WO2008115608A3 - Method and apparatus for cooling integrated circuit chips using recycled power - Google Patents

Method and apparatus for cooling integrated circuit chips using recycled power Download PDF

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Publication number
WO2008115608A3
WO2008115608A3 PCT/US2008/051331 US2008051331W WO2008115608A3 WO 2008115608 A3 WO2008115608 A3 WO 2008115608A3 US 2008051331 W US2008051331 W US 2008051331W WO 2008115608 A3 WO2008115608 A3 WO 2008115608A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
circuit chips
cooling integrated
recycled power
computer system
Prior art date
Application number
PCT/US2008/051331
Other languages
French (fr)
Other versions
WO2008115608A2 (en
Inventor
Chien Ouyang
Kenny C Gross
Original Assignee
Sun Microsystems Inc
Chien Ouyang
Kenny C Gross
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc, Chien Ouyang, Kenny C Gross filed Critical Sun Microsystems Inc
Publication of WO2008115608A2 publication Critical patent/WO2008115608A2/en
Publication of WO2008115608A3 publication Critical patent/WO2008115608A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Abstract

One embodiment of the present invention provides a system that cools integrated circuit (IC) chips within a computer system. During operation, the system converts heat generated by a heat-generating-device within the computer system into thermoelectric power. The system then supplies the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.
PCT/US2008/051331 2007-03-21 2008-01-17 Method and apparatus for cooling integrated circuit chips using recycled power WO2008115608A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/726,429 2007-03-21
US11/726,429 US20080229759A1 (en) 2007-03-21 2007-03-21 Method and apparatus for cooling integrated circuit chips using recycled power

Publications (2)

Publication Number Publication Date
WO2008115608A2 WO2008115608A2 (en) 2008-09-25
WO2008115608A3 true WO2008115608A3 (en) 2008-11-13

Family

ID=39333121

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/051331 WO2008115608A2 (en) 2007-03-21 2008-01-17 Method and apparatus for cooling integrated circuit chips using recycled power

Country Status (2)

Country Link
US (1) US20080229759A1 (en)
WO (1) WO2008115608A2 (en)

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TW200907649A (en) * 2007-08-03 2009-02-16 Asustek Comp Inc Heat-dissipating module
US20090109620A1 (en) * 2007-10-31 2009-04-30 Wang Cheng-Tu Heat-dissipating device of portable electronic apparatus
US20120047912A1 (en) * 2008-12-11 2012-03-01 Lamos Inc. Split thermo-electric cycles for simultaneous cooling, heating, and temperature control
EP2370754A2 (en) * 2008-12-11 2011-10-05 Lamos Inc. Thermo-electric structures for cooling, heating, and electric current generation
SE534185C2 (en) * 2009-02-11 2011-05-24 Bae Systems Haegglunds Ab Device for thermally adjusting the temperature distribution of a surface
US20120038175A1 (en) * 2009-04-15 2012-02-16 Tang William S Generating and using electricity derived from waste heat of an electrical appliance
FR2978871B1 (en) * 2011-08-02 2013-07-19 Commissariat Energie Atomique COOLING DEVICE PROVIDED WITH A THERMOELECTRIC SENSOR
US10217692B2 (en) 2012-07-18 2019-02-26 University Of Virginia Patent Foundation Heat transfer device for high heat flux applications and related methods thereof
CA2879504A1 (en) 2012-07-18 2014-01-23 University Of Virginia Patent Foundation Heat transfer device for high heat flux applications and related methods thereof
CN103887339B (en) * 2012-12-19 2019-02-05 中兴通讯股份有限公司 A kind of transistor, the radiator structure of transistor and the production method of transistor
US10162394B2 (en) * 2014-09-10 2018-12-25 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for sustainable self-cooling of central processing unit thermal hot spots using thermoelectric materials
US9831776B1 (en) * 2016-06-16 2017-11-28 Google Inc. DC-DC converter
US11249522B2 (en) * 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
US10231364B2 (en) 2016-10-24 2019-03-12 Toyota Motor Engineering & Manufacturing North America, Inc. Fluidly cooled power electronics assemblies having a thermo-electric generator
US10556481B2 (en) * 2017-06-26 2020-02-11 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods for providing heating and cooling to a vehicle cabin of autonomous vehicles
US10636725B2 (en) 2017-12-19 2020-04-28 Veoneer Us Inc. Electrical module cooling through waste heat recovery
WO2020123557A1 (en) 2018-12-12 2020-06-18 Edwards George Anthony Computer component cooling device and method
US11798865B2 (en) * 2019-03-04 2023-10-24 Intel Corporation Nested architectures for enhanced heterogeneous integration
CN110571205B (en) * 2019-09-12 2021-12-07 芯盟科技有限公司 Semiconductor structure and forming method thereof
CN110571206B (en) * 2019-09-12 2022-05-27 芯盟科技有限公司 Semiconductor structure and forming method thereof and forming method of chip
TW202301073A (en) * 2021-06-29 2023-01-01 十銓科技股份有限公司 Storage device with active heat dissipation
CN113543475B (en) * 2021-07-01 2022-10-25 苏州通富超威半导体有限公司 Packaging structure, electronic equipment and heat dissipation method
CN113631023A (en) * 2021-09-10 2021-11-09 英业达科技有限公司 Electronic device and heat dissipation assembly

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US20060107987A1 (en) * 2004-11-19 2006-05-25 Hon Hai Precision Industry Co., Ltd. Computer with heat-recycling function
US20060181855A1 (en) * 2005-02-14 2006-08-17 Asia Vital Component Co., Ltd. Heat generation assembly with cooling structure

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US20060107987A1 (en) * 2004-11-19 2006-05-25 Hon Hai Precision Industry Co., Ltd. Computer with heat-recycling function
US20060181855A1 (en) * 2005-02-14 2006-08-17 Asia Vital Component Co., Ltd. Heat generation assembly with cooling structure

Also Published As

Publication number Publication date
WO2008115608A2 (en) 2008-09-25
US20080229759A1 (en) 2008-09-25

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