 2011-12-15

Family

ID=36037022

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05796383T ATE537693T1 (de) 2004-09-07 2005-09-07 Vorrichtung und verfahren zum kühlen von geformten elektronischen schaltungen

Country Status (5)

Country Link
US (3) US7885076B2 (de)
EP (1) EP1797387B1 (de)
CN (1) CN101107895B (de)
AT (1) ATE537693T1 (de)
WO (1) WO2006029324A2 (de)

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US9398723B2 (en) * 2013-08-29 2016-07-19 Eaton Corporation Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
US9642289B2 (en) * 2013-09-19 2017-05-02 Infineon Technologies Austria Ag Power supply and method
US20160006178A1 (en) * 2014-07-01 2016-01-07 Michael S. Gzybowski Polarized electrical plug with orientation verification
US9414527B2 (en) 2014-11-06 2016-08-09 International Business Machines Corporation Thermal spreading for an externally pluggable electronic module
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US10284106B1 (en) 2015-06-05 2019-05-07 Vlt, Inc. Power adapter
DE102015016267A1 (de) * 2015-12-15 2016-07-21 Daimler Ag Vorrichtung zum Kühlen eines elektrisch leitfähigen Kontaktelements
US10667433B2 (en) * 2018-06-04 2020-05-26 International Business Machines Corporation Implementing contained thermal interface material for pluggable applications
DE102020102219A1 (de) 2020-01-30 2021-08-05 Audi Aktiengesellschaft Ladestecker für ein Ladekabel zum Anschließen an ein Kraftfahrzeug sowie Kraftfahrzeug und Ladesystem
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Also Published As

Publication number Publication date
WO2006029324A3 (en) 2007-08-02
CN101107895B (zh) 2016-01-13
EP1797387A4 (de) 2010-11-03
EP1797387B1 (de) 2011-12-14
CN101107895A (zh) 2008-01-16
WO2006029324A2 (en) 2006-03-16
US20110103119A1 (en) 2011-05-05
US7885076B2 (en) 2011-02-08
US20060076124A1 (en) 2006-04-13
US9204575B2 (en) 2015-12-01
US20130016476A1 (en) 2013-01-17
US8295048B2 (en) 2012-10-23
EP1797387A2 (de) 2007-06-20

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